| Physical Properties | Metric | English | Comments |
|---|---|---|---|
| Apparent Bulk Density | 0.700 - 0.850 g/cc | 0.0253 - 0.0307 lb/in³ | ISO 60 |
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Raschig Group 2557 AMC Polyester
Glass fiber reinforced polyester molding compound. Very good mechanical strength, very good electrical properties and dimensional stability, exceptional processability with short cycle time and low ..
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| Apparent Bulk Density | 0.700 - 0.850 g/cc | 0.0253 - 0.0307 lb/in³ | ISO 60 |
|
Raschig Group 2567 AMC
Glass fiber-reinforced and inorganically filled polyester molding compound (UP) in various colors. Outstanding mechanical strength similar to BMC/SMC, very good electrical isolation properties and ..
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| Apparent Bulk Density | 0.700 - 0.850 g/cc | 0.0253 - 0.0307 lb/in³ | ISO 60 |
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Raschig Group 2572 AMC
Glass fiber reinforced Polyester molding compound. Very good mechanical strength, very good electrical properties and dimensional stability, good abrasion stability, high flame retardance in combin..
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| Apparent Bulk Density | 0.700 - 0.850 g/cc | 0.0253 - 0.0307 lb/in³ | ISO 60 |
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Raschig Group 6502 DAIP Diallyl Phthalate (DAP), Cast, Mineral Filler
Glass-fiber reinforced diallyl isophthalate molding compound. Good mechanical strength together with retention of high electrical isolation properties under hot humid conditions, exceptional dimensi..
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| Apparent Bulk Density | 0.700 - 0.850 g/cc | 0.0253 - 0.0307 lb/in³ | ISO 60 |
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Raschig Group 6551 DAIP Diallyl Phthalate (DAP), Cast, Mineral Filler
Glass-fiber reinforced diallyl isophthalate molding compound. Good mechanical strength together with retention of high electrical isolation properties under hot humid conditions, exceptional dimensi..
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| Apparent Bulk Density | 0.700 - 0.900 g/cc | 0.0253 - 0.0325 lb/in³ | ISO 60 |
|
Raschig Group AMPLA® 2500 melamine-modified polyester
Halogen-free, organically and inorganically filled melamine-modified Polyester molding compound. Excellent elasticity and shock resistance, low post-shrinkage, very good electrical values, high heat..
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| Apparent Bulk Density | 0.700 - 0.900 g/cc | 0.0253 - 0.0325 lb/in³ | ISO 60 |
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Raschig Group AMPLA® 7250 melamine-modified polyester
Cellulose reinforced melamine-modified Polyester molding compound. Very good electrical values, excellent heat resistance, excellent surface quality, low post shrinkage. This product meets the allow..
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| Apparent Bulk Density | 0.700 - 0.900 g/cc | 0.0253 - 0.0325 lb/in³ | ISO 60 |
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Raschig Group AMPLA® 7500 melamine-modified polyester
Organically and inorganically filled melamine modified Polyester molding compound. Low post-shrinkage, very good electrical values, excellent heat resistance, very good sliding behavior and wear sta..
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| Apparent Bulk Density | 0.700 - 1.00 g/cc | 0.0253 - 0.0361 lb/in³ | ISO 60 |
|
Raschig Group EPOXIDUR® 3581 S ZC EP Epoxy Molding Compound
Inorganically filled epoxy molding compound. Good mechanical strength, very good electrical isolation properties and dimensional stability even at high temperatures. Very good sealing connection on ..
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| Apparent Bulk Density | 0.700 g/cc | 0.0253 lb/in³ | ISO 60 |
|
Hexion Bakelite™ MP 4165 Melamine Phenolic Resin, Copper Adhesive, Low Shrinkage, High Mechanical Strength
(d
Melamine/phenolic molding compound, inorganically filled, glass fiber reinforced, good temperature stability, high level of mechanical properties, copper adhesive, flammability UL 94/V-0/1.6 mm (not..
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| Apparent Bulk Density | 0.700 g/cc | 0.0253 lb/in³ | Apparent density per ASTM D1895 |
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Plenco 4759 Phenolic, Granular, Injection Molded
(discontinued **)
Two-stage Phenolic. PLENCO 04759 is a black, two stage, medium heat resistant phenolic molding compound. It has excellent molded finish and possesses good electrical properties. It is used in appli..
