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Sumitomo Bakelite North America E 8940SG Electrical Encapsulation Grade Epoxy

Category Polymer , Thermoset , Epoxy , Epoxy, Encapsulating, Glass or Mineral Filled , Filled/Reinforced Thermoset
Manufacturer Sumitomo Bakelite North America
Trade Name
Port Shanghai port,China
Trade Terms FOB, CFR, CIF
Payment Terms L/C, T/T, Western Union
Download PDF Sumitomo Bakelite North America E 8940SG Electrical Encapsulation Grade Epoxy.pdf
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Material Notes:
Mineral reinforced epoxy molding compound formulated for the encapsulation of electronic devices requiring high quality, exceptional reliability, and outstanding moldability. USES: Passive electronics, RC networks and rectifiers.Information provided by Vyncolit, a Sumitomo Bak Group
Physical Properties Metric English Comments
Bulk Density 0.800 g/cc
0.0289 lb/in³
Powder Density; ASTM D1895
Density 1.80 g/cc
0.0650 lb/in³
Relative Density; ASTM D792
Linear Mold Shrinkage 0.0030 - 0.0050 cm/cm
0.0030 - 0.0050 in/in
Compression Molding; ASTM D955
Mechanical Properties Metric English Comments
Tensile Strength at Break 86.0 MPa
12500 psi
ASTM D638
Flexural Strength 120 MPa
17400 psi
At Rupture; ASTM D790
Flexural Modulus 15.2 GPa
2200 ksi
ASTM D790
Compressive Strength 240 MPa
34800 psi
ASTM D695
Izod Impact, Notched 0.190 J/cm
0.356 ft-lb/in
ASTM D256
Thermal Properties Metric English Comments
CTE, linear, Parallel to Flow 22.0 µm/m-°C

@Temperature 20.0 °C
12.2 µin/in-°F

@Temperature 68.0 °F
ASTM E-831
Thermal Conductivity 0.720 W/m-K
5.00 BTU-in/hr-ft²-°F
ASTM C-518
Deflection Temperature at 1.8 MPa (264 psi) 225 °C
437 °F
Post Baked; ASTM D648A
Flammability, UL94 V-0

@Thickness 1.60 mm
V-0

@Thickness 0.0630 in
Electrical Properties Metric English Comments
Dielectric Constant 3.0

@Frequency 1e+6 Hz
3.0

@Frequency 1e+6 Hz
Dry; ASTM D150
Dielectric Strength 14.4 kV/mm
366 kV/in
60Hz, Step-by-Step, dry; ASTM D149
Dissipation Factor 0.0060

@Frequency 1e+6 Hz
0.0060

@Frequency 1e+6 Hz
Dry; ASTM D150
Descriptive Properties Value Comments
Color Black
Form Granular
Main Filler Mineral
Molding Method Compression, transfer
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