Polymer Property : Viscosity = 2000 cP Product List

Physical Properties

Tips: 30 items are displayed at most.

Physical Properties	Metric	English	Comments
Viscosity	2000 cP	2000 cP
NextGen Adhesives P907-03 Fiber Optic Adhesive Description: NGAC P907-03 is a low viscosity and room temperature curing adhesive specifically formulated for fiber optic terminations.Advantages and Applications: Uses include the termination of si..
Viscosity	2000 cP	2000 cP
NextGen Adhesives P907-12 Fiber Optic Adhesive Description: NGAC P907-12 is a rapid curing, low viscosity, heat cured epoxy adhesive system that is specifically formulated for use in the fiber optic industry.Advantages and Applications: Uses inc..
Viscosity	2000 cP @Temperature 25.0 °C	2000 cP @Temperature 77.0 °F	Uncured
Permabond HM161 Anaerobic Retaining Compound Permabond® HM161 is a single component liquid that cures only when in contact with metal parts and oxygen is excluded. The liquid adhesive fills the “air space’ between parts and upon cure unitiz..
Viscosity	2000 cP @Temperature 25.0 °C	2000 cP @Temperature 77.0 °F	Uncured
Permabond LM012 Anaerobic Threadsealant Permabond® LM012 is an unfilled, medium viscosity anaerobic adhesive. Its major benefit as related to other pipe sealants is that it is an unfilled resin that is compatible with hydraulic fluids. I..
Viscosity	2000 cP	2000 cP
Resinlab® CYNERGY CA6105 Adhesive Description: The CYNERGY 6100 SERIES products are used to bond metal to itself or other substrates. It is available in five standard viscosities.Application: The CYNERGY SERIES of the cyanoacrylates..
Viscosity	2000 - 3000 cP @Temperature 25.0 °C	2000 - 3000 cP @Temperature 77.0 °F	Uncured
Permabond UV620 UV-curable Adhesive PERMABOND UV620 is a single part, fast curing, UV curable adhesive. Its excellent optical clarity and resistance to yellowing make it ideal for bonding glass and crystal for a high quality finish. I..
Viscosity	2000 cP	2000 cP	Part B, RVT, #5, 20 rpm; TM R050-12
Resinlab® EP965LVLX Black Unfilled Electronic Grade Epoxy Encapsulant Resinlab™ EP965LVLX Black is a two part unfilled electronic grade epoxy encapsulant designed for small to medium sized castings. It cures at room temperature to a tough, semi-rigid polymer. It has ..
Viscosity	2000 cP @Temperature 121 °C	2000 cP @Temperature 250 °F	melt viscosity; ASTM D-3236
ExxonMobil Escorene® UL-7750 EVA Copolymer, Adhesive and Sealant Grade  (discontinued **) Data provided by the manufacturer, Exxon Chemical.A 28% vinyl acetate copolymerApplications: Hot melt adhesives; Wax blends; Industrial sealants.
Viscosity	2000 cP	2000 cP
Resinlab® CYNERGY CA6811 Adhesive Description: The CYNERGY 6800 SERIES are clear, high strength products ideal for bonding dissimilar materials with excellent performance on a wide range of surfaces. This series of products has USP ..
Viscosity	2000 - 8000 cP	2000 - 8000 cP
Huntsman Kerimid 701 A US Resin Comments/Applications: Used with Kerimid 701-1 B US for high Tg laminate systems. Suggested ratio 3 parts A to 1 part B.Data provided by Ciba Specialty Chemicals.Ciba Specialty Chemicals has been a..
Viscosity	2000 - 3000 cP	2000 - 3000 cP	25% Toluene Solution at 25Â°C; KM 06
KratonÂ® D1116 E (SBS) Radial Triblock Copolymer Description: Kraton D1116 E is a clear, radial triblock copolymer based on styrene and butadiene with a polystyrene content of 23%. It is supplied from Europe in the physical form identified: Kraton..
Viscosity	2000 - 5000 cP	2000 - 5000 cP	20% Viscosity, 1-2% NaCl
Solvay MACKADETÂ® DR-100M Surfactant Product Description: MackadetÂ® DR-100M is a concentrated blend of surfactants, which simply requires dilution and the addition of minor additives to produce a ready to package high foaming produc..
Viscosity	2000 - 4000 cP	2000 - 4000 cP	ASTM D803
SK Chemicals SKYTHANEÂ® U9081E Hardener Description: SK Chemicals has supplied Thermoplastic Polyurethane Elastomer (TPU) under the name of SKYTHANE. Applications include:Keyboard CoversOutsoles of Soccer ShoesWire and CableAirbagsSheets ..
