Polymer Property : Specific Gravity = 2.10 g/cc Product List

Physical Properties

Tips: 30 items are displayed at most.

Physical Properties	Metric	English	Comments
Specific Gravity	2.10 - 2.20 g/cc	2.10 - 2.20 g/cc	ASTM D1457-18
Polimersan Plastics POLITEF® (PTFE) with 25% Carbon As a result of Filled-In POLITEF® alloys, apart from all of its superior properties, POLITEF®, according to its usage areas has gained additional properties as described below:Electrical Conductiv..
Specific Gravity	2.10 - 2.20 g/cc	2.10 - 2.20 g/cc	ASTM D1457-18
Polimersan Plastics POLITEF® (PTFE) with 25% Carbon As a result of Filled-In POLITEF® alloys, apart from all of its superior properties, POLITEF®, according to its usage areas has gained additional properties as described below:Electrical Conductiv..
Specific Gravity	2.10 g/cc	2.10 g/cc	ASTM D792
Rogers Corporation RO3730 Antenna Grade Laminate RO3730™ Laminates have the excellent thermo-mechanical properties and electrical characteristics that antenna designers need. The laminates have a dielectric constant of 3.0 and a loss tangent of..
Specific Gravity	2.10 - 2.30 g/cc	2.10 - 2.30 g/cc	ASTM D1457-18
Polimersan Plastics POLITEF® (PTFE) with 15% Glass As a result of Filled-In POLITEF® alloys, apart from all of its superior properties, POLITEF®, according to its usage areas has gained additional properties as described below:Electrical Conductiv..
Specific Gravity	2.10 - 2.30 g/cc	2.10 - 2.30 g/cc	ASTM D1457-18
Polimersan Plastics POLITEF® (PTFE) with 15% Glass As a result of Filled-In POLITEF® alloys, apart from all of its superior properties, POLITEF®, according to its usage areas has gained additional properties as described below:Electrical Conductiv..
Specific Gravity	2.10 g/cc	2.10 g/cc
Resin Technology Group TIGA 951 One-Part Silver Conductive Epoxy System Cure 10 minutes at 120°CTIGA 951 is an electrically conductive, silver-filled epoxy adhesive recommended for electronic bonding and sealing applications. This one-part, smooth paste formulation of ..
Specific Gravity	2.10 g/cc	2.10 g/cc	-40Â°C for 1,000 hrs; JIS-K-6220; ASTM D 792
Fujipoly Industries SarconÂ® NR-c Gap Filler Pad Non-Silicone Sarcon NR-c consists of an Acrylate resin and some thermal conductive fillers. It is a highly conformable/ thermally conductive material in a versatile sheet form that makes reliable and complete p..
Specific Gravity	2.10 g/cc	2.10 g/cc	-40Â°C for 30 min and 125Â°C for 30 min. for 1,000 times; JIS-K-6220; ASTM D 792
Fujipoly Industries SarconÂ® NR-c Gap Filler Pad Non-Silicone Sarcon NR-c consists of an Acrylate resin and some thermal conductive fillers. It is a highly conformable/ thermally conductive material in a versatile sheet form that makes reliable and complete p..
Specific Gravity	2.10 g/cc	2.10 g/cc	85Â°C for 1,000 hrs with 85% RH; JIS-K-6220; ASTM D 792
Fujipoly Industries SarconÂ® NR-c Gap Filler Pad Non-Silicone Sarcon NR-c consists of an Acrylate resin and some thermal conductive fillers. It is a highly conformable/ thermally conductive material in a versatile sheet form that makes reliable and complete p..
Specific Gravity	2.10 g/cc	2.10 g/cc	80Â°C for 1,000 hrs; JIS-K-6220; ASTM D 792
Fujipoly Industries SarconÂ® NR-c Gap Filler Pad Non-Silicone Sarcon NR-c consists of an Acrylate resin and some thermal conductive fillers. It is a highly conformable/ thermally conductive material in a versatile sheet form that makes reliable and complete p..
Specific Gravity	2.10 g/cc	2.10 g/cc	STM 2
Lord Adhesives Thermosetâ„¢ SC-303 Silicone Encapsulant, Flame Retardant Lord SC-303 is a two component silicone elastomer that provides excellent thermal conductivity, while retaining the other desirable properties associated with silicones. It is a low viscosity, easil..
Specific Gravity	2.10 g/cc	2.10 g/cc	ASTM D297
