| Physical Properties | Metric | English | Comments |
|---|---|---|---|
| Apparent Bulk Density | 0.700 - 0.900 g/cc | 0.0253 - 0.0325 lb/in³ | ISO 60 |
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Raschig Group AMPLA® 2500 melamine-modified polyester
Halogen-free, organically and inorganically filled melamine-modified Polyester molding compound. Excellent elasticity and shock resistance, low post-shrinkage, very good electrical values, high heat..
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| Apparent Bulk Density | 0.700 - 0.900 g/cc | 0.0253 - 0.0325 lb/in³ | ISO 60 |
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Raschig Group AMPLA® 7250 melamine-modified polyester
Cellulose reinforced melamine-modified Polyester molding compound. Very good electrical values, excellent heat resistance, excellent surface quality, low post shrinkage. This product meets the allow..
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| Apparent Bulk Density | 0.700 - 0.900 g/cc | 0.0253 - 0.0325 lb/in³ | ISO 60 |
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Raschig Group AMPLA® 7500 melamine-modified polyester
Organically and inorganically filled melamine modified Polyester molding compound. Low post-shrinkage, very good electrical values, excellent heat resistance, very good sliding behavior and wear sta..
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| Apparent Bulk Density | 0.700 - 0.900 g/cc | 0.0253 - 0.0325 lb/in³ | ISO 60 |
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Raschig Group DECAL® 572R Phenolic
Glass-fiber reinforced phenolic molding compound. Exceptional heat resistance with regard to maintaining surface finish and mechanical properties, outstanding mechanical properties, excellent rotati..
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| Apparent Bulk Density | 0.700 - 0.900 g/cc | 0.0253 - 0.0325 lb/in³ | ISO 60 |
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Raschig Group DECAL® 666/8 Phenolic
Glass-fiber reinforced phenolic molding compound with mineral fillers. High heat resistance, reduced mould shrinkage and post-shrinkage, good chemical resistance and mechanical properties. This prod..
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| Apparent Bulk Density | 0.700 - 1.00 g/cc | 0.0253 - 0.0361 lb/in³ | ISO 60 |
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Raschig Group EPOXIDUR® 3581 S ZC EP Epoxy Molding Compound
Inorganically filled epoxy molding compound. Good mechanical strength, very good electrical isolation properties and dimensional stability even at high temperatures. Very good sealing connection on ..
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| Apparent Bulk Density | 0.700 - 1.00 g/cc | 0.0253 - 0.0361 lb/in³ | ISO 60 |
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Raschig Group EPOXIDUR® 3585 EP Epoxy, Molded, Glass Fiber Filler
Glass-fiber reinforced and inorganically filled epoxy molding compound. Good mechanical strength, very good electrical isolation properties and dimensional stability even at high temperatures, excel..
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| Apparent Bulk Density | 0.700 - 0.800 g/cc | 0.0253 - 0.0289 lb/in³ | ISO 60 |
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Raschig Group SURAPLAST 54 UPA
Glass fiber reinforced polyester molding compound. Minimal mold shrinkage and post-shrinkage, very good arc resistance, very good mechanical strength. This product meets the allowed upper limits for..
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| Apparent Bulk Density | 0.700 g/cc | 0.0253 lb/in³ | ASTM D1895B |
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Solvay Specialty Polymers Ixef® BXT-2000/0203 Polyarylamide (PARA)
(Unverified Data**)
Ixef BXT-2000/0203 resin was developed specifically for extrusion and blow-molding processes. Unlike grades targeted for injection molding, Ixef BXT-2000/0203 resin can be successfully extruded into..
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| Apparent Bulk Density | 0.700 g/cc | 0.0253 lb/in³ | ISO 60 |
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Hexion Bakelite™ MP 4165 Melamine Phenolic Resin, Copper Adhesive, Low Shrinkage, High Mechanical Strength
(d
Melamine/phenolic molding compound, inorganically filled, glass fiber reinforced, good temperature stability, high level of mechanical properties, copper adhesive, flammability UL 94/V-0/1.6 mm (not..
