| Mechanical Properties | Metric | English | Comments |
|---|---|---|---|
| Adhesive Bond Strength | 17.2 MPa | 2500 psi | Lap shear; 2024 T3 Al Abraded / MEK Wipe; Mixed 1:2; TM R050-37 |
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Resinlab® EP1215 Clear Unfilled Epoxy Structural Adhesive
Resinlab™ EP1215 Clear is a two part unfilled epoxy structural adhesive designed for bonding applications requiring high strength and good impact resistance. It cures completely at room temperature..
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| Adhesive Bond Strength | 17.2 MPa | 2500 psi | Lap shear; 2024 T3 Al Abraded / MEK Wipe; TM R050-37 |
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Resinlab® EP1290 Clear Mineral Filled Epoxy Adhesive
Resinlab™ EP1290 Clear is a two part mineral filled epoxy adhesive designed for bonding metals and plastics. It cures at room temperature to a tough, semi-flexible material. It has good wetting to ..
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| Adhesive Bond Strength | 17.2 MPa | 2500 psi | Lap shear; 2024 T3 Al Abraded / MEK Wipe; TM R050-37 |
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Resinlab® EP950NMF Gray Non-Metallic Filled Rubber Modified Epoxy
Resinlab™ EP950NMF Gray is a non-metallic filled version of EP950G. It is a one-part rubber modified epoxy designed for bonding metal and other structural material subject to stress at elevated tem..
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| Adhesive Bond Strength | 17.2 MPa | 2500 psi | lap shear (on grit blasted steel, bond line thickness of 0.010"); ASTM D1002 |
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ITW Devcon 5 minute® Epoxy Gel, Opaque
Information provided by ITW Devcon
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| Adhesive Bond Strength | >= 17.2 MPa | >= 2500 psi | shear, Al/Al |
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Master Bond EP21TDCHT-LO Room Temperature Curing, Toughened Two Component Epoxy
Master Bond Polymer Adhesive EP21TDCHT-LO is a two component epoxy adhesive formulated to cure at room temperature or more rapidly at elevated temperatures, with a very forgiving and convenient one ..
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| Adhesive Bond Strength | 17.2 MPa | 2500 psi | Lap shear, alum to alum |
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Tra-Con Tra-Bond 2147 Thixotropic Epoxy/Polyamide Adhesive
TRA-BOND 2147 is a thixotropic (thick paste) polymer epoxy/polyamide system developed for industrial adhesive and sealing applications where the combination of high fill, easy handling, good wetting..
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| Adhesive Bond Strength | 17.2 MPa | 2500 psi | Lap shear, alum to alum |
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Tra-Con Tra-Bond 2170 Flexible Plastic Bonder
TRA-BOND 2170 is a flexible thixotropic bonding adhesive designed for bonding all types of plastics including nylon, PVC, polyethylene, acrylic, lexan, polypropylene, kapton or almost any thermoplas..
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| Adhesive Bond Strength | 17.2 MPa | 2500 psi | Lap shear, gold to gold, @ 25°C |
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Tra-Con Tra-Bond 293-14 Electrically Conductive Silver-Filled Epoxy Adhesive
TRA-BOND 293-14 silver-filled, electrically conductive epoxy adhesive is designed to provide strong bonds to difficult-to-bond metals, such as nickel, copper, gold and solder. The stress-absorbing c..
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| Adhesive Bond Strength | 17.2 MPa | 2500 psi | Lap shear, alum to alum |
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Tra-Con Tra-Bond 724-17GR Polyurethane Adhesive
TRA-BOND 724-17GR premixed and frozen, polyurethane adhesive is designed for good adhesion, providing strong resilient bonds to a wide variety of substrates, including aluminum, solder, nylon, mylar..
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| Adhesive Bond Strength | 17.2 MPa | 2500 psi | Lap shear, alum to alum, 2 hrs @ 150°C |
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Tra-Con Tra-Bond 933-1 Moisture Resistant Chip Encapsulant
TRA-BOND 933-1 one component, highly filled, electrically insulating epoxy encapsulant is designed for encapsulating microelectronic chips. This epoxy provides excellent environmental and mechanical..
