Polymer Property : Viscosity = 50000 cP Product List

Physical Properties

Tips: 30 items are displayed at most.

Physical Properties	Metric	English	Comments
Viscosity	50000 - 75000 cP	50000 - 75000 cP
Huntsman HY 815 US Polyamide Approx. H+ equivalent weight 150. Mix Ratio with GY 6010 is 81.Comments/Applications: Solvent free, high molecular weight, low amine content. Superior adhesion, easily pigmented. Trade sale pain..
Viscosity	50000 - 70000 cP	50000 - 70000 cP	B
ITW Plexus Plexusâ„¢ AO420 Methacrylate Adhesive Two-part adhesive designed for structural bonding of thermoplastic, metal, and composite assemblies.All purpose adhesive , high toughness.Information provided by Illinois Tool Works.
Viscosity	50000 - 70000 cP	50000 - 70000 cP	B
ITW Plexus Plexusâ„¢ MA1023 Methacrylate Adhesive Two-part adhesive designed for structural bonding of thermoplastic, metal, and composite assemblies.Low shrinkage, low odor, all purpose.Information provided by Illinois Tool Works.
Viscosity	50000 - 80000 cP	50000 - 80000 cP	B
ITW Plexus Plexusâ„¢ MA420FS Methacrylate Adhesive Two-part adhesive designed for structural bonding of thermoplastic, metal, and composite assemblies.All purpose adhesive, very fast curing.Information provided by Illinois Tool Works.
Viscosity	50000 - 80000 cP	50000 - 80000 cP	B
ITW Plexus Plexusâ„¢ MA820 Methacrylate Adhesive Two-part adhesive designed for structural bonding of thermoplastic, metal, and composite assemblies.Excellent for structural bonding of surface metals with no surface preparation.Information provide..
Viscosity	50000 - 75000 cP	50000 - 75000 cP	B
ITW Plexus Plexusâ„¢ MA821 Methacrylate Adhesive Two-part adhesive designed for structural bonding of thermoplastic, metal, and composite assemblies.Designed for structural bonding of metals without primers.Information provided by Illinois Tool Wo..
Viscosity	50000 cP @Temperature 23.0 Â°C	50000 cP @Temperature 73.4 Â°F
Momentive Performance Materials TSE397 One Component RTV Adhesive Sealant/Coating, Clear/White TSE392, TSE397 and TSE399 adhesive sealants/coatings are one component RTVâ€™s that cure quickly by reacting with atmospheric moisture forming a soft dielectric silicone rubber. These materials i..
Viscosity	50000 cP @Temperature 25.0 Â°C	50000 cP @Temperature 77.0 Â°F	Dynamic
Struktol POLYDIS 3605 Elastomer modified epoxy prepolymer Applications: STRUKTOL VP 3605 is used where conventional epoxy systems and prepolymers are unable to satisfy the demands of for example impact, flexural and peel strength. A higher compatibility ca..
Viscosity	50000 - 110000 cP	50000 - 110000 cP	Part B
Master Bond EP21ANHT Two Component, Room Temperature Curing Epoxy Adhesive Product Description: Master Bond Polymer Adhesive EP21ANHT is a two component room temperature curing adhesive, sealant and coating that combines high thermal conductivity and electrical insulation ..
Viscosity	50000 cP	50000 cP	available as EP21TP
Master Bond EP21TPND Two Component Polysulfide Epoxy Adhesive Master Bond Polymer Adhesive EP21TPND is a two component polysulfide epoxy based adhesive / sealant formulated to cure at room temperature or more rapidly at elevated temperatures. Master Bond Pol..
Viscosity	50000 - 60000 cP @Temperature 23.0 °C	50000 - 60000 cP @Temperature 73.4 °F
Master Bond EP24 Fast Curing Two Component Epoxy System Master Bond Polymer Adhesive EP24 is a fast curing two component epoxy adhesive for general purpose bonding, sealing, and coating formulated to cure at room temperature with a one-to-one mix ratio, ..