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| Apparent Bulk Density | 0.700 g/cc | 0.0253 lb/in³ | ASTM D1895 |
|
Plenco Valite 759 Novolac Phenolic, Granular, Injection Molded
(discontinued **)
This Valite product has been replaced by Plenco 4759. Data provided by Plenco.VALITE 759 is a black, two stage, medium heat resistant phenolic molding compound. It has excellent molded finish and p..
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| Apparent Bulk Density | 0.700 g/cc | 0.0253 lb/in³ | ASTM D1895 |
|
Plenco 501 Black Electrical Grade Mineral/Flock Filled Phenolic Molding Compound
(discontinued **)
Plaslok 501 is a two-stage, mineral and flock-filled phenolic molding compound designed for use in heat resistant and electrical applications. It is designed for elevated temperature exposure for e..
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| Apparent Bulk Density | 0.700 g/cc | 0.0253 lb/in³ | ASTM D1895 |
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Plenco 506 Black Heat Resistant Mineral Filled Phenolic Molding Compound
(discontinued **)
Plaslok 506 is a two-stage, mineral-filled phenolic molding compound. It is formulated for automotive ashtrays and for appliance applications such as utensil handles receiving repeated exposure to ..
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| Apparent Bulk Density | 0.700 g/cc | 0.0253 lb/in³ | ASTM D1895 |
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Plaslok 506 Black Heat Resistant Mineral Filled Phenolic Molding Compound
(discontinued **)
Plaslok Corporation was purchased by Plastics Engineering Company (maker of Plenco brand materials) in March 2000. The Plaslok name is no longer in use.Plaslok 506 is a two-stage, mineral-filled ph..
|
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| Apparent Bulk Density | 0.700 g/cc | 0.0253 lb/in³ | TRM-37 |
|
Tipco Tipcolite® TG 211 Phenolic Compound, Mineral & Wood Flour, Soft Flow & High Electrical Properties
Soft Flow Phenolic Compound, Reinforced with Mineral & Wood FlourApplications: Electrical & ElectronicsProcessing: Compression MoldingInformation provided by the Manufacturer, Tipco Industries Ltd..
|
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| Apparent Bulk Density | 0.700 g/cc | 0.0253 lb/in³ | TRM-37 |
|
Tipco Tipcolite® TG 311 Phenolic Compound, Mineral & Wood Flour, Medium Flow & High Electrical Properties
Medium Flow Phenolic Compound, Reinforced with Mineral & Wood FlourApplications: Electrical & ElectronicsProcessing: Compression & TransferInformation provided by the Manufacturer, Tipco Industrie..
|
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| Apparent Bulk Density | 0.700 g/cc | 0.0253 lb/in³ | TRM-37 |
|
Tipco Tipcolite® TG 618 Phenolic Compound, Mineral & Wood Flour, Medium Flow & High Electrical Properties
Medium Flow Phenolic Compound, Reinforced with Mineral & Wood FlourApplications: Electrical & ElectronicsProcessing: Compression & TransferInformation provided by the Manufacturer, Tipco Industrie..
|
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| Apparent Bulk Density | 0.700 g/cc | 0.0253 lb/in³ | TRM-37 |
|
Tipco Tipcolite® THD 121 Phenolic Compound, Wood Flour, having Medium Flow & High Strength
Medium Flow Phenolic Compound, Reinforced with Wood FlourApplications: Electrical & ElectronicsProcessing: Compression MoldingInformation provided by the Manufacturer, Tipco Industries Ltd.,
India...
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| Apparent Bulk Density | 0.700 g/cc | 0.0253 lb/in³ | TRM-37 |
|
Tipco Tipcolite® TX 211 Phenolic Compound, Wood Flour, having Medium Flow & High Electrical Properties
Medium Flow Phenolic Compound, Reinforced with Wood FlourApplications: Switchgear, HRC FusesProcessing: Compression MoldingInformation provided by the Manufacturer, Tipco Industries Ltd.,
India.
