| Mechanical Properties | Metric | English | Comments |
|---|---|---|---|
| Adhesive Bond Strength | 13.1 MPa | 1900 psi | Lap shear; 2024 T3 Al Abraded / MEK Wipe; Mixed 1:1; TM R050-37 |
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Resinlab® EP1215 Clear Unfilled Epoxy Structural Adhesive
Resinlab™ EP1215 Clear is a two part unfilled epoxy structural adhesive designed for bonding applications requiring high strength and good impact resistance. It cures completely at room temperature..
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| Adhesive Bond Strength | 13.1 MPa | 1900 psi | lap shear (bond line thickness of 0.005"); ASTM D1002 |
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ITW Devcon 5 minute® Epoxy, Light Amber
Information provided by ITW Devcon
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| Adhesive Bond Strength | 13.1 MPa | 1900 psi | Lap shear, alum to alum, 2 hrs @ 65°C |
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Tra-Con Tra-Bond 2112 Rigid Epoxy Staking Compound
TRA-BOND 2112 is a thixotropic epoxy system recommended for critical electronic, aerospace and industrial bonding, laminating and reinforcing applications requiring an adhesive with high-fill, non-s..
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| Adhesive Bond Strength | 13.1 MPa | 1900 psi | Lap shear, alum to alum, 2 hrs @ 65°C |
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Tra-Con Tra-Bond 216D02 Thixotropic No-Sag Epoxy Adhesive
TRA-BOND 216D02 is a thixotropic, two part epoxy adhesive formulated specifically for applications where a nonsagging adhesive is required. TRA-BOND 216D02 works in concert with TRA-CAST 3135 to per..
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| Adhesive Bond Strength | 13.1 MPa | 1900 psi | Lap shear, alum to alum, 30 min @ 150°C |
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Tra-Con Tra-Bond 221M02
Information provided by Tra-Con Inc.
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| Adhesive Bond Strength | 13.1 MPa | 1900 psi | Lap shear, alum to alum, 2 min @ 150°C |
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Tra-Con Tra-Duct 2960 Snap Cure Electrically Conductive Silver-Filled Epoxy
TRA-DUCT 2960 is a one or two-part, specially refined and processed silver filled adhesive for high speed manufacturing. Recommended for the microelectronic, automotive computer and telecommunicatio..
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| Adhesive Bond Strength | 13.1 MPa | 1900 psi | |
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Trelleborg Emerson & Cuming Eccobond® 104 Two-Component High Temperature Performance Epoxy Adhesive
Emerson & Cuming 104 Eccobond® Two-Component High Temperature Performance Epoxy AdhesiveFilled, heat curing, high temperature resistant, epoxy adhesive. Excellent chemical resistance. Maintains hig..
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| Adhesive Bond Strength |
13.1
MPa @Temperature 82.2 °C |
1900
psi @Temperature 180 °F |
Aluminum-Aluminum tensile shear |
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Armstrong X-81/A Epoxy Adhesive
Information provided by Ellsworth Adhesives.
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| Adhesive Bond Strength | 13.1 MPa | 1900 psi | Alum to Alum |
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Atom Adhesives AA-BOND 2112 Epoxy Adhesive
AA-BOND 2112 is a thixotropic epoxy system recommended for critical electronics, aerospace and industrial bonding, laminating and reinforcing applications requiring an adhesive with high-fill, non-s..
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