Tra-Con Tra-Duct 2960 Snap Cure Electrically Conductive Silver-Filled Epoxy

Category	Polymer , Adhesive , Thermoset , Epoxy , Epoxy, Electrically Conductive , Filled/Reinforced Thermoset
Manufacturer	Tra-Con, Inc.
Trade Name	Tra-Duct
Port	Shanghai port,China
Trade Terms	FOB, CFR, CIF
Payment Terms	L/C, T/T, Western Union
Download PDF	Tra-Con Tra-Duct 2960 Snap Cure Electrically Conductive Silver-Filled Epoxy.pdf
Price	EMAIL US sales@lookpolymers.com
	Online Service lookpolymers 27660005

Material Notes:

TRA-DUCT 2960 is a one or two-part, specially refined and processed silver filled adhesive for high speed manufacturing. Recommended for the microelectronic, automotive computer and telecommunications assembly and packaging industries. TRA-DUCT 2960 provides high electrical and thermal conductivity , along with excellent adhesion to numerous substrate materials. Ideal for chip/die bonding or heat sink attach, TRA-DUCT 2960 snap cures in 2 minutes at 150°C and can withstand operating temperatures up to 175°C. TRA-DUCT 2960 was designed for high speed component attachment of electronic modules, printed circuit board assembly and high frequency shielding, when screen printing or automatic dispensing is desired. Information provided by Tra-Con Inc.

Physical Properties	Metric	English	Comments
Specific Gravity	2.76 g/cc	2.76 g/cc	Mixed
Volatile Organic Compounds (VOC) Content	5.73 g/l	5.73 g/l
Water Absorption	0.12 %	0.12 %	After 24 hours
Viscosity	144000 cP @Temperature 25.0 °C	144000 cP @Temperature 77.0 °F	Mixed (sp #7, 10 rpm)

Mechanical Properties	Metric	English	Comments
Hardness, Shore D	85	85
Adhesive Bond Strength	11.0 MPa	1600 psi	Lap shear, alum to alum, 15 min @ 100°C
	13.1 MPa	1900 psi	Lap shear, alum to alum, 2 min @ 150°C
	14.5 MPa	2100 psi	Lap shear, alum to alum, 5 min @ 125°C

Thermal Properties	Metric	English	Comments
CTE, linear	46.5 µm/m-°C	25.8 µin/in-°F	Below Tg
	280 µm/m-°C	156 µin/in-°F	Above Tg
Thermal Conductivity	1.32 W/m-K	9.16 BTU-in/hr-ft²-°F
Maximum Service Temperature, Air	175 °C	347 °F
Minimum Service Temperature, Air	-60.0 °C	-76.0 °F
Glass Transition Temp, Tg	49.0 °C	120 °F	Ultimate Tg

Electrical Properties	Metric	English	Comments
Volume Resistivity	0.00090 ohm-cm	0.00090 ohm-cm	cured 2 min @ 150°C
	0.0050 ohm-cm	0.0050 ohm-cm	cured 5 min @ 125°C
	0.0070 ohm-cm	0.0070 ohm-cm	cured 15 min @ 100°C

Processing Properties	Metric	English	Comments
Cure Time	2.00 min @Temperature 150 °C	0.0333 hour @Temperature 302 °F
	5.00 min @Temperature 125 °C	0.0833 hour @Temperature 257 °F
	15.0 min @Temperature 100 °C	0.250 hour @Temperature 212 °F
Pot Life	300 min	300 min	25 grams

Descriptive Properties	Value	Comments
Color	Silver
Outgassing, NASA	Passes
Working Life hours	8	25 grams

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