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Parker Chomerics THERM-A-FORM T642 Cure-in-Place Potting and Underfill Material
| Category | Polymer , Thermoset , Silicone |
| Manufacturer | Parker Chomerics |
| Trade Name | THERM-A-FORM |
| Port | Ningbo port,China |
| Trade Terms | FOB, CFR, CIF |
| Payment Terms | L/C, T/T, Western Union |
| Download PDF | Parker Chomerics THERM-A-FORM T642 Cure-in-Place Potting and Underfill Material.pdf  |
| Price | EMAIL US sales@lookpolymers.com |
Material Notes:
Description: THERM-A-FORM™ thermally conductive silicone elastomer products are dispensable form-in-place compounds designed for heat transfer without excessive compressive force in electronics cooling applications. These versatile liquid reactive materials can be dispensed and cured into complex geometries for cooling of multi-height components on a PCB without the expense of a molded sheet. Each compound is available in ready-to-use cartridge systems, eliminating weighing, mixing, and degassing procedures.Product Attributes: High thermal performance with flexibility; ideal for underfilling and low outgassingInformation provided by Chomerics
| Physical Properties | Metric | English | Comments |
|---|---|---|---|
| Specific Gravity | 1.50 g/cc | 1.50 g/cc | ASTM D792 |
| Viscosity | 2.5 cP | 2.5 cP | ASTM D2196 |
| Outgassing - Total Mass Loss | 0.21 % | 0.21 % | CVCM; ASTM D595 |
| 0.32 % | 0.32 % | TML; ASTM D595 |
| Mechanical Properties | Metric | English | Comments |
|---|---|---|---|
| Hardness, Shore A | 70 | 70 | ASTM D2240 |
| Thermal Properties | Metric | English | Comments |
|---|---|---|---|
| CTE, linear | 300 µm/m-°C | 167 µin/in-°F | ASTM E831 |
| Specific Heat Capacity | 1.00 J/g-°C | 0.239 BTU/lb-°F | ASTM E1269 |
| Thermal Conductivity | 1.20 W/m-K | 8.33 BTU-in/hr-ft²-°F | ASTM D5470 |
| Maximum Service Temperature, Air | 150 °C | 302 °F | |
| Minimum Service Temperature, Air | -50.0 °C | -58.0 °F | |
| Brittleness Temperature | -75.0 °C | -103 °F | ASTM D2137 |
| Electrical Properties | Metric | English | Comments |
|---|---|---|---|
| Volume Resistivity | 1.00e+13 ohm-cm | 1.00e+13 ohm-cm | ASTM D257 |
| Dielectric Constant | 4.0 @Frequency 1.00e+6 Hz |
4.0 @Frequency 1.00e+6 Hz |
ASTM D150 |
| Dielectric Strength | 20.0 kV/mm | 508 kV/in | ASTM D149 |
| Dissipation Factor | 0.0010 @Frequency 1.00e+6 Hz |
0.0010 @Frequency 1.00e+6 Hz |
Chomerics |
| Processing Properties | Metric | English | Comments |
|---|---|---|---|
| Cure Time | 3.00 min @Temperature 150 °C |
0.0500 hour @Temperature 302 °F |
|
| 30.0 min @Temperature 70.0 °C |
0.500 hour @Temperature 158 °F |
||
| 2880 min @Temperature 23.0 °C |
48.0 hour @Temperature 73.4 °F |
||
| Pot Life | 60.0 min @Temperature 23.0 °C |
60.0 min @Temperature 73.4 °F |
2X Starting Viscosity |
| Shelf Life | 3.00 Month | 3.00 Month | From date of Manufacture |
| Descriptive Properties | Value | Comments |
|---|---|---|
| Binder | Silicone | |
| Color | Blue | |
| Filler | Boron Nitride | |
| Mix Ratio | 10:1 | |
| Number of Components | 2-part |
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