Viscosity	50000 - 60000 cP	50000 - 60000 cP
Master Bond EP45HTMED Epoxy Resists Radiation and Steam Sterilization Description: Master Bond Polymer System EP45HTMED is a two component heat cured epoxy system for high performance structural bonding, sealing, coating and casting. It is especially designed for the ..
Viscosity	50000 cP @Temperature 25.0 °C	50000 cP @Temperature 77.0 °F	Mixed (cp #51, 5 rpm)
Tra-Con Tra-Bond 933-2 Moisture Resistant Chip Encapsulant TRA-BOND 933-2 one component, highly filled, electrically insulating epoxy encapsulant is designed for encapsulating microelectronic chips. This epoxy provides excellent environmental and mechanical..
Viscosity	50000 cP @Temperature 25.0 °C	50000 cP @Temperature 77.0 °F	After mixing
Tra-Con Tra-Bond F156 Optically Opaque Epoxy Adhesive TRA-BOND F156 is a black, solvent-free thixotropic epoxy system recommended for high quality photographic industry bonding, laminating, production and repair applications where a room-temperature cu..
Viscosity	50000 - 70000 cP	50000 - 70000 cP	uncured coating
Master Bond UV15DC80 One Component, UV and Heat Curable Epoxy System Master Bond UV15DC80 is a special dual cure epoxy based system which offers a primary cure utilizing UV light along with a secondary heat curing mechanism. This system addresses the problem of curin..
Viscosity	50000 - 60000 cP @Temperature 23.0 °C	50000 - 60000 cP @Temperature 73.4 °F	5 rpm
Epoxy Technology EPO-TEK® E4110-PFC Electrically Conductive Epoxy Product Description: EPO-TEK®E4110-PFC is a two-component, silver filled, electrically conductive adhesive designed for semiconductor IC packaging and general electronic assembly. It is a thixotr..
Viscosity	50000 cP	50000 cP
ACC MM940 Condensation Cure 2-Part Molding Rubber Part of the Amber Chemical Group. Data provided by manufacturer.Characteristics: high tear strength, picks up extremely fine details, low viscosity, good resistance to styrene attack, easy degassing..
Viscosity	50000 cP	50000 cP	Base
ACC QM Skin 30 QSI Quantum Silicones 30 Durometer Condensation Cure moldmaking Material QM Skin 30 is a two-component, room temperature condensation cure silicone material. The cured rubber is very soft, has excellent mechanical properties and very low bleed in addition to good shelf-l..
Viscosity	50000 cP	50000 cP	After mixing, uncured
Atom Adhesives AA-BOND F156 Epoxy Adhesive AA-BOND F156 is a black, solvent free thixotropic epoxy recommended for high quality photographic industry, laminating, production and repair applications where a room temperature cure optically opa..
Viscosity	50000 - 90000 cP	50000 - 90000 cP
Aremco Ceramabond™ 503 High Temperature Ceramic Adhesive/Paste, Alumina Filled Aremco's ceramic adhesives are easy to use, one- and two-component systems which air dry in 1-2 hrs and are ready for use following a 200 to 700 °F cure. These materials are mostly water-based and..
Viscosity	50000 cP	50000 cP	Part A, RVT, #7, 2.5 rpm; TM R050-12
Resinlab® EP1290 Gray Mineral Filled Epoxy Adhesive Resinlab™ EP1290 Gray is a two part mineral filled epoxy adhesive designed for bonding metals and plastics. It cures at room temperature to a tough, semi-flexible material. It has good wetting to m..
Viscosity	50000 cP	50000 cP	Mixed; TM R050-12
Resinlab® EP1115 Clear Unfilled Epoxy Adhesive Resinlab™ EP1115 Clear is a two part unfilled epoxy adhesive designed for bonding of metals, ceramics and most plastics. This product gives good resistance to water, salt spray, inorganic acids and..