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Tra-Con Tra-Duct 2958 Snap Cure Conductive Silver Epoxy Adhesive

Category Polymer , Adhesive , Thermoset , Epoxy , Epoxy, Electrically Conductive , Filled/Reinforced Thermoset
Manufacturer Tra-Con, Inc.
Trade Name Tra-Duct
Port Ningbo port,China
Trade Terms FOB, CFR, CIF
Payment Terms L/C, T/T, Western Union
Download PDF Tra-Con Tra-Duct 2958 Snap Cure Conductive Silver Epoxy Adhesive.pdf
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Material Notes:
TRA-DUCT 2958 is a two-part, smooth paste of specially refined and processed epoxy and silver components, recommended for electronic, microelectronic and die-attach bonding and sealing applications that require superior electrical and mechanical properties. It has a long pot life, and is free of contaminating solvents and additives, and develops strong durable, void-free, electrically and thermally conducting bonds, seals and coatings -- after a REQUIRED high temperature cure cycle -- to and between many different electronic substrates. TRA-DUCT 2958 is ideal for chip bonding, electrical modules, printed circuit, wave guides, high frequency shields, and for other manufacturing operations, using screen printing, or machine dispensing through small (from 0.006 inch up) tips. Information provided by Tra-Con Inc.
Physical Properties Metric English Comments
Specific Gravity 2.65 g/cc
2.65 g/cc
Mixed
Solids Content 100 %
100 %
Reactive Solids Content
Viscosity 40000 cP

@Temperature 25.0 °C
40000 cP

@Temperature 77.0 °F
After mixing
Mechanical Properties Metric English Comments
Hardness, Shore D 80
80
Adhesive Bond Strength 6.89 MPa
1000 psi
Lap shear, alum to alum, 2 min @ 150°C
6.89 MPa
1000 psi
Lap shear, alum to alum, 5 min @ 125°C
Thermal Properties Metric English Comments
CTE, linear 49.0 µm/m-°C

@Temperature 20.0 °C
27.2 µin/in-°F

@Temperature 68.0 °F
Thermal Conductivity 1.50 W/m-K
10.4 BTU-in/hr-ft²-°F
Maximum Service Temperature, Air 175 °C
347 °F
Minimum Service Temperature, Air -60.0 °C
-76.0 °F
Glass Transition Temp, Tg 92.0 °C
198 °F
Ultimate Tg
Electrical Properties Metric English Comments
Volume Resistivity 0.00030 ohm-cm
0.00030 ohm-cm
cured 5 min @ 125°C
0.00050 ohm-cm
0.00050 ohm-cm
cured 2 min @ 150°C
Processing Properties Metric English Comments
Cure Time 2.00 min

@Temperature 150 °C
0.0333 hour

@Temperature 302 °F
5.00 min

@Temperature 125 °C
0.0833 hour

@Temperature 257 °F
15.0 min

@Temperature 100 °C
0.250 hour

@Temperature 212 °F
Pot Life 240 min
240 min
Descriptive Properties Value Comments
Color Silver
Mix Ratio, parts by weight 100/6
Resin/Hardener
Thixotropic Index 2.9
5 rpm/50 rpm
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