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Sumitomo Bakelite North America 2008A Glass Reinforced Hardware Grade Epoxy

Category Polymer , Thermoset , Epoxy , Epoxy, Molded, Glass Fiber Filler , Filled/Reinforced Thermoset
Manufacturer Sumitomo Bakelite North America
Trade Name
Port Shanghai port,China
Trade Terms FOB, CFR, CIF
Payment Terms L/C, T/T, Western Union
Download PDF Sumitomo Bakelite North America 2008A Glass Reinforced Hardware Grade Epoxy.pdf
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Material Notes:
Epoxy is the premier material for military firewall connectors.Information provided by Sumitomo Bak North America, Inc.
Physical Properties Metric English Comments
Density 1.85 g/cc
0.0668 lb/in³
ASTM D792
Water Absorption 0.20 %
0.20 %
48 hours, 50°C. ASTM D570
Linear Mold Shrinkage 0.0030 - 0.0050 cm/cm
0.0030 - 0.0050 in/in
Compression Molding. ASTM D955
Mechanical Properties Metric English Comments
Hardness, Barcol 72
72
Tensile Strength, Ultimate 62.0 MPa
8990 psi
ASTM D638
Flexural Yield Strength 124 MPa
18000 psi
ASTM D790
Flexural Modulus 15.2 GPa
2200 ksi
ASTM D790
Compressive Yield Strength 207 MPa
30000 psi
ASTM D695
Izod Impact, Notched 0.350 J/cm
0.656 ft-lb/in
ASTM D256A
Thermal Properties Metric English Comments
CTE, linear, Parallel to Flow 37.0 µm/m-°C

@Temperature 20.0 °C
20.6 µin/in-°F

@Temperature 68.0 °F
ASTM D696
Thermal Conductivity 0.691 W/m-K
4.80 BTU-in/hr-ft²-°F
ASTM F433
Deflection Temperature at 1.8 MPa (264 psi) 260 °C
500 °F
ASTM D648A
Oxygen Index 50 %
50 %
ASTM D2863
Electrical Properties Metric English Comments
Dielectric Constant 4.0
4.0
Wet; ASTM D150
Dielectric Strength 12.0 kV/mm
305 kV/in
Wet, short term. ASTM D149
Dissipation Factor 0.019

@Frequency 1e+6 Hz
0.019

@Frequency 1e+6 Hz
Wet; ASTM D150
Arc Resistance 180 sec
180 sec
ASTM D495
Processing Properties Metric English Comments
Mold Temperature 143 - 177 °C
289 - 351 °F
compression/transfer molding.
174 - 182 °C
345 - 360 °F
injection molding.
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