Polymer Property : Shear Strength = 11.7 MPa Product List

Mechanical Properties

Tips: 30 items are displayed at most.

Mechanical Properties	Metric	English	Comments
Shear Strength	11.7 MPa	1700 psi	Cured 1 hour at 125°C, Au/Au
Resin Technology Group TIGA 908 Gold Bonder - Low Stress Silver Conductive 100 parts resin to 6 parts hardener.TIGA 908 is a low stress, conductive silver filled epoxy adhesive. It is recommended for bonding, and sealing electronic applications which require bonding to gol..
Shear Strength	>= 11.7 MPa	>= 1700 psi	Die
Epoxy Technology EPO-TEK® 301-1 Optical Grade Epoxy Material Description: A two component, room temperature curing, optical grade epoxy, designed for optics, medical, and opto-electronic packaging of semiconductor devices, components, and electronics..
Shear Strength	>= 11.7 MPa	>= 1700 psi	Die
Epoxy Technology EPO-TEK® 302 Fast Setting, Optical Epoxy Product Description: EPO-TEK® 302 is a two component, fast-gelling, room temperature curing epoxy, designed for electronic, optical, medical, and general applications. Advantages & Application No..
Shear Strength	>= 11.7 MPa	>= 1700 psi	Die
Epoxy Technology EPO-TEK® E2001 Electrically Conductive, Silver-Filled Epoxy Product Description: EPO-TEK® E2001 is a two component, silver-filled, electrically conductive epoxy designed for semiconductor die attach applications using a snap-cure profile. Advantages & Appl..
Shear Strength	>= 11.7 MPa	>= 1700 psi	Die
Epoxy Technology EPO-TEK® E2036 Epoxy Product Description: A two component, slightly flexible, silver-filled, electrically conductive adhesive for semiconductor and electronic assemblies. It is a low Tg epoxy, intended for many kinds o..
Shear Strength	>= 11.7 MPa	>= 1700 psi	Die
Epoxy Technology EPO-TEK® E4110 Electrically Conductive, Silver Epoxy Product Description: EPO-TEK® E4110 is an electrically conductive, silver-filled epoxy paste. This two component system is designed for low temperature curing from ambient to 80°C, although other..
Shear Strength	>= 11.7 MPa	>= 1700 psi	Die
Epoxy Technology EPO-TEK® EE165-3 Silver Filled Epoxy A two component, silver-filled, electrically conductive epoxy made for bonding of SMDs, and general solder replacement at the PCB level and circuit assembly. It was designed to be low modulus and f..
Shear Strength	>= 11.7 MPa	>= 1700 psi	Die after 1000 hrs 85C/85%R
Epoxy Technology EPO-TEK® EK1000 Epoxy Material Description: A single component, silver-filled adhesive that exhibits exceptional thermal and electrical conductivity along with a shiny silver appearance making it ideal for the demanding ..
Shear Strength	>= 11.7 MPa	>= 1700 psi	Die after 1000 hrs 85C/85%R
Epoxy Technology EPO-TEK® EK2000 Epoxy Preliminary Product Information SheetMaterial Description: A two component, silver-filled adhesive that exhibits exceptional thermal and electrical conductivity along with a shiny silver appearance ..
Shear Strength	>= 11.7 MPa	>= 1700 psi	Die
Epoxy Technology EPO-TEK® H20E-8 Electrically Conductive, Silver Epoxy Product Description: EPO-TEK® H20E-8 is a two component, silver-filled epoxy system designed specifically for chip bonding in microelectronic and optoelectronic applications. It is a higher viscos..
Shear Strength	>= 11.7 MPa	>= 1700 psi	Die
Epoxy Technology EPO-TEK® H20E-MP Electrically Conductive, Silver Epoxy Product Description: EPO-TEK® H20E-MP is a two component, 100% solids silver-filled epoxy system designed specifically for chip bonding in microelectronic and optoelectronic applications. It is al..
Shear Strength	>= 11.7 MPa	>= 1700 psi	Die
