Polymer Property : Viscosity = 80000 cP Product List

Physical Properties

Tips: 30 items are displayed at most.

Physical Properties	Metric	English	Comments
Viscosity	80000 cP	80000 cP	Part B, Spindle TD, 2.5 rpm; Uncured
Resinlab® AR 4340 HP Metal Bonding Methacrylate Adhesive Resinlab™ AR 4340 HP is a 1:1 mix methacrylate-based structural adhesive designed for general purpose bonding of a wide variety of materials in industrial applications. It is an accelerated version..
Viscosity	80000 cP	80000 cP	Mixed Viscosity
ITW Devcon 10 minuteâ„¢ Epoxy, Clear Information provided by ITW Devcon
Viscosity	80000 - 110000 cP	80000 - 110000 cP	A
ITW Plexus Plexusâ„¢ MA822 Methacrylate Adhesive Two-part adhesive designed for structural bonding of thermoplastic, metal, and composite assemblies.Designed for structural bonding of metals without primers.Information provided by Illinois Tool Wo..
Viscosity	80000 cP	80000 cP
Momentive Performance Materials TSE3261-G Heat Resistant Silicone Adhesive TSE3261-G is a one-component heat curable silicone adhesive designed for high temperature applications. TSE3261-G adheres well to a variety of substrates such as metals, plastics, ceramics and glas..
Viscosity	80000 cP	80000 cP
Shin-Etsu Silicones KE-1311T Silicone, Mold Making RTV Information Provided by Shin-Etsu Silicones of America, Inc.
Viscosity	80000 - 130000 cP	80000 - 130000 cP
Master Bond EP17HT-3 One component, snap-curing epoxy system Product Description: Master Bond Polymer System EP17HT-3 is a one part epoxy that fully cures in 2-3 minutes at 250-300°F. It is capable of service up to +400°F with excellent strength retention p..
Viscosity	80000 cP @Temperature 25.0 °C	80000 cP @Temperature 77.0 °F	Mixed (rv #7, 10 rpm)
Tra-Con Tra-Bond JL01 High Viscosity High Temperature Fiber Optic Adhesive TRA-BOND JL01 is a high viscosity, two-component epoxy formulation that is suggested for bonding fiber optic bundles, potting glass fibers, and terminating single or multi-channel fiber optic connec..
Viscosity	80000 - 140000 cP	80000 - 140000 cP	at 20 RPM; Thixotropic
Loctite® 334 Acrylic Bonding Adhesive Acrylic Bonding AdhesivesLoctite® Acrylic Adhesives were developed for bonding applications that require tensile, shear and peel strength combined with maximum impact, stress and shock resistance. ..
Viscosity	80000 - 90000 cP @Temperature 23.0 °C	80000 - 90000 cP @Temperature 73.4 °F
Master Bond EP3SP5FL High Shear and High Peel Strength One Component Epoxy “Snap” cure version of EP3FL. Fastest curing system available. Ideal for high speed manufacturing & production. Good physical properties. Bonds well to most substrates.
Viscosity	80000 cP	80000 cP	mixing, dynamic
Dow Corning SILASTIC® 9251/45 A&B KIT 45 Durometer, 2-part, 1 to 1 mix, off-white, Fabric Coating grade, Liquid Silicone Rubber.Information provided by Dow Corning
Viscosity	80000 - 120000 cP @Temperature 23.0 °C	80000 - 120000 cP @Temperature 73.4 °F	2.5 rpm
Epoxy Technology EPO-TEK® E3035T-2 Electrically Conductive Epoxy Product Description: EPO-TEK® E3035T-2 is a single component, silver-filled epoxy for semiconductor die attach, as well as SMD attach on hybrid circuits.Advantages & Application Notes: This epoxy c..
Viscosity	80000 - 110000 cP @Temperature 23.0 °C	80000 - 110000 cP @Temperature 73.4 °F	2.5 rpm
Epoxy Technology EPO-TEK® H37-MPT Epoxy Material Description: A single component, silver-filled and electrically conductive adhesive designed for semiconductor die attach and bonding SMDs for hybrid microelectronic packaging. It is certi..
Viscosity	80000 cP	80000 cP	Dynamic
Dow Corning 3-3602 Polymer 80,000 CS Polydimethylsiloxane polymer with terminated, curable silanol functionality, viscosity= 80,000 cp.Information provided by Dow Corning
Viscosity	80000 cP	80000 cP	Thixotropic Gel
Dymax 9-20525 HGA and OHGA Disk Drive Adhesive Disk Drive AdhesivesLow Outgassing Multi-Cure® Memory Saver Disk Drive AdhesivesDescriptionDymax offers a range of advanced formula epoxy and acrylic adhesives for disk drive assembly. UV cures in ..
Viscosity	80000 cP	80000 cP	Mixed
Armstrong A-12 Epoxy Adhesive, at 1:1 Mix Ratio Our most popular general-purpose, high viscosity adhesive for industry. Combines low toxicity with excellent physical properties, and offers a non-critical mixing ratio of 1:1 by weight. This rati..
Viscosity	80000 cP	80000 cP	Mixed
Armstrong A-12 Epoxy Adhesive, at 2:3 Mix Ratio Our most popular general-purpose, high viscosity adhesive for industry. Combines low toxicity with excellent physical properties, and offers a non-critical mixing ratio of 1:1 by weight. This rati..
Viscosity	80000 cP	80000 cP	Mixed
Armstrong A-12 Epoxy Adhesive, at 3:2 Mix Ratio Our most popular general-purpose, high viscosity adhesive for industry. Combines low toxicity with excellent physical properties, and offers a non-critical mixing ratio of 1:1 by weight. This rati..
Viscosity	80000 - 150000 cP	80000 - 150000 cP
CEN® Electronic Material CTS Polyimide Resin CEN® CTS polyimide resin is a high tensile strength, thermal stable, and viscose resin solution based on aromatic polyimide. The product offers high modulus value and high dimensional stability wit..
Viscosity	80000 cP	80000 cP	Base
3M Scotch-Weld™ DP8810NS Low Odor Acrylic Adhesives 3M™ Scotch-Weld™ Low Odor Acrylic Adhesives are high performance, two-part acrylic adhesives with lower odor than most acrylic adhesives. These toughened products offer excellent shear, peel, and ..
Viscosity	80000 cP	80000 cP
3M Scotch-Weld™ EC2216 Structural Adhesive High Performance, Very flexible bondsInformation provided by 3M