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PolyOne Edgetek® PF-20CF/000 Polysulfone  (discontinued **)

Category Polymer , Thermoplastic , Polysulfone (PSU)
Manufacturer
Trade Name
Port Ningbo port,China
Trade Terms FOB, CFR, CIF
Payment Terms L/C, T/T, Western Union
Download PDF PolyOne Edgetek® PF-20CF/000 Polysulfone  (discontinued **).pdf
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Material Notes:
The Edgetek® Engineering Thermoplastic Compounds portfolio covers a broad range of standard and custom-formulated high performance materials. This portfolio includes high-temperature materials for elevated service temperature environments, high-modulus / structural materials for load-bearing and high-strength applications and flame-retardant products. These compounds are based on select engineering thermoplastic resins that are compounded with reinforcing additives such as carbon fiber, glass fiber and glass beads.Description/Features:PSU (Polysulfone)20% Carbon Fiber ReinforcedHi-TempApplications: Multi-purposeProcessing Method: Injection MoldingInformation provided by PolyOne Corporation
Physical Properties Metric English Comments
Specific Gravity 1.31 g/cc
1.31 g/cc
ASTM D792
Water Absorption 0.20 %

@Thickness 3.17 mm
0.20 %

@Thickness 0.125 in
24 hr. Immersion; ASTM D570
Linear Mold Shrinkage 0.0010 - 0.0020 cm/cm
0.0010 - 0.0020 in/in
ASTM D955
Mechanical Properties Metric English Comments
Tensile Strength, Yield 128 MPa
18500 psi
Type 1 - Rigids, Yield, 0.2 in/min; ASTM D638
Elongation at Break 2.0 - 4.0 %
2.0 - 4.0 %
Type 1 - Rigids, 0.2 in/min; ASTM D638
Tensile Modulus 11.0 GPa
1600 ksi
Type 1 - Rigids, 0.2 in/min; ASTM D638
Flexural Strength 155 MPa
22500 psi
ASTM D790
Flexural Modulus 11.0 GPa
1600 ksi
ASTM D790
Izod Impact, Notched 0.854 J/cm

@Thickness 3.17 mm,
Temperature 23.0 °C
1.60 ft-lb/in

@Thickness 0.125 in,
Temperature 73.4 °F
Method A, Injection Molded; ASTM D256
Thermal Properties Metric English Comments
Deflection Temperature at 1.8 MPa (264 psi) 179 °C
355 °F
Unannealed; ASTM D648
Processing Properties Metric English Comments
Melt Temperature 354 - 377 °C
670 - 710 °F
Molding
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