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Tra-Con Tra-Duct 2907 Silver-Filled Epoxy Adhesive

Category Polymer , Adhesive , Thermoset , Epoxy , Filled/Reinforced Thermoset
Manufacturer Tra-Con, Inc.
Trade Name Tra-Duct
Port Ningbo port,China
Trade Terms FOB, CFR, CIF
Payment Terms L/C, T/T, Western Union
Download PDF Tra-Con Tra-Duct 2907 Silver-Filled Epoxy Adhesive.pdf
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Material Notes:
TRA-DUCT 2907 is an electrically conducting silver-filled medium viscosity epoxy compound recommended for electronic bonding and sealing applications that require a combination of good mechanical and electrical properties. This two-part, smooth paste formulation of refined pure silver and epoxy is free of solvents and copper or carbon additives. It develops strong, durable, electrically and thermally conducting bonds and coatings between many different and dissimilar materials such as metals, ceramics, glass and plastic laminates. TRA-DUCT 2907 cures at room temperature and can be used as a "cold-solder" for heat-sensitive components where hot-soldering is impractical. It also can be used for the assembly and repair of electrical modules, printed circuits, wave guides, flat cable and high frequency shields.Information provided by Tra-Con Inc.
Physical Properties Metric English Comments
Viscosity 6500 cP

@Temperature 25.0 °C
6500 cP

@Temperature 77.0 °F
Mixed (cp #52, 10 rpm)
Mechanical Properties Metric English Comments
Hardness, Shore D 85
85
24 hrs @ 25°C
87
87
10 min @ 100°C
88
88
2 hrs @ 65°C
Adhesive Bond Strength 8.27 MPa
1200 psi
Lap shear, alum to alum, 24 hrs @ 25°C
8.96 MPa
1300 psi
Lap shear, alum to alum, 10 min @ 100°C
10.3 MPa
1500 psi
Lap shear, alum to alum, 2 hrs @ 65°C
Thermal Properties Metric English Comments
CTE, linear 49.0 µm/m-°C

@Temperature 20.0 °C
27.2 µin/in-°F

@Temperature 68.0 °F
Glass Transition Temp, Tg 50.0 °C
122 °F
Ultimate Tg
Electrical Properties Metric English Comments
Volume Resistivity 0.00030 ohm-cm
0.00030 ohm-cm
cured 10 min @ 100°C
0.0040 ohm-cm
0.0040 ohm-cm
cured 2 hrs @ 65°C
0.0080 ohm-cm
0.0080 ohm-cm
cured 24 hrs @ 25°C
Processing Properties Metric English Comments
Cure Time 10.0 min

@Temperature 100 °C
0.167 hour

@Temperature 212 °F
120 min

@Temperature 65.0 °C
2.00 hour

@Temperature 149 °F
1440 min

@Temperature 25.0 °C
24.0 hour

@Temperature 77.0 °F
Pot Life 100 min
100 min
Descriptive Properties Value Comments
Color Silver
Thixotropic Index 3.5
1 rpm/10 rpm
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