Viscosity	2000 cP @Temperature 25.0 °C	2000 cP @Temperature 77.0 °F	Mixed (sp #7, 10 rpm)
Tra-Con Tra-Bond F123LV Color Keyed High Temperature Epoxy Adhesive TRA-BOND F123LV is a fast cure, low viscosity, two-component epoxy formulation that signals both proper mixing and curing when bonding fiber optic bundles, potting glass fibers, and/or terminating s..
Viscosity	2000 cP @Temperature 25.0 °C	2000 cP @Temperature 77.0 °F	After mixing
Tra-Con Tra-Bond F123NC High Temperature Fiber Optic Epoxy Adhesive TRA-BOND F123 NC is a fast cure, low viscosity, two-component epoxy formulation for bonding fiber optic bundles, potting glass fibers, and/or terminating single or multi-channel fiber optic connecto..
Viscosity	2000 cP @Temperature 23.9 °C	2000 cP @Temperature 75.0 °F
TSE Industries EcoSPRAY® SS100 Aliphatic Polyurethane Resin TSE-EcoSPRAY® SS100 is an “Environmentally-Preferred Product” or EPP. It is an Aliphatic polyurethane resin free of Styrene, and is an “ultra-low” emitting resin during application. TSE-EcoSPRA..
Viscosity	2000 - 10000 cP	2000 - 10000 cP	Unmilled Cement; Zeon Test #328
Zeon Chemicals Nipol® 1442 Nitrile Powder and Crumb Elastomer Nipol 1442 is a copolymer of butadiene and acrylonitrile with medium-high acrylonitrile content. Nipol 1442 shall be in the form of nominal 1/4" three-dimensional chips containing approximately 5%mi..
Viscosity	2000 - 4100 cP @Temperature 23.0 °C	2000 - 4100 cP @Temperature 73.4 °F	100 rpm
Epoxy Technology EPO-TEK® E3001 Electrically Conductive, Silver Epoxy Product Description: EPO-TEK® E3001-HV is a snap cure, single component, silver-filled die attach adhesive for semiconductor plastic IC packaging. Also available in a frozen syringe. Advantages & ..
Viscosity	2000 - 4000 cP @Temperature 23.0 °C	2000 - 4000 cP @Temperature 73.4 °F	100 rpm
Epoxy Technology EPO-TEK® EE149-6 Epoxy Material Description: A single component, silver-filled, B-stageable epoxy designed for semiconductor flip chip packaging or hybrid micro-electronic substrate attach or lid-sealing.Information Provi..
Viscosity	2000 cP @Temperature 177 °C	2000 cP @Temperature 350 °F	Typical
Bostik 6332 Quick Setup EVA Glue Stick Bostik 6332 Quick Setup EVA Glue StickShort open time and quick set up. Low viscosity. Easy to gun. Withstands elevated temperatures.
Viscosity	2000 cP	2000 cP	"B" component
ACC QGel 301 QSI Quantum Silicones High Strength Gel QGel 301 is a clear, very soft, tough, moderately cross-linked, silicone polymer. Silicone gels are used to provide protection from vibration, thermal or mechanical shock. Silicone gels also provide..
Viscosity	2000 cP	2000 cP
3M Scotch-Weld™ CA5 Instant Adhesive 3M™ Scotch-Weld™ Instant Adhesives are single component, high strength cyanoacrylate adhesives. Higher viscosity, slower setting version of CA4 for filling gaps. Meets CID A-A-3097, Type II, Clas..
Viscosity	2000 - 3000 cP	2000 - 3000 cP
3M Pronto™ CA-5 Instant Adhesive One-part, room-temperature curing adhesive that is ready-to-use without metering or mixing. Bonded parts reach handling strength in 5-10 seconds on many applications.A high viscosity, slower settin..
Viscosity	2000 - 2500 cP	2000 - 2500 cP	Brooksfield LV Viscometer
Aremco Cerama-Dip™ 538-N-BLK High Temperature Specialty Ceramic-Inorganic Coating Low viscosity, light gray coating for powder resistors and rheostats to 2600°F (1427°C). black and green pigments also available.
Viscosity	2000 cP	2000 cP	Uncatalyzed, QM 262F B
ACC QM 262F QSI Quantum Silicones 60 Durometer Addition Cure Moldmaking Material QM 262F is a two component, room temperature addition cure silicone material. The cured rubber has excellent mechanical properties, good shelf-life stability, excellent physical properties and resin..
Viscosity	2000 cP	2000 cP	Part B, RVT, #5, 20 rpm; TM R050-12
Resinlab® EP965LVLX Clear Unfilled Electronic Grade Epoxy Encapsulant Resinlab™ EP965LVLX Clear is a two part unfilled electronic grade epoxy encapsulant designed for small to medium sized castings. It cures at room temperature to a tough, semi-rigid polymer. It has ..