| Mechanical Properties | Metric | English | Comments |
|---|---|---|---|
| Tensile Modulus | 3.34 GPa | 484 ksi | 1 mm/min; ISO 527 |
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SABIC Innovative Plastics Cycoloy® C7410 PC+ABS (Asia Pacific)
Cycoloy* C7410 resin is a talc-filled PC+ABS, nonhalogenated FR for thinwall molding applications.
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| Tensile Modulus | 3.34 GPa | 484 ksi | 5 mm/min; ASTM D638 |
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SABIC Innovative Plastics ULTEM LTX300B PEI
Standard flow Polyetherimide blend with low toxicity, smoke, and flame evolution. ECO Compliant, UL94 V0 listing.
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| Tensile Modulus | 3.34 GPa | 484 ksi | 5 mm/min; ASTM D638 |
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SABIC Innovative Plastics ULTEM LTX300B PEI (Asia Pacific)
Standard flow Polyetherimide blend with low toxicity, smoke, and flame evolution. ECO Compliant, UL94 V0 listing.
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| Tensile Modulus | 3.34 GPa | 484 ksi | 50 mm/min; ASTM D638 |
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SABIC Innovative Plastics LNP STAT-KON FX98501 PE
LNP* STAT-KON* FX98501 is a compound based on Polyethylene resin containing Proprietary Fillers. Added feature of this material is: Electrically Conductive.
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| Tensile Modulus | 3.34 GPa | 484 ksi | 1 mm/min; ISO 527 |
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SABIC Innovative Plastics LNP Thermocomp C7410 PC+ABS (Asia Pacific)
LNP* Thermocomp* C7410 compound is a talc-filled PC+ABS, nonhalogenated FR for thinwall molding applications.This data was supplied by SABIC-IP for the Asia Pacific region.
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| Tensile Modulus | 3.34 GPa | 484 ksi | 1 mm/min; ISO 527 |
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SABIC Innovative Plastics LNP THERMOCOMP C7410 PC+ABS (Asia Pacific)
LNP* Thermocomp* C7410 compound is a talc-filled PC+ABS, nonhalogenated FR for thinwall molding applications.
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| Tensile Modulus | 3.34 GPa | 484 ksi | DIN EN ISO 527 |
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Wolf Kunststoff ZEDEX® ZX-530CD3 031 Polymer Alloy, Fiber Reinforced and PTFE Modified
Main Characteristics: Dimensionally stable and rigid; Stress resistant; Extremely low wear to 100 ° CApplications: Chemical Engineering; Laboratory Technology; Automitve Technology; Machine ToolsIn..
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| Tensile Modulus | 3.34 GPa | 485 ksi | Storage |
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Epoxy Technology EPO-TEK® H24 Electrically Conductive Epoxy
Product Description: EPO-TEK® H24 is a two component, electrically and thermally conductive epoxy adhesive designed for semiconductor die attach and hybrid micro-electronics assembly.Advantages & A..
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| Tensile Modulus | 3.34 GPa | 484 ksi | ASTM D-638 |
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Axiall 7765 Rigid PVC, Extrusion
Georgia Gulf 7765 is a general-purpose indoor rigid PVC profile extrusion compound designed for applications requiring the following properties. 7765 carries an NSF standard 51 listing (for food zo..
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