| Physical Properties | Metric | English | Comments |
|---|---|---|---|
| Viscosity | 1500 cP | 1500 cP | |
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Reltek BONDiT™ B-45 Adhesive, Sealant & Coating System
Key Properties: Excellent adhesive for low surface energy plastics without primer.Used in potting, painting and protective coating applications.Excellent thermal and mechanical shock resistance.Ease..
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| Viscosity | 1500 cP | 1500 cP | |
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Reltek BONDiT™ B-46 Adhesive, Sealant & Coating System
Key Properties: Excellent adhesion to low surface energy plastics without primer or surface preparation.Applications: Very high flexibility, 500% elongation, emphasizing high tack for un-abraded sub..
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| Viscosity | 1500 cP | 1500 cP | |
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Reltek BONDiT™ B-52 Adhesive, Sealant & Potting System
Key Properties: Outstanding for bonding dissimilar materials with high thermal expansion differential applications.Fast thermal cure, long pot life.Ease of use.Applications: Excellent for fast assem..
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| Viscosity | 1500 cP | 1500 cP | |
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Resin Technology Group DPE111798-1 UV Curable Adhesive
Oxy-Bond and Millenium Adhesive SystemsEngineered for strength, durability, lightness, and formability, our Oxy-Bond and Millenium lines offer adhesives with physical and electrical properties to ma..
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| Viscosity | 1500 cP | 1500 cP | |
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Resinlab® CYNERGY CA6010 Adhesive
Description: The CYNERGY 6000 SERIES are for use in demanding applications where very fast cure speeds are required. These are single component solvent free materials manufactured in a wide variety..
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| Viscosity |
1500
cP @Temperature 190 °C |
1500
cP @Temperature 374 °F |
melt viscosity; ASTM D 3236 |
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REXtac Rextac® RT 1215 Amorphous Polyalphaolefin (APAO)
Laminate Grade.Description: Ethylene copolymer and FDA compliantFeatures: Good heat resistance, short open time, and excellent wetting propertiesApplications: Lamination of reinforced tapes and prot..
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| Viscosity |
1500
cP @Temperature 25.0 °C |
1500
cP @Temperature 77.0 °F |
Uncured |
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Resin Technology Group UV MX-2230 Quick Fixture, Activator Cured, One-Component, Acrylic Adhesive
UV MX 2230 is a one-component acrylate based polymer designed to be used as a quick-fixture, surface activated adhesive, (with optional UV or oven cure), for applications on a variety of substrates ..
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| Viscosity | 1500 cP | 1500 cP | "B" component |
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ACC QLE 1030 QSI Quantum Silicones 27 Durometer Addition Cure Elastomer for Coating
(discontinued **)
Part of the Amber Chemical Group. Data provided by manufacturer.Characteristics: long pot life, excellent adhesion, 100%solid, fast cure.Applications: fabric or cloth coating. Part of the Amber Chem..
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| Viscosity |
1500
-
2500
cP @Shear Rate 230 1/s, Temperature 25.0 °C |
1500
-
2500
cP @Shear Rate 230 1/s, Temperature 77.0 °F |
Haake VT 550 PK1.1° |
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Gwent Electronic Materials C2070209P5 High Brightness Phosphor Ink (Green)
This product is part of a range of Heat Curable Inks designed specifically for use in Electro Luminescent systems. These products are based on a unique curing process that results in the low tempera..
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| Viscosity |
1500
cP @Temperature 25.0 °C |
1500
cP @Temperature 77.0 °F |
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Momentive Performance Materials RTV12 Clear General Purpose Potting/Encapsulating Compound
Two-part condensation cure. Two-part condensation cure silicones RTVs are designed to cute at room temperature, and can be applied at temperature up to one inch (2.5 cm). These are very tough mate..
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| Viscosity | 1500 - 3000 cP | 1500 - 3000 cP | |
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Lucite International Colacryl ® 1205 Acrylic Solution Resin
Butyl Methacrylate polymers are more flexible and softer than Methyl Methacrylate types. The polymers are compatible with nitrocellulose, chlorinated rubber, some phenolics and maleics. Butyl methac..
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| Viscosity |
1500
-
3500
cP @Temperature 25.0 °C |
1500
-
3500
cP @Temperature 77.0 °F |
Kinematic of 5.25% solution in Toluene |
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Sibur DST-30R-01 3rd Group Styrene-Butadiene-Styrene Block Copolymer (SBS-TPE)
Kraton D 1184, 1186. As modifiers for bitumen for production of roofing materials, footwear compositions, adhesives, and coverings, as well as for modification of plastics. Addition of thermal ela..
