| Thermal Properties | Metric | English | Comments |
|---|---|---|---|
| Glass Transition Temp, Tg | 65.0 °C | 149 °F | |
|
Resinlab® EP324E Clear Two Part Epoxy Casting Resin
Resinlab™ EP 324E Clear is a two part unfilled electronic grade epoxy encapsulant designed for medium sized castings. It cures at room temperature to a tough, semi-rigid polymer. It has good wettin..
|
|||
| Glass Transition Temp, Tg | 65.0 °C | 149 °F | 10°C/min; DAM; ISO 11357-1/-2 |
|
DuPont Performance Polymers Zytel® 73G30HSL NC010 Nylon 6
(Unverified Data**)
Zytel® 73G30HSL NC010 is a 30% glass fiber reinforced, heat stabilized polyamide 6 resin for injection molding.Information provided by DuPont Performance Polymers
|
|||
| Glass Transition Temp, Tg | 65.0 °C | 149 °F | |
|
Lucite International Elvacite ® 2042 Acrylic Resin
Elvacite® 2042 is a very high molecular weight ethyl methacrylate polymer. It is a tough, alcohol – tolerant, broadly compatible grade for use in abrasion – resistant coatings such as h..
|
|||
| Glass Transition Temp, Tg | 65.0 °C | 149 °F | DSC |
|
Solvay Specialty Polymers Kalix® 2930 HFFR Polyamide, High Performance (HPPA), Glass Fiber
Kalix® 2930 HFFR is a bio-sourced polyamide-based material specifically formulated to meet UL 94V2 @ 0.4 mm requirements for electronic devices. The material uses an advanced halogen-free flame r..
|
|||
| Glass Transition Temp, Tg | 65.0 °C | 149 °F | |
|
Unitika elitel UE3201 Polyester, Pellet
High molecular weight type UE3200UNITIKA l resins are thermoplastic saturated copolymeric polyester resins. l resins are expanding their applications from products such as adhesives, paints, ink bi..
|
|||
| Glass Transition Temp, Tg | 65.0 °C | 149 °F | 10°C/min; ISO 11357-1,-2,-3 |
|
Topas Advanced Polymers TOPAS® 9506F-500 Cyclic Olefin Copolymer (COC)
TOPAS® 9506F-500 is a high clarity extrusion grade for use in shrink, food and medical packaging as either a discrete layer in multilayer film or in blends with polyethylene. It is designed to del..
|
|||
| Glass Transition Temp, Tg | 65.0 °C | 149 °F | Ultimate Tg |
|
Tra-Con Tra-Cast 3135 Low Viscosity Encapsulant
TRA-CAST 3135 is a low viscosity adhesive developed for demanding electronic underfill and encapsulant adhesive applications. This solvent free material is readily mixed, and cured at room temperatu..
|
|||
| Glass Transition Temp, Tg | 65.0 °C | 149 °F | |
|
Unitika elitel UE9200 Polyester, Pellet
Hard type standard, Improved in color from UE3200UNITIKA l resins are thermoplastic saturated copolymeric polyester resins. l resins are expanding their applications from products such as adhesives..
|
|||
| Glass Transition Temp, Tg | 65.0 °C | 149 °F | Ultimate Tg |
|
Tra-Con Tra-Bond 2143D Medium Viscosity Polyamide Epoxy Adhesive
TRA-BOND 2143D is a medium viscosity adhesive recommended for industrial bonding and sealing applications where toughness, impact resistance, and superior mechanical properties are required. This tw..
|
|||
| Glass Transition Temp, Tg | 65.0 °C | 149 °F | Ultimate Tg |
|
Tra-Con Tra-Bond Ablebond 481-20 B-Stageable Epoxy Adhesive
Ablebond 481-20 flexible epoxy adhesive is a modification of Ablebond 481-19 adhesive. This adhesive is designed to absorb stresses between adherends with mismatched coefficients of thermal expansio..
|
|||
| Glass Transition Temp, Tg | >= 65.0 °C | >= 149 °F | Dynamic Cure 20—200°C /ISO 25 Min; Ramp 10—200°C @ 20°C/Min |
|
Epoxy Technology EPO-TEK® 301 Spectrally Transparent Epoxy
Product Description: EPO-TEK® 301 is a two component, room temperature curing epoxy featuring very low viscosity, and excellent optical-mechanical properties.Advantages & Application Notes: Semicon..
