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Polymer Property : Minimum Service Temperature, Air = -269 °C Product List
Thermal PropertiesTips: 30 items are displayed at most.
| Thermal Properties | Metric | English | Comments |
|---|---|---|---|
| Minimum Service Temperature, Air | -269 - -46.1 °C | -452 - -51.0 °F | Average value: -94.4 °C Grade Count:12 |
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Overview of materials for Epoxy, Cast, Unreinforced
This property data is a summary of similar materials in the MatWeb database for the category "Epoxy, Cast, Unreinforced". Each property range of values reported is minimum and maximum values of appr..
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| Minimum Service Temperature, Air | -269 - 15.6 °C | -453 - 60.0 °F | Average value: -62.8 °C Grade Count:115 |
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Overview of materials for Epoxy Encapsulant, Unreinforced
This property data is a summary of similar materials in the MatWeb database for the category "Epoxy Encapsulant, Unreinforced". Each property range of values reported is minimum and maximum values o..
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| Minimum Service Temperature, Air | -269 - -20.0 °C | -452 - -4.00 °F | Average value: -58.3 °C Grade Count:47 |
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Overview of materials for Epoxy, High Temperature
This property data is a summary of similar materials in the MatWeb database for the category "Epoxy, Encapsulating, Mineral Filled". Each property range of values reported is minimum and maximum val..
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| Minimum Service Temperature, Air | -269 °C | -452 °F | Continuous; DIN 52612 |
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Isoflon PEHD 1000 High Density Polyethylene
Products with excellent friction, anti-stick, abrasion and chemical inertia characteristicsVery good impact resistanceNo moisture regainProduct for the food industryInformation provided by Isoflon.
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| Minimum Service Temperature, Air | <= -269 °C | <= -452 °F | |
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Special Metals INCOLOY® alloy 908
INCOLOY® alloy 908 (UNS N09908) is an age-hardenable nickel-iron alloy which exhibits a low coefficient of thermal expansion, high tensile strength, high fracture and impact toughness, fatigue cr..
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| Minimum Service Temperature, Air | -269 °C | -452 °F | |
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Master Bond EP21TDCNFL Two Component Nickel Conductive Epoxy Adhesive
Master Bond Polymer System EP21TDCNFL is a two component, nickel filled, electrically conductive system for high performance bonding and sealing formulated to cure at room temperature or more rapidl..
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| Minimum Service Temperature, Air | -269 °C | -452 °F | |
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Master Bond EP21TDCSFL Flexible Two Component Silver Conductive Epoxy
Master Bond Polymer System EP21TDCSFL is a two component, silver filled, electrically conductive system for high performance bonding and sealing formulated to cure at room temperature or more rapidl..
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| Minimum Service Temperature, Air | -269 °C | -453 °F | |
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Master Bond EP30FL Low Viscosity, Flexibilized Two Component Epoxy
Master Bond Polymer System EP30FL is a low viscosity, flexibilized, two component epoxy resin system for high performance potting, casting, encapsulation as well as bonding and sealing. Master Bond ..
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| Minimum Service Temperature, Air | -269 °C | -453 °F | |
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Master Bond EP37-3FLF Low Exotherm Highly Flexible Two Component Epoxy
Master Bond Polymer System EP37-3FLF is a very flexible, low viscosity, optically clear two component epoxy resin system designed for high performance bonding, coating and casting applications. The ..
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| Minimum Service Temperature, Air | -269 °C | -453 °F | |
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Master Bond EP51 Fast Curing High Bond Strength Epoxy Adhesive
Master Bond Polymer Adhesive EP51 is a fast "5 minute" curing two component epoxy adhesive for general purpose bonding formulated to cure at room temperature with a one-to-one mix ratio by weight or..
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| Minimum Service Temperature, Air | -269 °C | -453 °F | |
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Master Bond Supreme 10HT One Component, Low Outgassing, Toughened Epoxy System
Master Bond Supreme 10HT features a unique blend of performance properties including both high shear and peel strengths along with convenient handling. Supreme 10HT is room temperature storable and ..
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| Minimum Service Temperature, Air | -269 °C | -453 °F | |
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Master Bond Supreme 10HTF Fast Curing Toughened One Component Epoxy Adhesive
Master Bond Polymer System Supreme 10HTF is a one part, no-mix system featuring a unique combination of properties including high shear and peel strength, exceptionally wide service temperature rang..
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| Minimum Service Temperature, Air | -269 °C | -453 °F | |
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Master Bond EP29LPSP Low Outgassing, Optically Clear Two Component Epoxy
Master Bond Polymer System EP29LPSP is a two component, high performance, modified low temperature heat cured epoxy system specially formulated for cryogenic applications. EP29LPSP is serviceable at..