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| Viscosity | 1500 - 2500 cP | 1500 - 2500 cP | #3 SP, 12 rpm; RP-1234 |
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Solvay MIRACARE® MS-2 Surfactant
Description: Formulated surfactant concentrate that is readily dilutable to yield ultra-mild cleansing products. Low eye and skin irritation.Chemical Name: AMPHOTERIC/ANIONIC/NONIONIC SURFACE ACTIVE..
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| Viscosity |
1500
-
1800
cP @Temperature 23.0 °C |
1500
-
1800
cP @Temperature 73.4 °F |
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Master Bond MB297FL Cyanoacrylate Adhesive System
Vibration & shock resistant, fills gap to 0.007Information provided by Master Bond Inc.
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| Viscosity | 1500 cP | 1500 cP | |
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Von Roll Isola IMI Varnish 271 Spirit Gum Varnish for Electrical Insulation
Data provided by Von Roll Isola USA.Flash Point:
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| Viscosity | 1500 cP | 1500 cP | |
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Dow Corning A Compound Antifoam
100% active silicone fluid containing a suspension of finely powdered silica to enhance its defoaming efficiency.Information provided by Dow Corning
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| Viscosity |
1500
cP @Temperature -20.0 °C |
1500
cP @Temperature -4.00 °F |
Cold Crank |
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ChevronTexaco 5R Neutral Oil
FeaturesChevron Neutral Oils are all-hydroprocessed, highly refined API Group II paraffinic base stocks. Their extremely low sulfur, nitrogen, and aromatic content give them excellent thermal and o..
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| Viscosity |
1500
cP @Temperature 25.0 °C |
1500
cP @Temperature 77.0 °F |
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Cytec (Conap) RN-1200 / EA-028 Conapoxy® Resin / Conacure® Hardener
Epoxy Potting and Encapsulating Systems for Electronic ApplicationsHigh technology epoxy resin systems for potting and encapsulation, for the defense, aerospace, electronics, computer, automotive an..
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| Viscosity |
1500
cP @Temperature 25.0 °C |
1500
cP @Temperature 77.0 °F |
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Cytec (Conap) RN-1200 / EA-87 Conapoxy® Resin / Conacure® Hardener
Epoxy Potting and Encapsulating Systems for Electronic ApplicationsHigh technology epoxy resin systems for potting and encapsulation, for the defense, aerospace, electronics, computer, automotive an..
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| Viscosity |
1500
-
2000
cP @Temperature 35.0 °C |
1500
-
2000
cP @Temperature 95.0 °F |
Dynamic viscosity |
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C.O.I.M. PLAXTER® P 30 Polymeric Plasticizer
Description: Used for the production of extruded cables where it is requested a resistance to a temperature of 105°C. Information provided by P.A.T. Products, Inc.
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| Viscosity |
1500
-
2500
cP @Temperature 35.0 °C |
1500
-
2500
cP @Temperature 95.0 °F |
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C.O.I.M. UREXTER® T 404 Polyurethane Two-Component Compound
Description: Polyester PU System for shoe sole manufacturingInformation provided by P.A.T. Products, Inc.
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| Viscosity | 1500 cP | 1500 cP | After mixing, uncured |
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Atom Adhesives AA-BOND FDA8 Epoxy Adhesive
AA-BOND FDA8 EPOXY ADHESIVE is a low viscosity epoxy resin system specifically developed for bonding and coating applications in accordance with Title 21, U.S. Code of Federal Regulations, Food and ..
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| Viscosity | 1500 cP | 1500 cP | Resin |
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ACC EP QS EPI Engineered Polymers Quick Set Epoxy
EP QS Quick Set Epoxy, “Powered by Reactamine® Technology”, is a two component 100% solids, no VOC, self-leveling modified epoxy. This versatile new generation epoxy displays low blush, fast cure..
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| Viscosity | 1500 cP | 1500 cP | Part B, RVT, #2, 20 rpm; TM R050-12 |
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Resinlab® EP1310 Medium Reactivity Epoxy Encapsulant
Resinlab™ EP1310 is a two part medium reactivity epoxy encapsulant capable of being quickly gelled prior to full cure by exposing to a UV light source. Usually 5- 10 seconds is sufficient to gel th..
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| Viscosity |
1500
cP @Temperature 190 °C |
1500
cP @Temperature 374 °F |
melt viscosity; ASTM D 3236 |
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REXtac Rextac® RT 1315 Amorphous Polyalphaolefin (APAO)
Laminate Grade.Description: Ethylene copolymer and FDA compliantFeatures: Medium open timeApplications: Lamination of reinforced tapes and protective overwrapsOther Properties: Ring and Ball Softeni..
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| Viscosity | 1500 - 3000 cP | 1500 - 3000 cP | Part B |
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Master Bond EP33LV Epoxy Has Dimensional Stability and Machinability
Description: Master Bond EP33LV is a two part, room temperature curing epoxy system used for bonding, sealing and coating featuring high temperature resistance, good dimensional stability and very g..
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