Greene Tweed CHEMRAZÂ® 520 Perfluoroelastomer ChemrazÂ® 520 is recommended for a wide variety of semiconductor equipment dry processing applications where seal reliability with minimal contaminations is required. Additionally, Chemraz 520 of..
Specific Gravity	2.10 g/cc	2.10 g/cc	Mixed
Tra-Con Tra-Bond 342-14T Low Viscosity Room Temperature Cure Epoxy Adhesive TRA-BOND 342-14T single component, low viscosity alumina-filled epoxy adhesive exhibits high bond strength and excellent thermal shock characteristics. This adhesive may be cured at room temperature..
Specific Gravity	2.10 g/cc	2.10 g/cc	Cured
Tra-Con Tra-Bond 933-1 Moisture Resistant Chip Encapsulant TRA-BOND 933-1 one component, highly filled, electrically insulating epoxy encapsulant is designed for encapsulating microelectronic chips. This epoxy provides excellent environmental and mechanical..
Specific Gravity	2.10 g/cc	2.10 g/cc	Mixed
Tra-Con Tra-Bond GA47-2LV Instrument Adhesive TRA-BOND GA47-2LV low viscosity adhesive is designed for guidance instrument applications. This adhesive exhibits excellent compatibility with conventional gyro flotation fluids. TRA-BOND GA47-2LV a..
Specific Gravity	2.10 g/cc	2.10 g/cc	Mixed
Tra-Con Tra-Bond 813J01 Silicone Encapsulant TRA-BOND 813J01 is a silicone adhesive system formulated to provide excellent thermal conductivity. This unique product bonds well to difficult substrates. Typical applications include encapsulation..
Specific Gravity	2.10 g/cc	2.10 g/cc	ASTM-D792
CoorsTek PolyGlyde™ 3000 Self-Lubricating Seal PolyGlyde seals offer low heat generation in high-friction and high-stress environments. These seals provide superior performance over traditional carbon materials: runs cooler – even in dry-runni..
Specific Gravity	2.10 - 2.14 g/cc	2.10 - 2.14 g/cc	ASTM D792
Daikin NEOFLON M-300H PCTFE Granular Molding Powder NEOFLON PCTFE M-300 series is used for general purpose applications.Description:Granular powders.Processing Methods: Compression molding, extrusion.Uses: Sheets, rods, tubing.Information provided by..
Specific Gravity	2.10 - 2.14 g/cc	2.10 - 2.14 g/cc	ASTM D792
Daikin NEOFLON M-300P PCTFE Pellets NEOFLON PCTFE M-300 series is used for general purpose applications.Description:Pellets.Processing Methods: Extrusion.Uses: Rods, small parts.Information provided by Daikin Industries.
Specific Gravity	2.10 - 2.14 g/cc	2.10 - 2.14 g/cc	ASTM D792
Daikin NEOFLON M-400H PCTFE Granular Molding Powder NEOFLON PCTFE M-400 series is a high molecular weight type material which is suitable for applications requiring mechanical toughness and stress crack resistance.Description:Granular powders.Process..
Specific Gravity	2.10 g/cc	2.10 g/cc	Part A
Epoxy Technology EPO-TEK® H24 Electrically Conductive Epoxy Product Description: EPO-TEK® H24 is a two component, electrically and thermally conductive epoxy adhesive designed for semiconductor die attach and hybrid micro-electronics assembly.Advantages & A..
Specific Gravity	2.10 g/cc @Temperature 25.0 °C	2.10 g/cc @Temperature 77.0 °F
Dow Corning 340 Heat Sink Compound White, non-flowing, highly filled compound, good thermal conductivity.Information provided by Dow Corning
Specific Gravity	2.10 - 2.12 g/cc	2.10 - 2.12 g/cc	ASTM D792
Asahi Glass Fluon® P-810UP PFA Perfluoropolymer Fluon® PFA is a copolymer of tetrafluoroethylene (C2F4) and perfluoroalkoxyethylene, which has excellent chemical, electrical, mechanical and surface properties. PFA retains many inherent character..
Specific Gravity	2.10 g/cc	2.10 g/cc
Bulk Molding Compounds BMC 2201 Mineral Filled Alkyd BMC 2201 molding compound is a mineral filled, glass-fiber-and nylon-floc reinforced alkyd compound suitable for compression and transfer molding. It was developed for applications requiring better ..
Specific Gravity	2.10 - 2.16 g/cc	2.10 - 2.16 g/cc	ISO 12086
Isoflon PCTFE Polychlorotrifluoroethylene Fluoropolymer material specifications.Information provided by Isoflon.