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Polymer Property : Particle Size = 20 µm Product List

Physical Properties

Tips: 30 items are displayed at most.
Physical Properties Metric English Comments
Particle Size <= 20 µm
<= 20 µm
90% smaller than
Nyco NYGLOS® 4W Wollastonite
High aspect ratio grade. This grade is recommended for polymer reinforcement.Wollastonite is a naturally occurring white mineral with an acicular (needle-shaped) particle structure. This distinctiv..
Particle Size 20 µm
20 µm
99% finer than
Imerys Bardenâ„¢ Kaolin
Barden is a high surface area kaolin product used a filler in rubber and plastic applications.Information provided by Imerys
Particle Size 20 µm
20 µm
96% finer than
Imerys Kaolin Slurryâ„¢
Kaolin Slurry is a carefully controlled Kaolin-water suspension formulated for use in cermic castings.Information provided by Imerys
Particle Size 20 µm
20 µm
97% finer than
Imerys KT-Cast/Rogersâ„¢ Kaolin
Information provided by Imerys
Particle Size >= 20 µm
>= 20 µm
trace
Imerys Minsparâ„¢ 1 Feldspar
Minspar 1 is a minus 30 mesh Feldspar product used in the glass container and ceramic tile markets.Information provided by Imerys
Particle Size 20 µm
20 µm
72% finer than
Imerys Minsparâ„¢ 200 Feldspar
Minspar 200 is 200 mesh flotation grade soda Feldspar used in the ceramic whiteware industry for sanitaryware, dinnerware, floor and wall tile, artware and glazes.Information provided by Imerys
Particle Size 20 µm
20 µm
Average Size
Inhance Fluoro-Seal INHANCE® HD-1800 HDPE
Product Description: INHANCE HD-1000 Series Polyethylene Particles are surface-activated High Density Polyethylene (HDPE) in particle or powder form. Surface activation makes the particles easy to..
Particle Size >= 20 µm
>= 20 µm
D10
Momentive Performance Materials PolarTherm® PTX60 Boron Nitride (BN) Powder
Spherical BN Agglomeration Powder. Spherical nature may improve thermal conductivity at moderate loading levels when used as a filler in polymers or lubricants, and produce less anisotropic propert..
Particle Size 20 µm
20 µm
maximum of 15% less than
H.C. Starck Amperit® 586.1 Chromium Carbide-Nickel Chromium 80-20 (Cr3C2-NiCr)
Particle Size 20 µm
20 µm
50% of particles
Ferro CF 7574 Glaze and Sealant Glass
Glass Type: Zn-B-Si Typical Powder Form: VSD Typical Application: Pyrex Silicon Ferro's electronic and specialty glass group has produced over 3,000 formulations. Many are used as protective and ..
Particle Size 20 - 24 µm
20 - 24 µm
10%
H.C. Starck Amperit® 109.066 Agglomerated Sintered Molybdenum (Mo)
Particle Size 20 µm
20 µm
Silberline SilBerCote® 520-10Z
SilBerCote® Z polymer treated aluminum pigments are resistant to acid and alkali staining, while providing enhanced electrical charge resistance in finished coatings. Product is typically formula..
Particle Size 20 µm
20 µm
Springback 13%, pressure 0.477 t/cc
TIMCAL TIMREX® KS44 Primary Synthetic Graphite
TIMREX Primary Synthetic Graphite is produced in a unique highly controlled graphitization process which assures narrow specifications and unequalled consistent quality due to: monitoring of all pro..
Particle Size 20 - 60 µm
20 - 60 µm
DayGlo ZQ Pigments ZQ-13 Rocket Red
DAY-GLO ZQ-Pigments are an improved version of DAY-GLO Z-Pigments. They offer lower mold plateout, increased plastic compatibility, are mostly stronger, require processing temperatures, and have lar..
Particle Size 20 - 60 µm
20 - 60 µm
DayGlo ZQ Pigments ZQ-17 Saturn Yellow
DAY-GLO ZQ-Pigments are an improved version of DAY-GLO Z-Pigments. They offer lower mold plateout, increased plastic compatibility, are mostly stronger, require processing temperatures, and have lar..
Particle Size 20 - 60 µm
20 - 60 µm
DayGlo ZQ Pigments ZQ-21 Corona Magenta
DAY-GLO ZQ-Pigments are an improved version of DAY-GLO Z-Pigments. They offer lower mold plateout, increased plastic compatibility, are mostly stronger, require processing temperatures, and have lar..
Particle Size <= 20 µm
<= 20 µm
Epoxy Technology EPO-TEK® E2101 Electrically Conductive, Silver Epoxy
Product Description: EPO-TEK® E2101 is a two component, thixotropic, electrically conductive adhesive. It may be used for circuit assembly and semiconductor applications. Advantages & Application ..
Particle Size <= 20 µm
<= 20 µm
Epoxy Technology EPO-TEK® E3001-HV Electrically Conductive, Silver Epoxy
Product Description: EPO-TEK® E3001-HV is a snap cure, single component, silver-filled die attach adhesive for semiconductor plastic IC packaging. Also available in a frozen syringe. Advantages & ..
Particle Size <= 20 µm
<= 20 µm
Epoxy Technology EPO-TEK® ED1021 Epoxy
Preliminary Product Information SheetMaterial Description: A single component, silver-filled epoxy designed for low power semiconductor LED die attach applications. Unique features include its abil..
Particle Size <= 20 µm
<= 20 µm
Epoxy Technology EPO-TEK® H20E-PFC Electrically Conductive, Silver Epoxy
Product Description: EPO-TEK® H20E-PFC is a two component, semiconductor grade epoxy, designed for flip chip interconnects using a solder-free joining method.Advantages & Application Notes: Stencil..
Particle Size <= 20 µm
<= 20 µm
Epoxy Technology EPO-TEK® H20S Electrically Conductive, Silver Epoxy for Die Stamping
Product Description: EPO-TEK® H20S is a modified version of EPO-TEK® H20E, designed primarily for die stamping and dispensing techniques for chip bonding. EPO-TEK®H20S is a highly reliable, two ..
Particle Size <= 20 µm
<= 20 µm
Epoxy Technology EPO-TEK® H35-175MP Electrically Conductive, Silver Epoxy
Product Description: EPO-TEK® H35-175MP is a single component, silver-filled, electrically conductive epoxy designed for semiconductor die attach applications found in hybrids, JEDEC, and opto-elec..
Particle Size 20 µm
20 µm
Target Median Particle Size
CIMBAR Crescent 35 Calcium Carbonate (CaCO3), Medium Powder
CIMBAR's Crescent product line is a natural calcium carbonate ground to various particle size distributions. The crystalline structure of the calcium carbonate in Crescent products has a predominan..
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