Polymer Property : Minimum Service Temperature, Air = -67.0 °F Product List

Thermal Properties

Tips: 30 items are displayed at most.

Thermal Properties	Metric	English	Comments
Minimum Service Temperature, Air	-55.0 °C	-67.0 °F	Flex TR10
Parker Chomerics CHO-SEAL® 6503 Conductive Elastomer Description: Highest performance in harsh environments; excellent shielding; best choice for corrosion requirements against aluminum.Molded and ExtrudedRoHS CompliantInformation provided by Chomeric..
Minimum Service Temperature, Air	-55.0 °C	-67.0 °F	Cured
Parker Chomerics Tecknit® 73-00008 Electrically Conductive Acrylic and Polyurethane Paint Description: TECKNIT manufactures a highly conductive acrylic and polyurethane paints filled with silver. These coatings provide a cost effective method for shielding and grounding plastic enclosure..
Minimum Service Temperature, Air	-55.0 °C	-67.0 °F	Cured
Parker Chomerics Tecknit CON/RTV-Ni 2 Part Nickel Filled RTV Description: TECKNIT electrically conductive, medium viscosity adhesive- sealant system. It is formulated with a special conductive material producing its own unique advantages. After full cure, the..
Minimum Service Temperature, Air	-55.0 °C	-67.0 °F
Parker Chomerics Tecknit Teckfip™ FIP-N Formed in Place Conductive Elastomer Description: FIP-N is similar in performance to FIP-A elastomer and hence offers a good non-corrosive EMI shield in harsh conditions. This material is one of our more cost effective FIP compoundsInf..
Minimum Service Temperature, Air	-55.0 °C	-67.0 °F	Glass
Parker Chomerics Tecknit Teckshield®-F 100 OPI 0.0022" Diameter Wire, High Performance EMC Window Description: TECKSHIELD-F high-performance fully laminated flat windows are specially designed to provide optimum optical transmission and EMI shielding in severe interference environments. TECKSHIE..
Minimum Service Temperature, Air	-55.0 - -40.0 °C	-67.0 - -40.0 °F	Average value: -51.7 °C Grade Count:39
Overview of materials for Methacrylate Adhesive This property data is a summary of similar materials in the MatWeb database for the category "Methacrylate Adhesive". Each property range of values reported is minimum and maximum values of appropri..
Minimum Service Temperature, Air	-55.0 Â°C	-67.0 Â°F
ITW Plexus Plexusâ„¢ MA3940 Methacrylate Adhesive Two-part adhesive designed for structural bonding of thermoplastic, metal, and composite assemblies.Use with craze sensitive plastics.Information provided by Illinois Tool Works.
Minimum Service Temperature, Air	-55.0 °C	-67.0 °F
Cytec EN-2521 (Conap) Potting and Encapsulation Adhesive Polyurethane Potting and Encapsulating SystemsConathane® EN-2500 series polyurethane potting and encapsulating systems from Cytek have varying degrees of worklife, viscosity and hardness for many s..
Minimum Service Temperature, Air	-55.0 °C	-67.0 °F
Cytec EN-2534 (Conap) Potting and Encapsulation Adhesive Polyurethane Potting and Encapsulating SystemsConathane® EN-2500 series polyurethane potting and encapsulating systems from Cytek have varying degrees of worklife, viscosity and hardness for many s..
Minimum Service Temperature, Air	-55.0 °C	-67.0 °F	Intermittent
Epoxy Technology EPO-TEK® 323LP Epoxy Material Description: Longer pot life version of EPO-TEK® 353ND designed for semiconductor, hybrid, fiber-optic, hard-disk drive and medical applications.Information Provided by Epoxy Technology
Minimum Service Temperature, Air	-55.0 °C	-67.0 °F	Intermittent
Epoxy Technology EPO-TEK® B9021-6 Epoxy Paste Material Description: A single component, B-stageable epoxy paste for semiconductor, microelectronics, and optical assemblies. It can be used in hybrid assemblies for lid-sealing and substrate atta..
Minimum Service Temperature, Air	-55.0 °C	-67.0 °F	Intermittent
