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Resin Technology Group 109-DP Oxy-Bond™ Two-Component Epoxy Adhesive

Category Polymer , Adhesive , Thermoset , Epoxy , Epoxy Adhesive
Manufacturer Resin Technology Group
Trade Name
Port Shanghai port,China
Trade Terms FOB, CFR, CIF
Payment Terms L/C, T/T, Western Union
Download PDF Resin Technology Group 109-DP Oxy-Bond™ Two-Component Epoxy Adhesive.pdf
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Material Notes:
Oxy-Bond and Millenium Adhesive SystemsEngineered for strength, durability, lightness, and formability, our Oxy-Bond and Millenium lines offer adhesives with physical and electrical properties to match a variety of specific application parameters, including MIL-APPROVED. Custom designed bonding products and expert technical assistance are always available.Resin Technology Group 109-DP Oxy-Bond™ Two-Component Epoxy AdhesiveTransparent, low viscosity, room temperature curing adhesive.
Physical Properties Metric English Comments
Viscosity 2500 cP
2500 cP
Thermal Properties Metric English Comments
Maximum Service Temperature, Air 120 °C
248 °F
Minimum Service Temperature, Air -60.0 °C
-76.0 °F
Optical Properties Metric English Comments
Transmission, Visible 90 %
90 %
transparent; thickness not quantified
Processing Properties Metric English Comments
Cure Time 30.0 min

@Temperature 65.0 °C
0.500 hour

@Temperature 149 °F
1440 min

@Temperature 23.0 °C
24.0 hour

@Temperature 73.4 °F
Pot Life 30 min
30 min
30 min
30 min
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