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Polymer Property : Glass Transition Temp, Tg = 100 °C Product List
Thermal PropertiesTips: 30 items are displayed at most.
| Thermal Properties | Metric | English | Comments |
|---|---|---|---|
| Glass Transition Temp, Tg | 100 °C | 212 °F | ISO 11357-1 |
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Murtfeldt Murinit® SP Polyphenylene Sulfide
Thanks to the low fiber content and integrated solid lubricant, Murinit® SP offers an excellent combination of good slide and wear behavior, high strength, and dimensional stability – even at high..
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| Glass Transition Temp, Tg | 100 °C | 212 °F | |
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NextGen Adhesives P907-03 Fiber Optic Adhesive
Description: NGAC P907-03 is a low viscosity and room temperature curing adhesive specifically formulated for fiber optic terminations.Advantages and Applications: Uses include the termination of si..
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| Glass Transition Temp, Tg | 100 °C | 212 °F | |
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Eastman Tenite 130-33 Cellulose Acetate
(discontinued **)
33% Plasticized, contains 100% fiber grade ester.ISO data as provided by the manufacturer, Eastman Chemical.
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| Glass Transition Temp, Tg | 100 - 110 °C | 212 - 230 °F | |
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Hybrid Plastics POSS® EP 1000 Epoxy Adhesive
EP1000 is a POSS® based epoxy adhesive with outstanding oxidative resistance to ozone, plasma, or atomic oxygen environments. The EP1000 POSS® Epoxy is also well-suited for peroxide and steam...
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| Glass Transition Temp, Tg | 100 °C | 212 °F | |
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Styron DL 220 Plastic Pigment
Performance Features: High stiffness, fast solvent penetrationApplications: Leather BindingEuropeInformation provided by Styron
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| Glass Transition Temp, Tg | 100 °C | 212 °F | |
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Zeon Chemicals Zeonor® 1060R Cyclo-Olefin Polymer
Zeonor 1020R shall be in the form of pellets.
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| Glass Transition Temp, Tg | 100 °C | 212 °F | |
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Zeus PFA Tubing
PFA, or perfluoroalkoxy, is well recognized for its ability to maintain mechanical integrity in extreme temperatures even when exposed to caustic chemicals. PFA comes in high purity versions that ar..
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| Glass Transition Temp, Tg | 100 °C | 212 °F | DMA |
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Hexcel® HexPly® ES70 120°C Curing Epoxy Matrix
HexPly® ES70 is a structural epoxy resin particularly well adapted to low pressure molding processes. This system is versatile and allows a polymerization from 100°C (212°F) up to 150°C (302°F)..
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| Glass Transition Temp, Tg | 100 °C | 212 °F | Ultimate Tg |
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Tra-Con Tra-Bond 931-1 Low Viscosity Encapsulant
TRA-BOND 931-1 low viscosity epoxy encapsulant is designed for high reliability applications, where capillary action is desired. This encapsulant provides environmental and mechanical protection.Inf..
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| Glass Transition Temp, Tg | 100 °C | 212 °F | Ultimate Tg |
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Tra-Con Tra-Bond FDA15 Food and Drug Application Epoxy Adhesive
TRA-BOND FDA-15 is a low viscosity epoxy resin system specifically developed for bonding and coating applications in accordance with Title 21, U.S. Code of Federal Regulations, Food and Drug Adminis..
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| Glass Transition Temp, Tg | 100 °C | 212 °F | |
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Hexcel® HexPly® M32 Epoxy Matrix
HexPly® M32 is specifically designed for prepreg applications with fabrics and short curing cycles for sporting (e.g. ski and snowboard production) and industrial applications. HexPly® M32 compris..
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| Glass Transition Temp, Tg | 100 °C | 212 °F | DSC |
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Eastman Sahara Film
Sahara Films are developed for use in applications where increased temperature resistance is desired.Applications/UsesHigh temperature printable films
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| Glass Transition Temp, Tg | >= 100 °C | >= 212 °F | Dynamic Cure 20—200°C /ISO 25 Min; Ramp 10—200°C @ 20°C/Min |
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Epoxy Technology EPO-TEK® 383ND High Temperature Epoxy
Material Description: A slightly longer pot life version of EPO-TEK®353ND designed for high temperature, optical and structural applications inside the semiconductor, hybrid, electronic, fiber opti..
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| Glass Transition Temp, Tg | >= 100 °C | >= 212 °F | Dynamic Cure 20—200°C /ISO 25 Min; Ramp -10—200°C @ 20°C/Min |
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Epoxy Technology EPO-TEK® E2001-HV Electrically Conductive, Silver-Filled Epoxy
Product Description: EPO-TEK® E2001-HV Is a snap cure, two component, silver-filled die attach adhesive for semiconductor plastic IC packaging.Advantages & Application Notes:Snap cure adhesive or f..
