Polymer Property : Viscosity = 25000 cP Product List

Physical Properties

Tips: 30 items are displayed at most.

Physical Properties	Metric	English	Comments
Viscosity	25000 - 45000 cP <br>@Temperature 25.0 °C	25000 - 45000 cP <br>@Temperature 77.0 °F
Nanocyl EPOCYL™ NC E128-04 Master Batch Liquid Bisphenol-A Resin for Solvent Based Formulation Purposes EPOCYL™ NC E128-04 is a Mater Batch based on liquid Bisphenol-A (Bis-A) epoxy resin containing high concentration of Carbon Nanotubes (CNT) produced by Nanocyl. It is specifically developed for so..
Viscosity	25000 - 45000 cP <br>@Temperature 25.0 °C	25000 - 45000 cP <br>@Temperature 77.0 °F
Nanocyl EPOCYL™ NC R128-04 Master Batch Liquid Bisphenol-A Resin for Solvent Based Formulation Purposes: Dilution Factor 6 EPOCYL™ NC R128-04 is a Master Batch based on liquid Bisphenol-A (Bis-A) epoxy resin containing high concentration of Carbon Nanotubes (CNT) produced by Nanocyl, with a suggested dilution factor of..
Viscosity	25000 cP	25000 cP	Base
ACC Stretch Effect QSI Quantum Silicones Stretch Effect 22 Durometer Addition Cure Translucent Moldmaking Material &amp Part of the Amber Chemical Group. Data provided by manufacturer.Characteristics: low viscosity, fast demold time, high elongation, excellent flexibility. Applications: special effects, skin replicat..
Viscosity	25000 - 75000 cP	25000 - 75000 cP
Lord Adhesives 521 Medium Viscosity, Slow Cure Acrylic Adhesive Lord 500 SeriesLord 500 Series Acrylic Adhesives bond plastics and prepared metals; they offer excellent adhesion to both thermoplastics and thermoset plastics. They are available with varying handi..
Viscosity	25000 - 40000 cP <br>@Shear Rate 230 1/s,<br> Temperature 25.0 Â°C	25000 - 40000 cP <br>@Shear Rate 230 1/s,<br> Temperature 77.0 Â°F	Haake VT 550 PK1.1Â°
Gwent Electronic Materials C2090428D4 Gold Ink Gold Ink is a fritted system that has been designed as a screen printing ink for uses on Alumina. It is also suitable for firing onto other high temperature substrates. This product should be used ..
Viscosity	25000 cP	25000 cP
Momentive Performance Materials RTV116 One Component Acetoxy Adhesive Sealant, Red RTV series one-component, ready-to-use adhesive sealants are extremely versatile. They cure to a tough, durable, resilient silicone rubber on exposure to atmospheric moisture at room temperature. ..
Viscosity	25000 cP <br>@Temperature 25.0 Â°C	25000 cP <br>@Temperature 77.0 Â°F
Momentive Performance Materials RTV31 Red Extreme High Temperature Potting/Encapsulating Compound Two-part condensation cure. Two-part condensation cure silicones RTVs are designed to cute at room temperature, and can be applied at temperature up to one inch (2.5 cm). These are very tough mate..
Viscosity	25000 cP	25000 cP
Momentive Performance Materials RTV31 Silicone Rubber Compound for High Temperature, Red RTV31, RTV60 and RTV88 silicone rubber compounds are high temperature two-part silicone elastomers. They are supplied ready-to-use with a base compound and DEBT (deputy tin deflagrate) as the standa..
Viscosity	25000 - 40000 cP <br>@Temperature 40.0 Â°C	25000 - 40000 cP <br>@Temperature 104 Â°F
Taiwan PU Corporation PPG CPU-2172 Polyurethane Casting Elastomer A urethane elastomer that can be cured by reacting with a polyamine or a polyolhardener. The molding process is composed of pre-heating, degassing, maxing with a hardener, pouring into the mold, cu..
Viscosity	25000 - 60000 cP	25000 - 60000 cP	Mixed, thixotropic
Master Bond EP112FLAO-1 Toughened, Two component, Heat Curing Epoxy Master Bond EP112FLAO-1 is a toughened two component, high performance epoxy resin system featuring very good temperature resistance, fine thermal conductivity and electrical insulation values with ..
Viscosity	25000 - 30000 cP <br>@Temperature 23.0 °C	25000 - 30000 cP <br>@Temperature 73.4 °F
Master Bond EP21FRSPLV Flame Resistant Two Component Epoxy Master Bond Polymer System EP21FRSPLV is a two component, room temperature curable, flame resistant compound for potting, encapsulating and casting. EP21FRSPLV has a one to one mix ratio, by weight...
Viscosity	25000 - 45000 cP	25000 - 45000 cP
Master Bond MasterSil 708FR One Part, Flame Resistant Silicone Description: MasterSil 708FR is a one component, high performance RTV silicone that is mainly used for its flame retardancy. It is UL listed with a flame classification for 94V.1 for thicknesses of ..
Viscosity	25000 - 40000 cP	25000 - 40000 cP	Part A
