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Resinlab® EP1026 Clear Epoxy Adhesive

Category Polymer , Adhesive , Thermoset , Epoxy , Epoxy Adhesive
Manufacturer Resinlab®
Trade Name
Port Shanghai port,China
Trade Terms FOB, CFR, CIF
Payment Terms L/C, T/T, Western Union
Download PDF Resinlab® EP1026 Clear Epoxy Adhesive.pdf
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Material Notes:
Resinlab™ EP1026 Clear is a two part unfilled epoxy adhesive designed for high speed bonding of metals, ceramics, and most plastics. It cures to a tough semi-rigid material, and is free flowing in viscosity. It gives good resistance to water, salt spray, inorganic acids and bases, and most organic solvents. It was especially formulated to a 1:1 mix ratio for use in either MMD equipment or side-by-side dual cartridges for easy dispensing. A handling cure is normally achieved at room temperature within 20-30 minutes with full cure in 24 hours. An elevated temperature cure schedule can be used to reach final properties quickly.Information Provided by Resinlab L.L.C., an Ellsworth Adhesives Company.
Physical Properties Metric English Comments
Specific Gravity 1.12 g/cc
1.12 g/cc
Part B; TM R050-16
1.14 g/cc
1.14 g/cc
Mixed; TM R050-16
1.16 g/cc
1.16 g/cc
Part A; TM R050-16
Water Absorption 1.56 %

@Time 86400 sec
1.56 %

@Time 24.0 hour
TM R050-35
Viscosity 15000 cP
15000 cP
Part B, RVT, #7, 2.5 rpm; TM R050-12
15500 cP
15500 cP
Mixed; TM R050-12
16000 cP
16000 cP
Part A, RVT, #6, 2.5 rpm; TM R050-12
Mechanical Properties Metric English Comments
Hardness, Shore D 85
85
TM R050-17
Tensile Strength at Break 44.8 MPa
6500 psi
TM R050-36
Tensile Strength, Ultimate 51.7 MPa
7500 psi
TM R050-36
Tensile Strength, Yield 27.6 MPa
4000 psi
TM R050-36
Elongation at Break 10 - 20 %
10 - 20 %
TM R050-36
Tensile Modulus 3.10 GPa
450 ksi
TM R050-36
Compressive Yield Strength 27.6 MPa
4000 psi
TM R050-38
Compressive Strength >= 193 MPa
>= 28000 psi
Break; TM R050-38
>= 193 MPa
>= 28000 psi
Ultimate; TM R050-38
Compressive Modulus 1.38 GPa
200 ksi
TM R050-38
Adhesive Bond Strength 17.2 MPa
2500 psi
Lap shear; 2024 T3 Al Abraded / MEK Wipe; TM R050-37
Thermal Properties Metric English Comments
CTE, linear 60.0 µm/m-°C

@Temperature <=34.0 °C
33.3 µin/in-°F

@Temperature <=93.2 °F
below Tg
209 µm/m-°C

@Temperature >=34.0 °C
116 µin/in-°F

@Temperature >=93.2 °F
above Tg
Thermal Conductivity 0.185 W/m-K
1.28 BTU-in/hr-ft²-°F
Maximum Service Temperature, Air 90.0 °C
194 °F
Minimum Service Temperature, Air -40.0 °C
-40.0 °F
Glass Transition Temp, Tg 34.0 °C
93.2 °F
TM R050-25
Optical Properties Metric English Comments
Transmission, Visible 90 %
90 %
clear; thickness not quantified
Electrical Properties Metric English Comments
Volume Resistivity 8.00e+14 ohm-cm
8.00e+14 ohm-cm
Dielectric Constant 4.5

@Frequency 100 Hz,
Temperature 25.0 °C
4.5

@Frequency 100 Hz,
Temperature 77.0 °F
Dielectric Strength 16.1 kV/mm
410 kV/in
Processing Properties Metric English Comments
Pot Life 3.0 - 5.0 min
3.0 - 5.0 min
Mass: 25g; TM R050-19
Descriptive Properties Value Comments
Color Clear
Mix Ratio 1:1
Weight and Volume
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