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| Glass Transition Temp, Tg | >= 100 °C | >= 212 °F | Dynamic Cure 20—200°C /ISO 25 Min; Ramp -10—200°C @ 20°C/Min |
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Epoxy Technology EPO-TEK® E3001-6 Electrically Conductive, Silver Epoxy
Product Description: EPO-TEK® E3001-HV is a snap cure, single component, silver-filled die attach adhesive for semiconductor plastic IC packaging. Also available in a frozen syringe. Advantages & ..
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| Glass Transition Temp, Tg | >= 100 °C | >= 212 °F | Dynamic Cure 20—200°C /ISO 25 Min; Ramp -10—200°C @ 20°C/Min |
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Epoxy Technology EPO-TEK® E3035T-2 Electrically Conductive Epoxy
Product Description: EPO-TEK® E3035T-2 is a single component, silver-filled epoxy for semiconductor die attach, as well as SMD attach on hybrid circuits.Advantages & Application Notes: This epoxy c..
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| Glass Transition Temp, Tg | >= 100 °C | >= 212 °F | Dynamic Cure 20—200°C /ISO 25 Min; Ramp -10—200°C @ 20°C/Min |
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Epoxy Technology EPO-TEK® H24 Electrically Conductive Epoxy
Product Description: EPO-TEK® H24 is a two component, electrically and thermally conductive epoxy adhesive designed for semiconductor die attach and hybrid micro-electronics assembly.Advantages & A..
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| Glass Transition Temp, Tg | >= 100 °C | >= 212 °F | Dynamic Cure 20—300°C /ISO 25 Min; Ramp -10—200°C @ 20°C/Min |
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Epoxy Technology EPO-TEK® H35-175MPT Electrically Conductive, Silver Epoxy
Product Description: EPO-TEK® H35MPT is a single component, silver-filled, electrically conductive epoxy designed for military hybrid die and component attach. High viscosity version of EPO-TEK® H..
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| Glass Transition Temp, Tg | >= 100 °C | >= 212 °F | Dynamic Cure 20—200°C /ISO 25 Min; Ramp -10—200°C @ 20°C/Min |
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Epoxy Technology EPO-TEK® H44 Gold-Filled, Electrically Conductive Epoxy
Product Description: EPO-TEK® H44 is a single component, gold-filled, electrically conductive epoxy adhesive designed for hybrid microelectronic packaging.Advantages & Application Notes: High visco..
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| Glass Transition Temp, Tg | >= 100 °C | >= 212 °F | Dynamic Cure 20—200°C /ISO 25 Min; Ramp -10—200°C @ 20°C/Min |
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Epoxy Technology EPO-TEK® H55 Epoxy
Material Description: A two component, thixotropic and high temperature epoxy designed to be used for hybrids and PCB applications.Information Provided by Epoxy Technology
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| Glass Transition Temp, Tg | >= 100 °C | >= 212 °F | Dynamic Cure 20—200°C /ISO 25 Min; Ramp -10—200°C @ 20°C/Min |
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Epoxy Technology EPO-TEK® H81A Epoxy
Material Description: A two component, gold-filled, electrically and thermally conductive epoxy designed for hybrid microelectronic and semiconductor packaging.Information Provided by Epoxy Technolo..
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| Glass Transition Temp, Tg | >= 100 °C | >= 212 °F | Dynamic Cure 20—200°C /ISO 25 Min; Ramp 10—200°C @ 20°C/Min |
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Epoxy Technology EPO-TEK® OE100-T High Temperature Epoxy
Material Description: A two component, high Tg, high temperature grade epoxy designed for semiconductor, underfill, hard-disk drive and hybrid micro-electronics packaging applications. The epoxy ca..
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| Glass Transition Temp, Tg | 100 °C | 212 °F | |
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Armstrong C-1/E Epoxy Adhesive
A versatile, low viscosity, unfilled resin used for electrical potting and laminating applications. It is an excellent insulator, and provides outstanding chemical resistance to most compoundsInfor..
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| Glass Transition Temp, Tg | 100 °C | 212 °F | |
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BASF Polystyrol® 168 N Polystyrene (Europe)
High molecular, heat-resistant grades used where high strength is required. Suitable for expanded film.Data was collected by ISO methods and provided by BASF.
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| Glass Transition Temp, Tg | 100 °C | 212 °F | |
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Atom Adhesives AA-BOND FDA15 Epoxy Adhesive
AA-BOND FDA15 is a low viscosity epoxy resin system specifically developed for bonding and coating applications in accordance with Title 21, U.S. Code of Federal Regulations, Food and Drug Administr..
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| Glass Transition Temp, Tg | 100 °C | 212 °F | |
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BASF Polystyrol® 158 K Polystyrene (Global)
Heat-resistant, rapid freezing general-purpose grade. Suitable for expanded film and for blending with Styrolux and impact-modified Polystyrol in heat contact applications (e.g. coffee cups).Data w..
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| Glass Transition Temp, Tg | 100 °C | 212 °F | ASTM D7426 |
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Perstorp Compounds Akestra™ 110 Thermoplastic Copolyester
Transparent sparkling glass-like appearance. Suitable for films, sheets, blow molding, foams and injection molding. It can be used as a polystyrene alternative for heat resistant thin wall contain..
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