Master Bond EP30QF Quartz Filled, Two Component Epoxy System Master Bond Polymer System EP30QF is a quartz filled, two component epoxy for high performance bonding, sealing, coating and casting that is formulated to cure at room temperature or more rapidly at..
Viscosity	25000 cP	25000 cP
Valley Adhesives EM-115 High Performance Application Glue Stick Valley Adhesives EM-115 High Performance Application Glue StickHigh peel, shear strength, and heat resistance; Good wetting and heat resistance for potting; Excellent adhesion to wood, plastics, pol..
Viscosity	25000 cP <br>@Temperature 25.0 °C	25000 cP <br>@Temperature 77.0 °F	Mixed
Trelleborg Emerson & Cuming Eccobond® 15 Clear Variable Hardness Catalyst Emerson & Cuming 15 Clear Eccobond® Variable Hardness CatalystEasy-to-use, simple mix ratios. Hardness of cured castings can be controlled by the amount of hardener used. Long working life. Yields ..
Viscosity	25000 cP <br>@Temperature 25.0 °C	25000 cP <br>@Temperature 77.0 °F	Mixed
Trelleborg Emerson & Cuming Eccobond® 45LV Two-Component General Purpose Epoxy Adhesive Emerson & Cuming 45LV Eccobond® Two-Component General Purpose Epoxy AdhesiveLow viscosity, filled, general purpose, room temperature curing, epoxy adhesive and sealant. Flexibility can be adjusted ..
Viscosity	25000 - 45000 cP <br>@Temperature 23.0 °C	25000 - 45000 cP <br>@Temperature 73.4 °F	1 rpm
Epoxy Technology EPO-TEK® EJ2189-LV Electrically Conductive Epoxy Low Viscosity, two component room temp curing conductive epoxyInformation Provided by Epoxy Technology
Viscosity	25000 cP	25000 cP
Cotronics Duralco™ 122 500°F (260°C) Nickel Filled Adhesive and Casting Epoxy Specially formulated to provide an economical alternative to silver filled electrically conductive epoxies. Applications: for use in applications where highest electrically conductivity not required..
Viscosity	25000 cP	25000 cP	Thixotropic Gel
Dymax 9-20512 Voil Coil Assembly Disk Drive Adhesive Disk Drive AdhesivesLow Outgassing Multi-Cure® Memory Saver Disk Drive AdhesivesDescriptionDymax offers a range of advanced formula epoxy and acrylic adhesives for disk drive assembly. UV cures in ..
Viscosity	25000 cP	25000 cP	Mixed
Armstrong C-7/W Epoxy Adhesive, 2:3 Mix Ratio A clear, unfilled, medium viscosity adhesive recommended for use with any Armstrong Activator. Physical property data included covers C-7 used with Activators W and H-20. All other Activators may ..
Viscosity	25000 cP	25000 cP
ACC MM928 Condensation Cure 2-Part Molding Rubber Part of the Amber Chemical Group. Data provided by manufacturer.Characteristics: high tear strength, picks up extremely fine details, low viscosity, good resistance to styrene attack, easy degassing..
Viscosity	25000 cP	25000 cP	"A" component
ACC QLE 1031 QSI Quantum Silicones 25 Durometer Addition Cure Elastomer for Coating QLE 1031 is a 100% silicone solids elastomer designed for fabric or cloth coating applications. This two-component system offers a tough coating with excellent adhesion and fast cure.Key Features: ..
Viscosity	25000 cP	25000 cP	Base
ACC QM 122 QSI Quantum Silicones 22 Durometer Condensation Cured Moldmaking Material QM 122 is a two-component, room temperature condensation cure silicone material. The cured rubber is flexible with excellent mechanical and physical properties in addition to good shelf-life stabili..
Viscosity	25000 cP	25000 cP	Accelerator
3M Scotch-Weld™ DP8805NS Low Odor Acrylic Adhesives 3M™ Scotch-Weld™ Low Odor Acrylic Adhesives are high performance, two-part acrylic adhesives with lower odor than most acrylic adhesives. These toughened products offer excellent shear, peel, and ..
Viscosity	25000 cP	25000 cP
Aremco Ceramacast™ 900 High Temperature Potting & Casting Material Zirconia Silicate High Density, high strength molding compound.
Viscosity	25000 cP	25000 cP	Spindle #5; 10 rpm; ASTM D1824
Aptek 6500-PMF Electrically conductive epoxy adhesive High purity, low outgassing, electrically conductive adhesiveAPTEK 6500-PMF is a one component, pre-mixed frozen, 100% solid, silver-filled epoxy adhesive specifically designed for microelectronic d..
Viscosity	25000 cP	25000 cP
Dymax 9-3095-Gel Strain Relief, Wire and Parts Tacking Adhesive High Performance Light-Curing Adhesives and Coatings for Electronic AssemblyDymax 9-3095-Gel Strain Relief, Wire and Parts Tacking AdhesiveFor fastest curing, cure with UV and visible light Cure Typ..