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| Apparent Bulk Density | 0.700 g/cc | 0.0253 lb/in³ | ISO 60 |
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Hexion Bakelite™ PF 2535 Phenolic Formaldehyde Resin, High Surface Quality, Dishwasher Proof
(discontinued **
Phenolic molding compound, inorganically/organically filled, average heat resistant, steam resistant, dish washer proof, high surface quality.Application areas: Fittings for ovens and dishwashers, t..
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| Apparent Bulk Density | 0.700 g/cc | 0.0253 lb/in³ | Apparent density per ASTM D1895 |
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Plenco 4759 Phenolic, Granular, Injection Molded
(discontinued **)
Two-stage Phenolic. PLENCO 04759 is a black, two stage, medium heat resistant phenolic molding compound. It has excellent molded finish and possesses good electrical properties. It is used in appli..
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| Apparent Bulk Density | 0.700 g/cc | 0.0253 lb/in³ | ASTM D1895 |
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Plenco 501 Black Electrical Grade Mineral/Flock Filled Phenolic Molding Compound
(discontinued **)
Plaslok 501 is a two-stage, mineral and flock-filled phenolic molding compound designed for use in heat resistant and electrical applications. It is designed for elevated temperature exposure for e..
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| Apparent Bulk Density | 0.700 g/cc | 0.0253 lb/in³ | ASTM D1895 |
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Plenco 506 Black Heat Resistant Mineral Filled Phenolic Molding Compound
(discontinued **)
Plaslok 506 is a two-stage, mineral-filled phenolic molding compound. It is formulated for automotive ashtrays and for appliance applications such as utensil handles receiving repeated exposure to ..
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| Apparent Bulk Density | 0.700 g/cc | 0.0253 lb/in³ | Tap density |
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Momentive Performance Materials AC-6028 Boron Nitride (BN) Powder
Grade AC-6028 consists of agglomerated particles of hexagonal Boron Nitride (BN) with a mean particle size between 100 and 150µ. It exhibits the unique properties of BN in a form readily used in..
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| Apparent Bulk Density | 0.700 g/cc | 0.0253 lb/in³ | ASTM D-1875 |
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Lubrizol Advanced Materials Pearlthane® MB-9005 Thermoplastic Polyurethane Elastomer
Pearlthane® MB-9005 is a TPU-based color masterbatch, supplied in the form of homogenously black colored pellets. It is specially intended for coloring TPUs (either polyester or polyether-based)..
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| Apparent Bulk Density | 0.700 g/cc | 0.0253 lb/in³ | Method B; ASTM D1895 |
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Solvay Specialty Polymers Ixef® BXT 2000-0203 Polyarylamide (PARA)
Ixef® BXT 2000-0203 resin was developed specifically for extrusion and blow-molding processes. Unlike grades targeted for injection molding, Ixef® BXT 2000-0203 resin can be successfully extru..
|
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| Apparent Bulk Density | 0.700 g/cc | 0.0253 lb/in³ | Apparent packing density; ISO 1068 |
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SolVin 266SC Polyvinyl Chloride Pastes - filler Polymers
Made by suspension polymerization.
APPLICATIONS
Filler polymer for plastisols.
CHARACTERISTICS
SolVin 266SC is a suspension resin with very low porosity, small particle size and a very low amount of..
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| Apparent Bulk Density | 0.700 g/cc | 0.0253 lb/in³ | |
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Cosmic Plastics K31 Short Glass Fiber Filled Iso Diallyl Phthalate Molding Compound
Data provided by the manufacturer.
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| Apparent Bulk Density | 0.700 g/cc | 0.0253 lb/in³ | TRM-37 |
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Tipco Tipcolite® TG 211 Phenolic Compound, Mineral & Wood Flour, Soft Flow & High Electrical Properties
Soft Flow Phenolic Compound, Reinforced with Mineral & Wood FlourApplications: Electrical & ElectronicsProcessing: Compression MoldingInformation provided by the Manufacturer, Tipco Industries Ltd..
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| Apparent Bulk Density | 0.700 g/cc | 0.0253 lb/in³ | TRM-37 |
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Tipco Tipcolite® TG 618 Phenolic Compound, Mineral & Wood Flour, Medium Flow & High Electrical Properties
Medium Flow Phenolic Compound, Reinforced with Mineral & Wood FlourApplications: Electrical & ElectronicsProcessing: Compression & TransferInformation provided by the Manufacturer, Tipco Industrie..