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| Adhesive Bond Strength | 17.2 MPa | 2500 psi | Lap shear, alum to alum, 2 hrs @ 150°C |
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Tra-Con Tra-Bond 933-2 Moisture Resistant Chip Encapsulant
TRA-BOND 933-2 one component, highly filled, electrically insulating epoxy encapsulant is designed for encapsulating microelectronic chips. This epoxy provides excellent environmental and mechanical..
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| Adhesive Bond Strength | 17.2 MPa | 2500 psi | Lap shear, alum to alum, 24 hrs @ 25°C |
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Tra-Con Tra-Bond F112 Fiber Optic Epoxy Adhesive
TRA-BOND F112 is a long pot life, impact resistant, fiber-optic adhesive. This two-part, low viscosity epoxy has the distinct advantage of remaining below 3000 cps for a minimum of 40 minutes. This ..
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| Adhesive Bond Strength | 17.2 MPa | 2500 psi | Lap shear, alum to alum |
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Tra-Con Tra-Bond F123LV Color Keyed High Temperature Epoxy Adhesive
TRA-BOND F123LV is a fast cure, low viscosity, two-component epoxy formulation that signals both proper mixing and curing when bonding fiber optic bundles, potting glass fibers, and/or terminating s..
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| Adhesive Bond Strength | 17.2 MPa | 2500 psi | Lap shear, alum to alum, 1 hr @ 100°C |
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Tra-Con Tra-Bond FS227 Thixotropic Epoxy/Polyamide Adhesive
TRA-BOND FS227 is a thixotropic (thick paste) polymer epoxy/polyamide system developed for industrial adhesive and sealing applications where the combination of high fill, easy handling, good wettin..
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| Adhesive Bond Strength | 17.2 MPa | 2500 psi | Lap shear, pvc to pvc |
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Tra-Con Tra-Bond FS420 Flexible Plastic Adhesive
TRA-BOND FS-420 is a flexible thixotropic bonding adhesive designed for bonding all types of plastics including nylon, PVC, polyethylene, acrylic, lexan, polypropylene, kapton or almost any thermopl..
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| Adhesive Bond Strength | >= 17.2 MPa | >= 2500 psi | Shear, Al/Al |
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Master Bond Supreme 33CLV Two Component, Room Temperature Curing Toughened Epoxy
Master Bond Polymer System Supreme 33CLV is a special, room temperature curing, toughened epoxy adhesive/sealant, featuring exceptionally high temperature resistance. This innovative system has outs..
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| Adhesive Bond Strength | 17.2 MPa | 2500 psi | Lap shear, alum to alum, @ 25°C |
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Tra-Con Tra-Bond 2211 High Temperature Epoxy Adhesive
TRA-BOND 2211 is a low viscosity epoxy adhesive system recommended for industrial bonding applications where superior wetting and good mechanical and electrical insulation performance features are r..
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| Adhesive Bond Strength | 17.2 MPa | 2500 psi | |
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Trelleborg Emerson & Cuming Eccobond® A 316 Filler End Cap Epoxy Adhesive
Emerson & Cuming A 316 Eccobond® Filler End Cap Epoxy AdhesiveOne component, pourable, fast heat curing, epoxy adhesive. Exhibits excellent thermal stability and resistance to chemicals. Used as en..
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| Adhesive Bond Strength | 17.2 MPa | 2500 psi | |
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Trelleborg Emerson & Cuming Eccobond® A316-48 One-Component Fast Cure Epoxy Adhesive
Emerson & Cuming A316-48 Eccobond® One-Component Fast Cure Epoxy AdhesivePourable, fast heat curing, epoxy adhesive and insulation compound. Excellent chemical and heat resistance. Cure Type: Heat ..
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| Adhesive Bond Strength | 17.2 MPa | 2500 psi | Adhesive tensile shear strength; ASTM D1002 |
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Devcon HVAC Repair (Special F) Epoxy
General Repair EpoxyComments: Aluminum-filled epoxy adhesive, conveniently packaged in two 6.5 oz. tubes. Bonds to aluminum and other metals, ceramics, wood, concrete or glass. Use as an adhesive ..
