| Mechanical Properties | Metric | English | Comments |
|---|---|---|---|
| Tensile Modulus | 2.76 GPa | 400 ksi | Type I, 5.1 mm/min; ASTM D638 |
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PolyOne Geon™ Vinyl Packaging 4195 Polyvinyl Chloride, Rigid (PVC, Rigid)
Information provided by PolyOne
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| Tensile Modulus | 2.76 GPa | 400 ksi | Type I, 51 mm/min; ASTM D638 |
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PolyOne Nanoblend™ LST 5571 Polypropylene, Unspecified (PP, Unspecified)
Nanoblend compounds, formerly known as Maxxam LST, are LIGHT, STIFF AND TOUGH. Using nanoclay technology, these compounds deliver a combination of high stiffness and impact resistance to meet demand..
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| Tensile Modulus | 2.76 - 2.96 GPa | 400 - 429 ksi | ASTM D638 |
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Proto3000 Accura® 45HC Plastic Stereolithography (SLA) Prototyping Polymer
A high speed material, with excellent thermal and moisture resistance for producing functional prototypes in 3D Systems' SLA 250 systems.Benefits:Fast build speed:Provides build speeds that are sign..
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| Tensile Modulus | 2.76 GPa | 400 ksi | Type I, 5.1 mm/min; ASTM D638 |
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PolyOne Edgetek® X TR2-10GF/000 NATURAL Copolyester
The Edgetek™ engineering thermoplastics compounds made with Eastman Tritan™ copolyester offer a wide range of performance and properties with the addition of reinforcing additives. By utilizing Ea..
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| Tensile Modulus | 2.76 GPa | 400 ksi | Type I, 5.1 mm/min; ASTM D638 |
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PolyOne Geon™ Vinyl Dry Blend E6755 Polyvinyl Chloride, Rigid (PVC, Rigid)
Information provided by PolyOne
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| Tensile Modulus | 2.76 - 3.10 GPa | 400 - 450 ksi | ASTM D790 |
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Alcoa KAMA 2100 Prime Clear OPS, Film
(discontinued **)
CapabilitiesGauge: .001” to .004” (28 to 101µm)Width: .2” to 80” (50.8 to 2032mm)Core size: 3” and 6” standard cores, 8” availableRoll O.D.: various confiations availableCustom colors and ti..
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| Tensile Modulus | 2.76 - 3.10 GPa | 400 - 450 ksi | ASTM D790 |
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Alcoa KAMA 2200 Prime Graphic Arts OPS
(discontinued **)
CapabilitiesGauge: .001” to .004” (28 to 101µm)Width: .2” to 80” (50.8 to 2032mm)Core size: 3” and 6” standard cores, 8” availableRoll O.D.: various confiations availableCustom colors and ti..
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| Tensile Modulus | 2.76 GPa | 400 ksi | ASTM D638 |
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Quantum PET
Information provided by Quantum Advanced Engineering Plastics
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| Tensile Modulus | 2.76 GPa | 400 ksi | Type 1 - Rigids, 0.2 in/min; ASTM D638 |
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PolyOne Stat-Tech™ AS-10CP/000 Acrylonitrile Butadiene Styrene (ABS)
(discontinued **)
Description/Features:AntistaticConductive Carbon Powder FilledInformation provided by PolyOne Corporation.
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| Tensile Modulus | >= 2.76 GPa | >= 400 ksi | |
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Master Bond EP30QF Quartz Filled, Two Component Epoxy System
Master Bond Polymer System EP30QF is a quartz filled, two component epoxy for high performance bonding, sealing, coating and casting that is formulated to cure at room temperature or more rapidly at..
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| Tensile Modulus | 2.76 GPa | 400 ksi | ASTM D638 |
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Ensinger Tecamid® GF30 Extruded Nylon 6/6 30% glass-fiber-reinforced (PA66)
Tecamid® 6/6 GF30 is a 30% glass-fiber reinforced nylon 6/6 material whose important properties include high tensile and flexural strength, stiffness, excellent heat deflection temperature, and sup..
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| Tensile Modulus | 2.76 GPa | 400 ksi | ASTM D638 |
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Ensinger Tecapeek® XP-93 Compression Molded PEEK Compound, 30% PTFE Filled
Ensinger Special Polymers offers over twenty different VICTREX® PEEK blends to choose from and has the capability to blend custom compounds for specific applications. Compression molding results in..
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| Tensile Modulus | 2.75 GPa | 400 ksi | Storage |
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Epoxy Technology EPO-TEK® 431 Copper Filled Epoxy
A two component, copper-filled, electrically and thermally conductive epoxy for adhesive bonding in electronics. It may be used at the PCB level for interconnecting, grounding and EMI RF shielding...
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| Tensile Modulus | 2.76 GPa | 400 ksi | TM R050-36 |
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Resinlab® EP1296 Highly Filled, Moderately Thixotropic Black Casting Resin
Resinlab™ EP1296 is a highly filled, moderately thixotropic black casting resin designed for applications requiring good thermal conductivity, low shrinkage and a low CTE. It was especially formula..
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| Tensile Modulus | >= 2.76 GPa | >= 400 ksi | |
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Master Bond Supreme 10HTND-3 Non-Drip Epoxy Resists High Temperatures
Description: Master Bond Supreme 10HTND-3 features a blend of performance properties including both high shear and peel strengths along with a totally non-drip application feature. This one componen..
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