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Tra-Con Supertherm 826M01 High Performance Diamond Epoxy Adhesive

Category Polymer , Adhesive , Thermoset , Epoxy , Epoxy, Thermally Conductive , Filled/Reinforced Thermoset
Manufacturer Tra-Con, Inc.
Trade Name Supertherm
Port Shanghai port,China
Trade Terms FOB, CFR, CIF
Payment Terms L/C, T/T, Western Union
Download PDF Tra-Con Supertherm 826M01 High Performance Diamond Epoxy Adhesive.pdf
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Material Notes:
SUPERTHERM 826M01 is a one-part, smooth paste ULTRA HIGH THERMALLY CONDUCTIVE diamond filled epoxy adhesive recommended for semiconductor die-attach and other micro-electronic applications where the combination of very high thermal conductivity coupled with good electrical insulation over a wide temperature range is required. It develops good adhesion, after a REQUIRED high temperature cure cycle, to and between many different semiconductor substrates, metals, glass, ceramics and laminates. SUPERTHERM 826M01 has a long pot life at 25°C and a shelf life of 6 months when stored at -40°C. It provides both enhanced thermal conductivity and good electrical isolation for active or passive chip-type electronic or surface mounted components in printed, integrated and hybrid circuits, and is ideal for screen, dispenser or pin transfer and application methods. This adhesive complies with the requirements of NASA Outgassing Specification. Information provided by Tra-Con Inc.
Physical Properties Metric English Comments
Specific Gravity 2.55 g/cc
2.55 g/cc
Cured
Viscosity 110000 cP
110000 cP
Mixed (cp #52, 5 rpm)
Mechanical Properties Metric English Comments
Hardness, Shore D 90
90
15 min @ 150°C
Adhesive Bond Strength 11.0 MPa
1600 psi
Lap shear, alum to alum, 1 hr @ 150°C
Thermal Properties Metric English Comments
CTE, linear 20.0 µm/m-°C

@Temperature 20.0 °C
11.1 µin/in-°F

@Temperature 68.0 °F
Alpha 1; TMA
72.6 µm/m-°C

@Temperature 20.0 °C
40.3 µin/in-°F

@Temperature 68.0 °F
Alpha 2; TMA
Thermal Conductivity 2.30 W/m-K
16.0 BTU-in/hr-ft²-°F
ASTM E1461
Glass Transition Temp, Tg 105 °C
221 °F
Ultimate Tg; TMA
Processing Properties Metric English Comments
Cure Time 15.0 min

@Temperature 150 °C
0.250 hour

@Temperature 302 °F
30.0 min

@Temperature 120 °C
0.500 hour

@Temperature 248 °F
60.0 min

@Temperature 100 °C
1.00 hour

@Temperature 212 °F
120 min

@Temperature 80.0 °C
2.00 hour

@Temperature 176 °F
Pot Life 1440 min

@Temperature 25.0 °C
1440 min

@Temperature 77.0 °F
(1 day)
Descriptive Properties Value Comments
Color Gray
Outgassing, NASA, %CVCM 0.01
Outgassing, NASA, %TWL 0.17
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