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| Adhesive Bond Strength | 17.2 MPa | 2500 psi | Lap Shear Strength |
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Epoxyset Epoxibond EB-103F Unfilled Epoxy Adhesive
A two-component, unfilled, fast setting epoxy adhesive used for bonding and small potting applications in the medical, electronics, and aerospace industries. EB-103F has excellent bond strength to v..
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| Adhesive Bond Strength | 17.2 MPa | 2500 psi | initial adhesion to Saran™ film; ASTM D3330 |
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Dow Saran® 520 Vapor Retarder Tape
Saran™ 520 Vapor Retarder Tape is a Vapor Retarder Film coated with acrylic adhesive designed for long-lasting adhesion and wide temperature range performance. Information provided by Dow
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| Adhesive Bond Strength |
17.2
MPa @Temperature 82.2 °C |
2500
psi @Temperature 180 °F |
Aluminum-Aluminum tensile shear |
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Armstrong A-5/E Epoxy Adhesive
Information provided by Ellsworth Adhesives.
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| Adhesive Bond Strength |
17.2
MPa @Temperature -54.4 °C |
2500
psi @Temperature -66.0 °F |
Aluminum-Aluminum tensile shear |
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Armstrong A-661 Epoxy Adhesive
A truly unique, two-component, room temperature curing thixotropic epoxy adhesive system, which exhibits good bond strength at service temperatures up to 400°F. Ideal for applications where resist..
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| Adhesive Bond Strength | 17.2 MPa | 2500 psi | Lap shear, alum to alum |
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Tra-Con Tra-Bond 724-17GR1B3 Polyurethane Adhesive
TRA-BOND 724-17GR1B3 premixed and frozen polyurethane adhesive is designed for good adhesion, providing strong resilient bonds to a wide variety of substrates, including aluminum, solder, nylon, myl..
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| Adhesive Bond Strength | 17.2 MPa | 2500 psi | Lap shear; 2024 T3 Al Abraded / MEK Wipe; TM R050-37 |
|
Resinlab® EP1290 Gray Mineral Filled Epoxy Adhesive
Resinlab™ EP1290 Gray is a two part mineral filled epoxy adhesive designed for bonding metals and plastics. It cures at room temperature to a tough, semi-flexible material. It has good wetting to m..
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| Adhesive Bond Strength | 17.2 MPa | 2500 psi | Lap shear; 2024 T3 Al Abraded / MEK Wipe; TM R050-37 |
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Resinlab® EP965SC-7 Black Unfilled Electronic Grade Epoxy Encapsulant
Resinlab™ EP965SC-7 Black is a two part unfilled electronic grade epoxy encapsulant designed for medium sized castings. It cures at room temperature to a tough, semi-rigid polymer. It has good wett..
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| Adhesive Bond Strength | 17.2 MPa | 2500 psi | Lap shear; 2024 T3 Al Abraded / MEK Wipe; TM R050-37 |
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Resinlab® EP1026 Black Epoxy Adhesive
Resinlab™ EP1026 Black is a two part unfilled epoxy adhesive designed for high speed bonding of metals, ceramics, and most plastics. It cures to a tough semi-rigid material, and is free flowing in ..
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| Adhesive Bond Strength | 17.2 MPa | 2500 psi | Lap shear; 2024 T3 Al Abraded / MEK Wipe; TM R050-37 |
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Resinlab® EP1115 Clear Unfilled Epoxy Adhesive
Resinlab™ EP1115 Clear is a two part unfilled epoxy adhesive designed for bonding of metals, ceramics and most plastics. This product gives good resistance to water, salt spray, inorganic acids and..
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| Adhesive Bond Strength | >= 17.2 MPa | >= 2500 psi | Shear, Al/Al |
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Master Bond Supreme 46HT-2ND2 Two Component, Non-Drip, Toughened, Epoxy Adhesive
Master Bond Polymer Supreme 46HT-2ND2 is a two component, non-drip, epoxy adhesive featuring an attractive balance of superior shear and peel strengths for high performance structural bonding suitab..
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