Polymer Property : Viscosity = 2000 cP Product List

Physical Properties

Tips: 30 items are displayed at most.

Physical Properties	Metric	English	Comments
Viscosity	2000 cP	2000 cP
Resin Technology Group 15 Metal Bonder Fusion™ Cyanoacrylate Instant Ethyl Adhesive Resin Technology Group 15 Metal Bonder Fusion™ Cyanoacrylate Instant Ethyl Adhesive
Viscosity	2000 - 3000 cP @Temperature 25.0 °C	2000 - 3000 cP @Temperature 77.0 °F	Uncured
Permabond UV670 UV-curable Adhesive PERMABOND UV670 is a single part, fast curing, UV curable adhesive. The cured adhesive is tough, flexible and has excellent impact resistance. Permabond UV670 is well suited for bonding glass to met..
Viscosity	2000 cP @Temperature 190 °C	2000 cP @Temperature 374 °F	melt viscosity; ASTM D 3236
REXtac Rextac® RT 1320 Amorphous Polyalphaolefin (APAO) Laminate Grade.Description: Ethylene copolymer and FDA compliantFeatures: Medium open timeApplications: LaminationOther Properties: Ring and Ball Softening Point (ASTM E 28): 138°C.Needle Penetrati..
Viscosity	2000 cP	2000 cP
NextGen Adhesives G907-08 Epoxy Adhesive Description: NGAC G907-08 is a low viscosity, electrically insulating, heat cured and 2-part adhesive systems designed for applications where temperature and chemical resistance is critical. The NGA..
Viscosity	2000 cP @Temperature 25.0 °C	2000 cP @Temperature 77.0 °F	Uncured
Permabond 798 Cyanoacrylate, Surface insensitive PERMABOND 798 is a high viscosity cyanoacrylate that combines fast cure with the ability to cure through a large gap. Plastics, Metals, Ceramics and elastomers are also rapidly bonded. The fast cu..
Viscosity	2000 - 13000 cP	2000 - 13000 cP
Huntsman Araldite XU 3909 Water-Based Adhesive/Coating Base Resin is GT 6609 (Type 9). Typical Solids Content 55%. Mean Particle Size
Viscosity	2000 cP	2000 cP
Lord Adhesives 9900 Normal Setting, High Viscosity, Odorless, Non-Frosting Methyl Cyanoacrylate Adhesive Lord Cyanoacrylate AdhesivesLordÂ® Cyanoacrylate Adhesives were developed for production situations requiring instant bonds and immediate handling strength, particularly when bonding rubber, metal..
Viscosity	2000 cP	2000 cP
Shin-Etsu Silicones KE-1204 BL Silicone, Potting/Encapsulation RTV Information Provided by Shin-Etsu Silicones of America, Inc.
Viscosity	2000 cP @Temperature 25.0 Â°C	2000 cP @Temperature 77.0 Â°F
Silikony Polskie Polsil OM 2000 Methyl Silicone Fluid The methyl silicone fluids are liquid organic silicone polymers, including inorganic elements (Si-O bond, as in quartz, glass or sand) and inorganic elements (methyl groups) in one molecule. This gi..
Viscosity	2000 - 4000 cP	2000 - 4000 cP	ASTM D803
SK Chemicals SKYTHANEÂ® U9081E Hardener Description: SK Chemicals has supplied Thermoplastic Polyurethane Elastomer (TPU) under the name of SKYTHANE. Applications include:Keyboard CoversOutsoles of Soccer ShoesWire and CableAirbagsSheets ..
Viscosity	2000 - 2300 cP @Temperature 23.0 °C	2000 - 2300 cP @Temperature 73.4 °F
Master Bond EP42LV Low Viscosity Chemically Resistant Two Component Epoxy System Master Bond Polymer System EP42LV is a low viscosity room temperature curable two component epoxy, adhesive, sealant, coating and casting material featuring outstanding chemical resistance. While EP..
Viscosity	2000 cP	2000 cP	Mixed
Tra-Con Tra-Bond 216R02 Quick Set Electrical Insulator TRA-BOND 216R02 is an exceptional epoxy formulation recommended for applications where both quick set-up and a low-viscosity material are required. This clear, two-part, low-viscosity system is easi..
Viscosity	2000 cP @Temperature 23.0 °C	2000 cP @Temperature 73.4 °F
Master Bond EP30-4 Fast Curing Non-Yellowing Two Component Epoxy System Master Bond Polymer Adhesive EP30-4 is a unique low viscosity, two component epoxy adhesive for bonding, coating, and sealing formulated to cure at room temperature or more rapidly at elevated tempe..
