Parker Chomerics CHO-FORM® 5518 Robotically Dispensed Gasketing

Category	Polymer , Thermoset , Silicone
Manufacturer	Parker Chomerics
Trade Name	CHO-FORM®
Port	Ningbo port,China
Trade Terms	FOB, CFR, CIF
Payment Terms	L/C, T/T, Western Union
Download PDF	Parker Chomerics CHO-FORM® 5518 Robotically Dispensed Gasketing.pdf
Price	EMAIL US sales@lookpolymers.com
	Online Service lookpolymers 27660005

Material Notes:

Description: CHO-FORM® 5518 Two-component, thermal cure silicone system with Ag/Cu particle filler. Minimum cure temperature is only 85°C (185°F). Formulated for painted, plated or metalized plastic housings that will not withstand higher temperature bake. Also provides excellent adhesion to metallic housings.Information provided by Chomerics

Physical Properties	Metric	English	Comments
Specific Gravity	3.30 g/cc	3.30 g/cc	ASTM D792

Mechanical Properties	Metric	English	Comments
Hardness, Shore A	55 - 60	55 - 60	ASTM D2240
Tensile Strength	>= 2.41 MPa	>= 350 psi	ASTM D412
Elongation at Break	>= 225 %	>= 225 %	ASTM D412
Compression Set	<= 35 % @Temperature 85.0 °C, Time 79200 sec	<= 35 % @Temperature 185 °F, Time 22.0 hour	ASTM D395 Method B

Thermal Properties	Metric	English	Comments
Maximum Service Temperature, Air	85.0 °C	185 °F

Electrical Properties	Metric	English	Comments
Volume Resistivity	<= 0.010 ohm-cm	<= 0.010 ohm-cm	Initial; MIL-G-83528 Para. 4.6.11
	<= 0.020 ohm-cm	<= 0.020 ohm-cm	Aged; MIL-G-83528 Para. 4.6.15
Shielding Effectiveness	80 - 100 dB	80 - 100 dB	modified specimen 0.85 mm x 1.0 mm bead with plastic bolts; MIL-G-83528 Para. 4.6.12

Processing Properties	Metric	English	Comments
Cure Time	19.8 min @Temperature 100 °C	0.330 hour @Temperature 212 °F
	30.0 min @Temperature 85.0 °C	0.500 hour @Temperature 185 °F

Descriptive Properties	Value	Comments
Adhesion	>8 N/cm²	WI 038
Cure System	Heat
Filler	Ag/Cu
Mix Ratio	2-part

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