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Polymer Property : Minimum Service Temperature, Air = -55.0 °C Product List
Thermal PropertiesTips: 30 items are displayed at most.
| Thermal Properties | Metric | English | Comments |
|---|---|---|---|
| Minimum Service Temperature, Air | -55.0 °C | -67.0 °F | Recommended use; SAE J-2236 |
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Rogers Corporation Bisco™ HT-820 Cellular Silicone Foam
Firm grade silicone sponge. UL recognized for flame retardance.Applications: Gaskets where higher closure force is available or necessary, Cushions in heavier-load applicationsGasketing and sealing..
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| Minimum Service Temperature, Air | -55.0 °C | -67.0 °F | |
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P & P Technology EC-H Silver Copper Loaded Fluorosilicone
P & P Technology material reference EC-H is a printing grade fluorosilicone elastomer with a Silver/Copper conductive filler and is green in color. The material is specially compounded to offer exc..
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| Minimum Service Temperature, Air | -55.0 °C | -67.0 °F | |
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P & P Technology EC-H Silver Copper Loaded Silicone
P & P Technology material reference EC-H is a printing grade silicone elastomer with a Silver/Copper conductive filler and is Tan in color. The material is specially compounded to offer excellent p..
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| Minimum Service Temperature, Air | -55.0 °C | -67.0 °F | |
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Parker Chomerics Tecknit Consil®-N 891 Silver-Nickel Filled Silicone Elastomer
Description: CONSIL-N is a silicone elastomer filled with silver-plated nickel particles and designed to provide high shielding effectiveness and corrosion resistance. CONSIL-N is available in sheet..
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| Minimum Service Temperature, Air | -55.0 °C | -67.0 °F | |
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NextGen Adhesives G907-21 Structural Epoxy Adhesive
Description: NGAC G907-21 is a high viscosity and thixotropic adhesive system that is specifically formulated for structural bonding applications: industrial, electronics and aerospace.Advantages an..
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| Minimum Service Temperature, Air | -55.0 °C | -67.0 °F | |
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ITW Plexus Plexusâ„¢ MA420FS Methacrylate Adhesive
Two-part adhesive designed for structural bonding of thermoplastic, metal, and composite assemblies.All purpose adhesive, very fast curing.Information provided by Illinois Tool Works.
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| Minimum Service Temperature, Air | -55.0 °C | -67.0 °F | |
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ITW Plexus Plexusâ„¢ MA555 Methacrylate Adhesive
Two-part adhesive designed for structural bonding of thermoplastic, metal, and composite assemblies.Low exotherm adhesive able to be used 1" thick.Information provided by Illinois Tool Works.
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| Minimum Service Temperature, Air | -55.0 °C | -67.0 °F | |
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Trelleborg Emerson & Cuming Eccobond® 930-09 Low Temperature Performance Lighting Epoxy Adhesive
Emerson & Cuming 930-09 Eccobond® Low Temperature Performance Lighting Epoxy AdhesiveFlexible, non-blushing, epoxy adhesive for glass headlamp bonding. Maintains flexibility at temperatures as low ..
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| Minimum Service Temperature, Air | -55.0 °C | -67.0 °F | Intermittent |
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Epoxy Technology EPO-TEK® 301-2 Optically Transparent Epoxy
Product Description: EPO-TEK® 301-2 is a two component optical, medical, and semiconductor grade epoxy resin, with low viscosity, long pot-life, and good handling characteristics.Advantages & Appli..
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| Minimum Service Temperature, Air | -55.0 °C | -67.0 °F | Intermittent |
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Epoxy Technology EPO-TEK® 302 Fast Setting, Optical Epoxy
Product Description: EPO-TEK® 302 is a two component, fast-gelling, room temperature curing epoxy, designed for electronic, optical, medical, and general applications. Advantages & Application No..
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| Minimum Service Temperature, Air | -55.0 °C | -67.0 °F | Continuous |
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Epoxy Technology EPO-TEK® 320NC-2 Optically Opaque Epoxy
Material Description: A two component, black colored and optically opaque epoxy designed for optical, medical, and opto-electronic packaging of semiconductor devices and components. It is a modific..