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| Apparent Bulk Density | 0.700 g/cc | 0.0253 lb/in³ | TRM-37 |
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Tipco Tipcolite® TX 211 Phenolic Compound, Wood Flour, having Medium Flow & High Electrical Properties
Medium Flow Phenolic Compound, Reinforced with Wood FlourApplications: Switchgear, HRC FusesProcessing: Compression MoldingInformation provided by the Manufacturer, Tipco Industries Ltd.,
India.
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| Apparent Bulk Density | 0.700 - 0.850 g/cc | 0.0253 - 0.0307 lb/in³ | IS 867-1963 |
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Amity Thermosets ATE 183 M Phenolic Molding Mica and organic Filler, Compression Molded
Characteristics:Electric low loss Low water absorption Low shrinkage Heat stableGlossy surface finishVery good mouldabilityGood electrical insulationGood chemical resistantColor-blackMedium flowAppl..
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| Apparent Bulk Density | 0.700 - 0.800 g/cc | 0.0253 - 0.0289 lb/in³ | IS 867-1963 |
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Amity Thermosets ATS 135 Phenolic Molding Inorganic and glass fiber Filler, Compression Molded
Characteristics: Self lubricating Good mechanical strength Low co-efficient of friction Good thermal conductivity Heat stable (200°C) Good mouldability Not suitable for electrical application Color..
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| Apparent Bulk Density | 0.700 - 0.750 g/cc | 0.0253 - 0.0271 lb/in³ | IS 867-1963 |
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Amity Thermosets ATS 1612 Phenolic Molding Nylon, inorganic, and glass Filler, Compression Molded
Characteristics:High dielectric & mechanical strengthWeather resistant Good electric insulationLow water absorption Good mechanical tension bearing capacityColor-blackSoft/Medium flow Applications:R..
|
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| Apparent Bulk Density | 0.700 - 0.850 g/cc | 0.0253 - 0.0307 lb/in³ | IS 867-1963 |
|
Amity Thermosets ATE 183 Phenolic Molding Mica and organic Filler, Compression Molded
Characteristics:Electric low loss Low water absorption Low shrinkage Heat stableGlossy surface finishVery good mouldabilityGood electrical insulationGood chemical resistantColor-blackMedium flowAppl..
|
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| Apparent Bulk Density | 0.700 - 0.750 g/cc | 0.0253 - 0.0271 lb/in³ | IS 867-1963 |
|
Amity Thermosets ATS 1613-G Phenolic Molding Nylon and inorganic Filler, Compression Molded
Characteristics:High dielectric & mechanical strengthWeather resistant Good electric insulationLow water absorption Good mechanical tension bearing capacityColor-blackSoft/Medium flow Applications:R..
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| Apparent Bulk Density | 0.700 g/cc | 0.0253 lb/in³ | ISO 60 |
|
Hexion Bakelite™ PF 2874 Phenolic Formaldehyde Resin, Low Shrinkage, Improved Electrical Properties, UL Listed, High Mechanical Strength
Phenolic molding compound, inorganically filled, glass fiber reinforced, increased mechanical strength, increased temperature stability, low water absorption, good dimensional stability, UL listed m..
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| Apparent Bulk Density | 0.700 - 1.30 g/cc | 0.0253 - 0.0470 lb/in³ | Average value: 0.950 g/cc Grade Count:5 |
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Overview of materials for Epoxy Molding Compound
This property data is a summary of similar materials in the MatWeb database for the category "Epoxy Molding Compound". Each property range of values reported is minimum and maximum values of appropr..
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| Apparent Bulk Density | 0.700 g/cc | 0.0253 lb/in³ | ISO 60 |
|
Hexion Bakelite™ PF 8052 Phenolic Formaldehyde Resin, Resistant to High Temperatures
(discontinued **)
Phenolic molding compound, glass fiber reinforced and inorganically filled. Excellent heat resistance with respect to surface finish and mechanical properties.Application areas: Pan handles, heat r..
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