| Physical Properties | Metric | English | Comments |
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| Particle Size | <= 20 µm | <= 20 µm | 90% smaller than |
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Nyco NYGLOS® 4W Wollastonite
High aspect ratio grade. This grade is recommended for polymer reinforcement.Wollastonite is a naturally occurring white mineral with an acicular (needle-shaped) particle structure. This distinctiv..
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| Particle Size | 20 µm | 20 µm | 99% finer than |
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Imerys Bardenâ„¢ Kaolin
Barden is a high surface area kaolin product used a filler in rubber and plastic applications.Information provided by Imerys
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| Particle Size | 20 µm | 20 µm | 96% finer than |
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Imerys Kaolin Slurryâ„¢
Kaolin Slurry is a carefully controlled Kaolin-water suspension formulated for use in cermic castings.Information provided by Imerys
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| Particle Size | 20 µm | 20 µm | 97% finer than |
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Imerys KT-Cast/Rogersâ„¢ Kaolin
Information provided by Imerys
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| Particle Size | >= 20 µm | >= 20 µm | trace |
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Imerys Minsparâ„¢ 1 Feldspar
Minspar 1 is a minus 30 mesh Feldspar product used in the glass container and ceramic tile markets.Information provided by Imerys
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| Particle Size | 20 µm | 20 µm | 72% finer than |
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Imerys Minsparâ„¢ 200 Feldspar
Minspar 200 is 200 mesh flotation grade soda Feldspar used in the ceramic whiteware industry for sanitaryware, dinnerware, floor and wall tile, artware and glazes.Information provided by Imerys
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| Particle Size | 20 µm | 20 µm | Average Size |
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Inhance Fluoro-Seal INHANCE® HD-1800 HDPE
Product Description: INHANCE HD-1000 Series Polyethylene Particles are surface-activated High Density Polyethylene (HDPE) in particle or powder form. Surface activation makes the particles easy to..
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| Particle Size | >= 20 µm | >= 20 µm | D10 |
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Momentive Performance Materials PolarTherm® PTX60 Boron Nitride (BN) Powder
Spherical BN Agglomeration Powder. Spherical nature may improve thermal conductivity at moderate loading levels when used as a filler in polymers or lubricants, and produce less anisotropic propert..
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| Particle Size | 20 µm | 20 µm | maximum of 15% less than |
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H.C. Starck Amperit® 586.1 Chromium Carbide-Nickel Chromium 80-20 (Cr3C2-NiCr) |
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| Particle Size | 20 µm | 20 µm | 50% of particles |
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Ferro CF 7574 Glaze and Sealant Glass
Glass Type: Zn-B-Si Typical Powder Form: VSD Typical Application: Pyrex Silicon Ferro's electronic and specialty glass group has produced over 3,000 formulations. Many are used as protective and ..
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| Particle Size | 20 - 24 µm | 20 - 24 µm | 10% |
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H.C. Starck Amperit® 109.066 Agglomerated Sintered Molybdenum (Mo) |
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| Particle Size | 20 µm | 20 µm | |
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Silberline SilBerCote® 520-10Z
SilBerCote® Z polymer treated aluminum pigments are resistant to acid and alkali staining, while providing enhanced electrical charge resistance in finished coatings. Product is typically formula..
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| Particle Size | 20 µm | 20 µm | Springback 13%, pressure 0.477 t/cc |
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TIMCAL TIMREX® KS44 Primary Synthetic Graphite
TIMREX Primary Synthetic Graphite is produced in a unique highly controlled graphitization process which assures narrow specifications and unequalled consistent quality due to: monitoring of all pro..
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| Particle Size | 20 - 60 µm | 20 - 60 µm | |
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DayGlo ZQ Pigments ZQ-13 Rocket Red
DAY-GLO ZQ-Pigments are an improved version of DAY-GLO Z-Pigments. They offer lower mold plateout, increased plastic compatibility, are mostly stronger, require processing temperatures, and have lar..
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| Particle Size | 20 - 60 µm | 20 - 60 µm | |
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DayGlo ZQ Pigments ZQ-17 Saturn Yellow
DAY-GLO ZQ-Pigments are an improved version of DAY-GLO Z-Pigments. They offer lower mold plateout, increased plastic compatibility, are mostly stronger, require processing temperatures, and have lar..
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| Particle Size | 20 - 60 µm | 20 - 60 µm | |
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DayGlo ZQ Pigments ZQ-21 Corona Magenta
DAY-GLO ZQ-Pigments are an improved version of DAY-GLO Z-Pigments. They offer lower mold plateout, increased plastic compatibility, are mostly stronger, require processing temperatures, and have lar..
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| Particle Size | <= 20 µm | <= 20 µm | |
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Epoxy Technology EPO-TEK® E2101 Electrically Conductive, Silver Epoxy
Product Description: EPO-TEK® E2101 is a two component, thixotropic, electrically conductive adhesive. It may be used for circuit assembly and semiconductor applications. Advantages & Application ..
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| Particle Size | <= 20 µm | <= 20 µm | |
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Epoxy Technology EPO-TEK® E3001-HV Electrically Conductive, Silver Epoxy
Product Description: EPO-TEK® E3001-HV is a snap cure, single component, silver-filled die attach adhesive for semiconductor plastic IC packaging. Also available in a frozen syringe. Advantages & ..
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| Particle Size | <= 20 µm | <= 20 µm | |
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Epoxy Technology EPO-TEK® ED1021 Epoxy
Preliminary Product Information SheetMaterial Description: A single component, silver-filled epoxy designed for low power semiconductor LED die attach applications. Unique features include its abil..
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| Particle Size | <= 20 µm | <= 20 µm | |
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Epoxy Technology EPO-TEK® H20E-PFC Electrically Conductive, Silver Epoxy
Product Description: EPO-TEK® H20E-PFC is a two component, semiconductor grade epoxy, designed for flip chip interconnects using a solder-free joining method.Advantages & Application Notes: Stencil..
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| Particle Size | <= 20 µm | <= 20 µm | |
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Epoxy Technology EPO-TEK® H20S Electrically Conductive, Silver Epoxy for Die Stamping
Product Description: EPO-TEK® H20S is a modified version of EPO-TEK® H20E, designed primarily for die stamping and dispensing techniques for chip bonding. EPO-TEK®H20S is a highly reliable, two ..
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| Particle Size | <= 20 µm | <= 20 µm | |
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Epoxy Technology EPO-TEK® H35-175MP Electrically Conductive, Silver Epoxy
Product Description: EPO-TEK® H35-175MP is a single component, silver-filled, electrically conductive epoxy designed for semiconductor die attach applications found in hybrids, JEDEC, and opto-elec..
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| Particle Size | 20 µm | 20 µm | Target Median Particle Size |
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CIMBAR Crescent 35 Calcium Carbonate (CaCO3), Medium Powder
CIMBAR's Crescent product line is a natural calcium carbonate ground to various particle size distributions. The crystalline structure of the calcium carbonate in Crescent products has a predominan..
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