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| Minimum Service Temperature, Air | -55.0 °C | -67.0 °F | Intermittent |
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Epoxy Technology EPO-TEK® 337H Graphite-Filled, High Temperature Epoxy
Product Description: EPO-TEK® 377H is a two component, high Tg, graphite filled epoxy designed for ESD/EMI shielding of semiconductor devices and electronics. It can be used in many electronic ind..
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| Minimum Service Temperature, Air | -55.0 °C | -67.0 °F | Intermittent |
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Epoxy Technology EPO-TEK® 353ND Black High Temperature Epoxy
Product Description: EPO TEK® 353ND Black is a a two component, high temperature epoxy designed for semiconductor, hybrid, fiber optic, and medical applicationsAdvantages & Application Notes: EPO T..
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| Minimum Service Temperature, Air | -55.0 °C | -67.0 °F | Continuous |
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Epoxy Technology EPO-TEK® 353ND-T Black High Temperature Thixotropic Epoxy
Product Description: EPO-TEK® 353ND-T Black is a two component, high temperature, thixotropic epoxy for fiber optic, PCB and various medical applications. Advantages & Application Notes: This produ..
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| Minimum Service Temperature, Air | -55.0 °C | -67.0 °F | Intermittent |
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Epoxy Technology EPO-TEK® 353ND-T1 High Temperature Thixotropic Epoxy
Material Description: A two component, thixotropic and high temperature epoxy designed for fiber optic, electronics and medical applications. It is a more viscous alternative to EPO-TEK® 353ND-T.I..
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| Minimum Service Temperature, Air | -55.0 °C | -67.0 °F | Intermittent |
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Epoxy Technology EPO-TEK® ED1021 Epoxy
Preliminary Product Information SheetMaterial Description: A single component, silver-filled epoxy designed for low power semiconductor LED die attach applications. Unique features include its abil..
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| Minimum Service Temperature, Air | -55.0 °C | -67.0 °F | Intermittent |
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Epoxy Technology EPO-TEK® H54 High Temperature Epoxy
Product Description: EPO-TEK® H54 is a two component, high Tg, electrically and thermally insulating epoxy adhesive for general bonding and high temperature packaging in medical, hybrid, and optica..
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| Minimum Service Temperature, Air | -55.0 °C | -67.0 °F | Intermittent |
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Epoxy Technology EPO-TEK® OE138 Two Component Epoxy
Material Description: A two component epoxy with intermediate viscosity range between EPO-TEK® 353ND and EPO-TEK® 353ND-T. It is designed for semiconductor glob top applications, as well as use in..
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| Minimum Service Temperature, Air | -55.0 °C | -67.0 °F | Continuous |
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Epoxy Technology EPO-TEK® OG159-2 UV Cure Optical Epoxy
Material Description: A single component, high viscosity, UV curable epoxy adhesive designed for sealing glass plates together in the LCD/OLED/display industry. It contains 1mil glass beads for bon..
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| Minimum Service Temperature, Air | -55.0 °C | -67.0 °F | |
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Epoxyset Epoxiohm EO-23M Electrically Conductive Epoxy Adhesive
EO-23M is an electrically conductive, low viscosity silver-filled epoxy adhesive. Used for hybrid / micro-electronic adhesive including die-attach and substrate attach for Rf and Microwave devices.I..
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| Minimum Service Temperature, Air | -55.0 °C | -67.0 °F | Intermittent |
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Epoxy Technology EPO-TEK® H31 Electrically Conductive, Silver Epoxy
Product Description: EPO-TEK® H31 is a single component, silver-filled, electrically conductive epoxy designed for semiconductor die attach applications found in hybrids, JEDEC, and opto-electronic..
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| Minimum Service Temperature, Air | -55.0 °C | -67.0 °F | |
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ACC QGel 301 QSI Quantum Silicones High Strength Gel
QGel 301 is a clear, very soft, tough, moderately cross-linked, silicone polymer. Silicone gels are used to provide protection from vibration, thermal or mechanical shock. Silicone gels also provide..
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| Minimum Service Temperature, Air | -55.0 °C | -67.0 °F | Continuous |
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Atom Adhesives AA-SUPERTHERM 195 Epoxy Adhesive
AA-SUPERTHERM 195 is a two component, thermally conductive epoxy system recommended for staking transistors, diodes, resistors, integrated circuits and other heat sensitive components to printed cir..
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