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| Minimum Service Temperature, Air | -269 °C | -453 °F | |
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Master Bond EP30DP Abrasion Resistant Cryogenic Epoxy Urethane System
Master Bond Polymer System EP30DP is a versatile, two component, epoxy-urethane elastomeric compound, featuring superior strength, toughness, and abrasion resistance for high performance bonding, se..
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| Minimum Service Temperature, Air | -269 °C | -452 °F | Maintains properties and flexibility |
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DuPont™ Kapton® 100HN Polyimide Film, 25 Micron Thickness
Film thickness 25 micron (1.0 mil)All purpose polyimide film. Can be laminated, diecut, slit, formed, or adhesive-coated. Available in thicknesses from 0.3 mil (7.5 µm) to 5 mil (125 µm).General..
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| Minimum Service Temperature, Air | -269 °C | -452 °F | Maintains properties and flexibility |
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DuPont™ Kapton® 100KN Polyimide Film, 25 Micron Thickness
Film thickness 25 micron (1.0 mil)Excellent processability, CTE close to copper, and a moderately high modulus.General Kapton® information: Kapton® is synthesized by polymerizing an aromatic dian..
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| Minimum Service Temperature, Air | -269 °C | -452 °F | Maintains properties and flexibility |
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DuPont™ Kapton® 300KN Polyimide Film, 75 Micron Thickness
Film thickness 75 micron (3.0 mil)Excellent processability, CTE close to copper, and a moderately high modulus.General Kapton® information: Kapton® is synthesized by polymerizing an aromatic dian..
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| Minimum Service Temperature, Air | -269 °C | -452 °F | Maintains properties and flexibility |
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DuPont™ Kapton® 500FPC Polyimide Film, 125 Micron Thickness
Film thickness 125 micron (5.0 mil)All purpose polyimide film. Can be laminated, diecut, slit, formed, or adhesive-coated. Similar to Kapton® Type VN with improved bondability. Available in thic..
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| Minimum Service Temperature, Air | -269 °C | -452 °F | Maintains properties and flexibility |
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DuPont™ Kapton® 50EN Polyimide Film, 13 Micron Thickness
Film thickness 13 micron (0.5 mil)Kapton® Type E and EN films have superior dimensional stability, low CHE, a CTE close to copper, and a high modulus. This type is exceptional for applications req..
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| Minimum Service Temperature, Air | -269 °C | -452 °F | Maintains properties and flexibility |
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DuPont™ Kapton® 50FPC Polyimide Film, 13 Micron Thickness
Film thickness 13 micron (0.5 mil)All purpose polyimide film. Can be laminated, diecut, slit, formed, or adhesive-coated. Similar to Kapton® Type VN with improved bondability. Available in thick..
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| Minimum Service Temperature, Air | -269 °C | -452 °F | Maintains properties and flexibility |
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DuPont™ Kapton® 50HN Polyimide Film, 13 Micron Thickness
Film thickness 13 micron (0.5 mil)All purpose polyimide film. Can be laminated, diecut, slit, formed, or adhesive-coated. Available in thicknesses from 0.3 mil (7.5 µm) to 5 mil (125 µm).General..
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| Minimum Service Temperature, Air | -269 °C | -452 °F | Maintains properties and flexibility |
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DuPont™ Kapton® 50VN Polyimide Film, 13 Micron Thickness
Film thickness 13 micron (0.5 mil)All purpose polyimide film. Can be laminated, diecut, slit, formed, or adhesive-coated. Similar to Kapton® Type HN with added dimensional stability. Available i..
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| Minimum Service Temperature, Air | -269 °C | -452 °F | Maintains properties and flexibility |
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DuPont™ Kapton® 50ZT Polyimide Film, 13 Micron Thickness
Film thickness 13 micron (0.5 mil)All purpose polyimide film. Can be laminated, diecut, slit, formed, or adhesive-coated. Similar to Kapton® Type VN and HN with superior bondability. Available i..
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| Minimum Service Temperature, Air | -269 °C | -452 °F | Maintains properties and flexibility |
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DuPont™ Kapton® 100FPC Polyimide Film, 25 Micron Thickness
Film thickness 25 micron (1.0 mil)All purpose polyimide film. Can be laminated, diecut, slit, formed, or adhesive-coated. Similar to Kapton® Type VN with improved bondability. Available in thick..
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| Minimum Service Temperature, Air | -269 °C | -452 °F | Maintains properties and flexibility |
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DuPont™ Kapton® 200HN Polyimide Film, 50 Micron Thickness
Film thickness 50 micron 2.0 mil)All purpose polyimide film. Can be laminated, diecut, slit, formed, or adhesive-coated. Available in thicknesses from 0.3 mil (7.5 µm) to 5 mil (125 µm).General ..
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