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Tra-Con Tra-Bond F175T One-Part Thixotropic UV Curing Adhesive

Category Polymer , Adhesive , Thermoset
Manufacturer Tra-Con, Inc.
Trade Name Tra-Bond
Port Shanghai port,China
Trade Terms FOB, CFR, CIF
Payment Terms L/C, T/T, Western Union
Download PDF Tra-Con Tra-Bond F175T One-Part Thixotropic UV Curing Adhesive.pdf
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Material Notes:
TRA-BOND F175T is a thixotropic, one part UV curing adhesive designed for bonding metals, ceramics and most rigid polymers. It is an excellent adhesive for fiber optic terminations where fast cure with ultraviolet light is desired. It is also recommended for electronic applications as it has very low ionic impurities. TRA-BOND F175T is a unique system which produces very little shrinkage upon cure. It is an excellent choice for high humidity environments or applications requiring thermal cycling. HANDLING: TRA-BOND F175T should be stored with an air space to ensure maximum stability. Do not purge with nitrogen.Information provided by Tra-Con Inc.
Physical Properties Metric English Comments
Specific Gravity 1.05 g/cc
1.05 g/cc
Mixed
Mechanical Properties Metric English Comments
Hardness, Shore D 75
75
Thermal Properties Metric English Comments
CTE, linear 130 µm/m-°C

@Temperature 20.0 °C
72.2 µin/in-°F

@Temperature 68.0 °F
Maximum Service Temperature, Air 110 °C
230 °F
Minimum Service Temperature, Air -55.0 °C
-67.0 °F
Glass Transition Temp, Tg 11.0 °C
51.8 °F
Ultimate Tg
Processing Properties Metric English Comments
Cure Time 0.0167 min
0.000278 hour
400 W/inch @ 1"
0.0667 min
0.00111 hour
400 W/inch @ 6"
0.750 min
0.0125 hour
9 mW/inch @ 1"
Descriptive Properties Value Comments
Color Light Yellow
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