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Tra-Con Tra-Bond 933-2 Moisture Resistant Chip Encapsulant

Category Polymer , Thermoset , Epoxy , Filled/Reinforced Thermoset
Manufacturer Tra-Con, Inc.
Trade Name Tra-Bond
Port Ningbo port,China
Trade Terms FOB, CFR, CIF
Payment Terms L/C, T/T, Western Union
Download PDF Tra-Con Tra-Bond 933-2 Moisture Resistant Chip Encapsulant.pdf
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Material Notes:
TRA-BOND 933-2 one component, highly filled, electrically insulating epoxy encapsulant is designed for encapsulating microelectronic chips. This epoxy provides excellent environmental and mechanical protection. TRA-BOND 933-2 encapsulant exhibits a longer work life and a lower moisture sensitivity than the anhydride-cured systems. The low coefficient of thermal expansion minimizes stress effects on components and wiring during thermal shock tests. Information provided by Tra-Con Inc.
Physical Properties Metric English Comments
Specific Gravity 2.20 g/cc
2.20 g/cc
Cured
Viscosity 50000 cP

@Temperature 25.0 °C
50000 cP

@Temperature 77.0 °F
Mixed (cp #51, 5 rpm)
Mechanical Properties Metric English Comments
Hardness, Shore D 92
92
Adhesive Bond Strength 17.2 MPa
2500 psi
Lap shear, alum to alum, 2 hrs @ 150°C
Thermal Properties Metric English Comments
CTE, linear 30.0 µm/m-°C
16.7 µin/in-°F
Below Tg
120 µm/m-°C
66.7 µin/in-°F
Above Tg
Maximum Service Temperature, Air 150 °C
302 °F
Minimum Service Temperature, Air -60.0 °C
-76.0 °F
Glass Transition Temp, Tg 120 °C
248 °F
Ultimate Tg
Processing Properties Metric English Comments
Cure Time 15.0 min

@Temperature 170 °C
0.250 hour

@Temperature 338 °F
30.0 min

@Temperature 150 °C
0.500 hour

@Temperature 302 °F
60.0 - 120 min

@Temperature 125 °C
1.00 - 2.00 hour

@Temperature 257 °F
Descriptive Properties Value Comments
Color Black
Working Life, months 2
At 25°C
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