Epoxy Technology EPO-TEK® E2001 Electrically Conductive, Silver-Filled Epoxy Product Description: EPO-TEK® E2001 is a two component, silver-filled, electrically conductive epoxy designed for semiconductor die attach applications using a snap-cure profile. Advantages & Appl..
Minimum Service Temperature, Air	-55.0 °C	-67.0 °F	Continuous
Epoxy Technology EPO-TEK® E3001-HV Electrically Conductive, Silver Epoxy Product Description: EPO-TEK® E3001-HV is a snap cure, single component, silver-filled die attach adhesive for semiconductor plastic IC packaging. Also available in a frozen syringe. Advantages & ..
Minimum Service Temperature, Air	-55.0 °C	-67.0 °F	Continuous
Epoxy Technology EPO-TEK® H55 Epoxy Material Description: A two component, thixotropic and high temperature epoxy designed to be used for hybrids and PCB applications.Information Provided by Epoxy Technology
Minimum Service Temperature, Air	-55.0 °C	-67.0 °F	Intermittent
Epoxy Technology EPO-TEK® OE120 Two Component Epoxy Material Description: A two component, opaque epoxy, designed for fiber optics packaging applications. It is a black-colored version of EPO-TEK 353ND-T. It has a high Tg for resisting elevated ope..
Minimum Service Temperature, Air	-55.0 °C	-67.0 °F	Intermittent
Epoxy Technology EPO-TEK® OG116-31 UV Cure Optical Epoxy Product Description: EPO-TEK® OG116-31 is a single component, UV curable epoxy adhesive and encapsulant, designed for PCB and circuit assembly applications found in semiconductor, computer, medical..
Minimum Service Temperature, Air	-55.0 °C	-67.0 °F	Continuous
Epoxy Technology EPO-TEK® OG133-8 UV Cure Optical Epoxy Material Description: A single component, UV curable, thixotropic flexible epoxy adhesive/encapsulant designed for semiconductor and opto-electronic packaging. Glob top over IC and wire bonds, and ..
Minimum Service Temperature, Air	-55.0 °C	-67.0 °F	Intermittent
Epoxy Technology EPO-TEK® T7139 Glob Top Epoxy Product Description: EPO-TEK® T7139 is a two component, electrically insulating, encapsulating epoxy designed for semiconductor glob top applications and package assembly.Advantages & Application N..
Minimum Service Temperature, Air	-55.0 °C	-67.0 °F
Cytec EN-2555 (Conap) Potting and Encapsulation Adhesive Polyurethane Potting and Encapsulating SystemsConathane® EN-2500 series polyurethane potting and encapsulating systems from Cytek have varying degrees of worklife, viscosity and hardness for many s..
Minimum Service Temperature, Air	-55.0 °C	-67.0 °F
ACC QM 245 QSI Quantum Silicones 45 Durometer Addition Cure Moldmaking Material QM 245 is a two component, room temperature addition cure silicone material. The cured rubber has excellent mechanical properties and good shelf-life stability. This material is a good choice for th..
Minimum Service Temperature, Air	-55.0 °C	-67.0 °F
ACC QM 260 QSI Quantum Silicones 60 Durometer Addition Cure Moldmaking Material QM 260 is a two component, room temperature addition cure silicone material. The cured rubber has excellent mechanical properties and good shelf-life stability. This material is a good choice for th..
Minimum Service Temperature, Air	-55.0 °C	-67.0 °F
Parker Chomerics CHO-BOND 1024 Conductive Silicone Splicing Compound Conductive splicing compounds are intended for making "custom" EMI/RFI gaskets from standard CHO-SEAL® and CHO-SIL® strips. Compounds consist of Chomerics silver-bearing powders dispersed in silic..
Minimum Service Temperature, Air	-55.0 °C	-67.0 °F
Dow Corning 3112 RTV SILICONE RUBBER Moldmaking RTV Rubber; Potting and encapsulating of electrical/electronic productsInformation provided by Dow Corning
Minimum Service Temperature, Air	-55.0 °C	-67.0 °F
ACC QSil 12 QSI Quantum Silicones Clear Low Viscosity for Potting Material QSil 12 is a clear, transparent, low viscosity, two-component, liquid silicone material which cures at room temperature and is primarily intended for potting applications. This material is typically..