Polymer Property : Viscosity = 50000 cP Product List

Physical Properties

Tips: 30 items are displayed at most.

Physical Properties	Metric	English	Comments
Viscosity	50000 cP	50000 cP
Resin Technology Group 119-EX Oxy-Bond™ Two-Component Epoxy Adhesive Oxy-Bond and Millenium Adhesive SystemsEngineered for strength, durability, lightness, and formability, our Oxy-Bond and Millenium lines offer adhesives with physical and electrical properties to ma..
Viscosity	50000 - 100000 cP @Temperature 25.0 °C	50000 - 100000 cP @Temperature 77.0 °F
Northstar Polymers MPC-070 Prepolymer Information provided by Northstar Polymers.
Viscosity	50000 - 75000 cP	50000 - 75000 cP
Huntsman HY 815 US Polyamide Approx. H+ equivalent weight 150. Mix Ratio with GY 6010 is 81.Comments/Applications: Solvent free, high molecular weight, low amine content. Superior adhesion, easily pigmented. Trade sale pain..
Viscosity	50000 - 70000 cP	50000 - 70000 cP	B
ITW Plexus Plexusâ„¢ AO420 Methacrylate Adhesive Two-part adhesive designed for structural bonding of thermoplastic, metal, and composite assemblies.All purpose adhesive , high toughness.Information provided by Illinois Tool Works.
Viscosity	50000 - 70000 cP	50000 - 70000 cP	B
ITW Plexus Plexusâ„¢ MA1020 Methacrylate Adhesive Two-part adhesive designed for structural bonding of thermoplastic, metal, and composite assemblies.Low shrinkage, low odor, all purpose.Information provided by Illinois Tool Works.
Viscosity	50000 - 70000 cP	50000 - 70000 cP	B
ITW Plexus Plexusâ„¢ MA1023 Methacrylate Adhesive Two-part adhesive designed for structural bonding of thermoplastic, metal, and composite assemblies.Low shrinkage, low odor, all purpose.Information provided by Illinois Tool Works.
Viscosity	50000 - 80000 cP	50000 - 80000 cP	B
ITW Plexus Plexusâ„¢ MA820 Methacrylate Adhesive Two-part adhesive designed for structural bonding of thermoplastic, metal, and composite assemblies.Excellent for structural bonding of surface metals with no surface preparation.Information provide..
Viscosity	50000 - 75000 cP	50000 - 75000 cP	B
ITW Plexus Plexusâ„¢ MA821 Methacrylate Adhesive Two-part adhesive designed for structural bonding of thermoplastic, metal, and composite assemblies.Designed for structural bonding of metals without primers.Information provided by Illinois Tool Wo..
Viscosity	50000 - 80000 cP	50000 - 80000 cP	B
ITW Plexus Plexusâ„¢ MA822 Methacrylate Adhesive Two-part adhesive designed for structural bonding of thermoplastic, metal, and composite assemblies.Designed for structural bonding of metals without primers.Information provided by Illinois Tool Wo..
Viscosity	50000 cP	50000 cP	Before Curing
Silikony Polskie Polastosil M-33 Silicone Rubber Medium hard with good tearing resistance
Viscosity	50000 - 60000 cP @Temperature 23.0 °C	50000 - 60000 cP @Temperature 73.4 °F
Master Bond EP21 Room Temperature Curing Epoxy System Room temperature curing epoxy adhesive Master Bond EP21 has outstanding physical properties and durability. Its variable mix ratio feature allows you to adjust the type of cure to get either a more ..
Viscosity	50000 - 65000 cP	50000 - 65000 cP	Part B
Master Bond EP21AOLV-1 Two Part, Room Temperature Curing Epoxy System Product Description: Master Bond Polymer Adhesive EP21AOLV-1 is a two component, thermally conductive, electrically isolating epoxy adhesive, sealant and coating. This versatile system will adhere t..
Viscosity	50000 - 60000 cP @Temperature 23.0 °C	50000 - 60000 cP @Temperature 73.4 °F
Master Bond EP24 Fast Curing Two Component Epoxy System Master Bond Polymer Adhesive EP24 is a fast curing two component epoxy adhesive for general purpose bonding, sealing, and coating formulated to cure at room temperature with a one-to-one mix ratio, ..
Viscosity	50000 cP @Temperature 25.0 °C	50000 cP @Temperature 77.0 °F	Mixed (cp #51, 5 rpm)
Tra-Con Tra-Bond 933-2 Moisture Resistant Chip Encapsulant TRA-BOND 933-2 one component, highly filled, electrically insulating epoxy encapsulant is designed for encapsulating microelectronic chips. This epoxy provides excellent environmental and mechanical..
Viscosity	50000 cP	50000 cP	Haake cone and plate rheometer @ 5/sec (35mm/2° cone)
Loctite® 3533 Low viscosity fill encapsulant Fill Encapsulant COB/DCA Encapsulants are essential to the reliability of flip chip assemblies because they minimize the thermal mismatch between the flip chip and substrate.Loctite® Underfills and Encapsulants imp..
Viscosity	50000 - 70000 cP	50000 - 70000 cP	uncured coating
Master Bond UV15DC80 One Component, UV and Heat Curable Epoxy System Master Bond UV15DC80 is a special dual cure epoxy based system which offers a primary cure utilizing UV light along with a secondary heat curing mechanism. This system addresses the problem of curin..
Viscosity	50000 cP	50000 cP
Cotronics Duralco™ 4703 Adhesive and Tooling Compound High temperature resin reinforced with ceramic and metallic fibers and particles, resulting in high thermal stability. Easily machined to close tolerances and will repair and rebuild worn or cracke..
Viscosity	50000 cP	50000 cP
Cotronics Duralco™ 127 400°F (200°C) Graphite Filled Epoxy One component, graphite filled epoxy for low cost production applications. Can be used with automatic dispensing equipment.
Viscosity	50000 cP	50000 cP
ACC MM940 Condensation Cure 2-Part Molding Rubber Part of the Amber Chemical Group. Data provided by manufacturer.Characteristics: high tear strength, picks up extremely fine details, low viscosity, good resistance to styrene attack, easy degassing..
Viscosity	50000 cP	50000 cP	"A" component
ACC QLE 1020 QSI Quantum Silicones 45 Durometer Clear, Addition Cure Elastomer for Coating QLE 1020 is a 100% silicone solids elastomer designed for fabric or cloth coating applications. This two-component system offers a tough coating with excellent adhesion and fast cure.Key Features: ..
Viscosity	50000 cP	50000 cP	Base
ACC QM 245 QSI Quantum Silicones 45 Durometer Addition Cure Moldmaking Material QM 245 is a two component, room temperature addition cure silicone material. The cured rubber has excellent mechanical properties and good shelf-life stability. This material is a good choice for th..
Viscosity	50000 cP	50000 cP	After mixing, uncured
Atom Adhesives AA-BOND F156 Epoxy Adhesive AA-BOND F156 is a black, solvent free thixotropic epoxy recommended for high quality photographic industry, laminating, production and repair applications where a room temperature cure optically opa..
Viscosity	50000 cP	50000 cP
ACC QMSkin 30 Specialist Molding 2-Part Condensation Cure Part of the Amber Chemical Group. Data provided by manufacturer.
Viscosity	50000 cP	50000 cP	Part A, RVT, #7, 2.5 rpm; TM R050-12
Resinlab® EP1290 Gray Mineral Filled Epoxy Adhesive Resinlab™ EP1290 Gray is a two part mineral filled epoxy adhesive designed for bonding metals and plastics. It cures at room temperature to a tough, semi-flexible material. It has good wetting to m..