Epoxy Technology EPO-TEK® H20S Electrically Conductive, Silver Epoxy for Die Stamping Product Description: EPO-TEK® H20S is a modified version of EPO-TEK® H20E, designed primarily for die stamping and dispensing techniques for chip bonding. EPO-TEK®H20S is a highly reliable, two ..
Shear Strength	>= 11.7 MPa	>= 1700 psi	Die
Epoxy Technology EPO-TEK® H22 Electrically Conductive, Silver Epoxy Product Description: EPO-TEK® H22 is a two component, silver-filled epoxy system designed specifically for die bonding and sealing hybrid circuit packages.Advantages & Application Notes: A smooth, ..
Shear Strength	>= 11.7 MPa	>= 1700 psi	Die
Epoxy Technology EPO-TEK® H24 Electrically Conductive Epoxy Product Description: EPO-TEK® H24 is a two component, electrically and thermally conductive epoxy adhesive designed for semiconductor die attach and hybrid micro-electronics assembly.Advantages & A..
Shear Strength	>= 11.7 MPa	>= 1700 psi	Die
Epoxy Technology EPO-TEK® H31D Electrically Conductive, Silver Epoxy Product Description: EPO-TEK® H31D is a single component, electrically conductive silver epoxy designed for die-bonding of semiconductors, including IC’s, resistors, capacitors, transistors, and d..
Shear Strength	>= 11.7 MPa	>= 1700 psi	Die
Epoxy Technology EPO-TEK® H31LV Electrically Conductive, Silver Epoxy Product Description: EPO-TEK® H31LV is a single component, silver-filled, electrically conductive epoxy designed for semiconductor die attach applications found in hybrids, JEDEC, and opto-electron..
Shear Strength	>= 11.7 MPa	>= 1700 psi	Die
Epoxy Technology EPO-TEK® H55 Epoxy Material Description: A two component, thixotropic and high temperature epoxy designed to be used for hybrids and PCB applications.Information Provided by Epoxy Technology
Shear Strength	>= 11.7 MPa	>= 1700 psi	Die
Epoxy Technology EPO-TEK® H20E Electrically Conductive, Silver Epoxy Product Description: EPO-TEK® H20E is a two component, 100% solids silver-filled epoxy system designed specifically for chip bonding in microelectronic and optoelectronic applications. It is also ..
Shear Strength	>= 11.7 MPa	>= 1700 psi	Die
Epoxy Technology EPO-TEK® H20E-LV Electrically Conductive, Silver Epoxy Product Description: EPO-TEK® H20E-LV is a two component, 100% solids silver-filled epoxy system designed specifically for chip bonding in microelectronic and optoelectronic applications. It is a ..
Shear Strength	>= 11.7 MPa	>= 1700 psi	Die
Epoxy Technology EPO-TEK® H31 Electrically Conductive, Silver Epoxy Product Description: EPO-TEK® H31 is a single component, silver-filled, electrically conductive epoxy designed for semiconductor die attach applications found in hybrids, JEDEC, and opto-electronic..
Shear Strength	11.7 MPa	1700 psi	Overlap, Cold Rolled Steel
3M Scotch-Weld™ DP100 Plus Clear Epoxy Adhesive 3M™ Scotch-Weld™ Epoxy Adhesive DP100 Plus Clear is a fast setting, two-part, 1:1 mix ratio mercaptan-cured epoxy adhesive. It is a unique among fast setting mercaptan cure epoxies in that it comb..
Shear Strength	11.7 MPa	1700 psi	Die, @ 23°C: = 5 Kg
Atom Adhesives AA-BOND G298 Epoxy Adhesive AA-BOND G298 is a two component, gold-filled, electrically and thermally conductive epoxy designed for hybrid microelectronic and semiconductor packaging.Appearance: Resin: Brown, Hardener: Dark Bro..
Shear Strength	11.7 MPa	1700 psi	Overlap, CRS/CRS; ASTM D1002
3M Scotch-Weld™ 2216 B/A Gray Epoxy Adhesive 3M™ Scotch-Weld™ Epoxy Adhesive 2216 B/A is a flexible, two-part, room temperature curing epoxy with high peel and shear strength. Scotch-Weld epoxy adhesive 2216 B/A is identical to 3M Scotch-Wel..