Viscosity	2000 - 3000 cP @Temperature 23.0 °C	2000 - 3000 cP @Temperature 73.4 °F
Master Bond EP31 High Shear and Peel Strength Room Temperature Curing Epoxy Master Bond Polymer System EP31 is a two component room temperature curing epoxy for high performance structural bonding applications featuring lap shear strengths exceeding 4600 psi. In addition, u..
Viscosity	2000 cP @Temperature 25.0 °C	2000 cP @Temperature 77.0 °F	After mixing
Tra-Con Tra-Bond 2211 High Temperature Epoxy Adhesive TRA-BOND 2211 is a low viscosity epoxy adhesive system recommended for industrial bonding applications where superior wetting and good mechanical and electrical insulation performance features are r..
Viscosity	2000 - 3000 cP @Temperature 35.0 °C	2000 - 3000 cP @Temperature 95.0 °F
C.O.I.M. UREXTER® Lp 285 Polyurethane Two-Component Compound Description: Polyester PU System for shoe sole manufacturingInformation provided by P.A.T. Products, Inc.
Viscosity	2000 cP	2000 cP	"B" component
ACC QGel 300 QSI Quantum Silicones High Strength Gel QGel 300 is a clear, very soft, tough, moderately cross-linked, silicone polymer. Silicone gels are used to provide protection from vibration, thermal or mechanical shock. Silicone gels also provide..
Viscosity	2000 cP	2000 cP	"B" component
ACC QGel 301 QSI Quantum Silicones High Strength Gel QGel 301 is a clear, very soft, tough, moderately cross-linked, silicone polymer. Silicone gels are used to provide protection from vibration, thermal or mechanical shock. Silicone gels also provide..
Viscosity	2000 cP	2000 cP	"B" component
ACC QLE 1101 QSI Quantum Silicones Specialty Silicone Coating QLE 1101 is a low viscosity, two-component, addition cure, silicone elastomer.Key Features: Fast cure at elevated temperaturesLow linear shrinkageTransparent, ideal for pigmentationLow viscosity Par..
Viscosity	2000 cP	2000 cP
3M Scotch-Weld™ CA5 Instant Adhesive 3M™ Scotch-Weld™ Instant Adhesives are single component, high strength cyanoacrylate adhesives. Higher viscosity, slower setting version of CA4 for filling gaps. Meets CID A-A-3097, Type II, Clas..
Viscosity	2000 - 5000 cP	2000 - 5000 cP
Beijing Ranger Chem SM-634X85 Solvent Based Epoxy Resin Information provided by Beijing Ranger Chemical Co.
Viscosity	2000 cP	2000 cP
Abatron AboCast 8502-7/AboCure 8502-7 Colorless, Low-Exotherm Epoxy Casting Compound AboCast 8502-7/AboCure 8502-7 is a rigid, heat cured, colorless, low-exotherm epoxy casting compound for larger masses. It is a 2-component structural and dielectric liquid system with extremely low..
Viscosity	2000 cP	2000 cP	Part B, RVT, #3, 20 rpm; TM R050-12
Resinlab® EP1282 Clear Unfilled Electronic Grade Epoxy Encapsulant Resinlab™ EP1282 Clear is a two part unfilled electronic grade epoxy encapsulant designed for medium sized castings. It is recognized under the Component Recognition Program of Underwriters Laborat..
Viscosity	2000 cP	2000 cP
Resinlab® RC8035 Anaerobic Retaining Compound The RC 8000 Series anaerobic retaining compounds are designed for use in demanding applications to fill the spaces and surface irregularities between tightly mated cylindrical parts. These products ..
Viscosity	2000 cP	2000 cP	Mixed; TM R050-12
Resinlab® UR3001HP Clear Urethane Encapsulant Resinlab™ UR3001HP Clear is a clear, two component, room temperature curing urethane encapsulating system. It is designed to cure completely at room temperature. UR3001HP Clear provides excellent e..
Viscosity	2000 cP	2000 cP	Part B, RVT, #5, 20 rpm; TM R050-12
Resinlab® EP1121 Black Electronic Grade Epoxy Encapsulant Resinlab™ EP1121 Black is a two part unfilled electronic grade epoxy encapsulant designed for small to medium sized castings. It cures completely at room temperature to a tough, flexible polymer. I..