|
|||
| Glass Transition Temp, Tg | >= 65.0 °C | >= 149 °F | Dynamic Cure 20—200°C /ISO 25 Min; Ramp 10—200°C @ 20°C/Min |
|
Epoxy Technology EPO-TEK® 301-1 Optical Grade Epoxy
Material Description: A two component, room temperature curing, optical grade epoxy, designed for optics, medical, and opto-electronic packaging of semiconductor devices, components, and electronics..
|
|||
| Glass Transition Temp, Tg | >= 65.0 °C | >= 149 °F | Dynamic Cure 20—200°C /ISO 25 Min; Ramp -10—200°C @ 20°C/Min |
|
Epoxy Technology EPO-TEK® EM127 Electrically Conductive Epoxy
Product Description: EPO-TEK® EM127 is a single component, heat curable, electrically conductive epoxy adhesive for semiconductor IC and LED die attach applications.Advantages & Application Notes: ..
|
|||
| Glass Transition Temp, Tg | >= 65.0 °C | >= 149 °F | Dynamic Cure 20—200°C /ISO 25 Min; Ramp 10—200°C @ 20°C/Min |
|
Epoxy Technology EPO-TEK® OE101 Two Component Epoxy
Material Description: A two component epoxy designed for low stress applications in fiber optic packaging, opto-electronics and semiconductors. It is a lower modulus version of EPO-TEK® 353ND.Inf..
|
|||
| Glass Transition Temp, Tg | 65.0 °C | 149 °F | |
|
Epoxyset Epoxibond EB-107LP-1 Unfilled Epoxy Adhesive
A two-component, unfilled epoxy adhesive used for bonding and small potting applications in the medical, electronics, and aerospace industries.Information provided by Epoxyset Inc.
|
|||
| Glass Transition Temp, Tg | 65.0 °C | 149 °F | |
|
Epoxyset Epoxibond EB-107LP-2 Unfilled Epoxy Adhesive
A two-component, unfilled epoxy adhesive used for bonding and small potting applications in the medical, electronics, and aerospace industries.Information provided by Epoxyset Inc.
|
|||
| Glass Transition Temp, Tg | 65.0 °C | 149 °F | |
|
Epoxyset Epoxiohm EO-21M-5 Electrically Conductive Epoxy Adhesive
EO-21M-5 is an electrically conductive & thermally conductive, silver filled epoxy adhesive. This two component system is designed to be cured at room temperature or the cure can be accelerated by e..
|
|||
| Glass Transition Temp, Tg | 65.0 °C | 149 °F | DAM; 10°C/min; ISO 11357-1/-2 |
|
DuPont Performance Polymers Zytel® 77G33L BK031 Nylon 612
(Unverified Data**)
33% Glass Reinforced Polyamide 612 Zytel 77G33L BK031 is a 33% glass fiber reinforced black polyamide 612 resin for injection molding.Information provided by DuPont Performance Polymers
|
|||
| Glass Transition Temp, Tg | 65.0 °C | 149 °F | DAM; 10°C/min; ISO 11357-1/-2 |
|
DuPont Performance Polymers Zytel® FG77G33L NC010 Nylon 612
33% Glass Reinforced Polyamide 612 with Developed for Food Contact ApplicationsInformation provided by DuPont Performance Polymers
|
|||
| Glass Transition Temp, Tg | 65.0 °C | 149 °F | DAM; 10°C/min; ISO 11357-1/-2 |
|
DuPont Performance Polymers Zytel® 151 NC010 Nylon 612
(Unverified Data**)
Unreinforced Polyamide 612Information provided by DuPont Performance Polymers
|
|||
| Glass Transition Temp, Tg | 65.0 °C | 149 °F | |
|
Armstrong C-4/W Epoxy Adhesive
A low viscosity, clear amber, unfilled adhesive, recommended for use with activators D or W. C-4 with Activator W offers maximum versatility in that differing degrees of flexibility can be achieved ..
|
|||
| Glass Transition Temp, Tg | 65.0 °C | 149 °F | DAM; 10°C/min; ISO 11357-1/-2 |
|
DuPont Performance Polymers Zytel® FG151L NC010 Nylon 612
(Unverified Data**)
Unreinforced Polyamide 612 with Developed for Food Contact ApplicationsInformation provided by DuPont Performance Polymers
|
|||