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| Apparent Bulk Density | 0.700 - 0.850 g/cc | 0.0253 - 0.0307 lb/in³ | IS 867-1963 |
|
Amity Thermosets ATE 183 M Phenolic Molding Mica and organic Filler, Compression Molded
Characteristics:Electric low loss Low water absorption Low shrinkage Heat stableGlossy surface finishVery good mouldabilityGood electrical insulationGood chemical resistantColor-blackMedium flowAppl..
|
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| Apparent Bulk Density | 0.700 - 0.800 g/cc | 0.0253 - 0.0289 lb/in³ | IS 867-1963 |
|
Amity Thermosets ATS 135 Phenolic Molding Inorganic and glass fiber Filler, Compression Molded
Characteristics: Self lubricating Good mechanical strength Low co-efficient of friction Good thermal conductivity Heat stable (200°C) Good mouldability Not suitable for electrical application Color..
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| Apparent Bulk Density | 0.700 g/cc | 0.0253 lb/in³ | ASTM D1895 |
|
Ashley Polymers Ashlene® 531 Nylon 66
For Monofilament spinning/super dry.Data provided by the manufacturer
|
|||
| Apparent Bulk Density | 0.700 - 0.850 g/cc | 0.0253 - 0.0307 lb/in³ | IS 867-1963 |
|
Amity Thermosets ATE 183 Phenolic Molding Mica and organic Filler, Compression Molded
Characteristics:Electric low loss Low water absorption Low shrinkage Heat stableGlossy surface finishVery good mouldabilityGood electrical insulationGood chemical resistantColor-blackMedium flowAppl..
|
|||
| Apparent Bulk Density | 0.700 - 0.750 g/cc | 0.0253 - 0.0271 lb/in³ | IS 867-1963 |
|
Amity Thermosets ATS 1613-G Phenolic Molding Nylon and inorganic Filler, Compression Molded
Characteristics:High dielectric & mechanical strengthWeather resistant Good electric insulationLow water absorption Good mechanical tension bearing capacityColor-blackSoft/Medium flow Applications:R..
|
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| Apparent Bulk Density | 0.700 - 0.950 g/cc | 0.0253 - 0.0343 lb/in³ | ISO 60 |
|
Raschig Group RALUPOL® 8605 UP Polyester
Glass fiber reinforced polyester molding compound. Resistant to hydrolysis. This product meets the allowed upper limits for heavy metals and PCAs and also conforms to the requirements of the EU dire..
|
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| Apparent Bulk Density | 0.700 g/cc | 0.0253 lb/in³ | ISO 60 |
|
Hexion Bakelite™ PF 2874 Phenolic Formaldehyde Resin, Low Shrinkage, Improved Electrical Properties, UL Listed, High Mechanical Strength
Phenolic molding compound, inorganically filled, glass fiber reinforced, increased mechanical strength, increased temperature stability, low water absorption, good dimensional stability, UL listed m..
|
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| Apparent Bulk Density | 0.700 - 1.30 g/cc | 0.0253 - 0.0470 lb/in³ | Average value: 0.950 g/cc Grade Count:5 |
|
Overview of materials for Epoxy Molding Compound
This property data is a summary of similar materials in the MatWeb database for the category "Epoxy Molding Compound". Each property range of values reported is minimum and maximum values of appropr..
|
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| Apparent Bulk Density | 0.700 g/cc | 0.0253 lb/in³ | ISO 60 |
|
Hexion Bakelite™ PF 8052 Phenolic Formaldehyde Resin, Resistant to High Temperatures
(discontinued **)
Phenolic molding compound, glass fiber reinforced and inorganically filled. Excellent heat resistance with respect to surface finish and mechanical properties.Application areas: Pan handles, heat r..
|
|||
| Apparent Bulk Density | 0.700 g/cc | 0.0253 lb/in³ | ASTM D1895 |
|
Plaslok 501 Black Electrical Grade Mineral/Flock Filled Phenolic Molding Compound
(discontinued **)
Plaslok Corporation was purchased by Plastics Engineering Company (maker of Plenco brand materials) in March 2000. The Plaslok name is no longer in use.Plaslok 501 is a two-stage, mineral and flock..
|
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