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Polymer Property : Glass Transition Temp, Tg = 212 °F Product List
Thermal PropertiesTips: 30 items are displayed at most.
| Thermal Properties | Metric | English | Comments |
|---|---|---|---|
| Glass Transition Temp, Tg | 100 °C | 212 °F | ISO 11357-1 |
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Murtfeldt Murinit® SP Polyphenylene Sulfide
Thanks to the low fiber content and integrated solid lubricant, Murinit® SP offers an excellent combination of good slide and wear behavior, high strength, and dimensional stability – even at high..
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| Glass Transition Temp, Tg | 100 °C | 212 °F | |
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NextGen Adhesives P907-03 Fiber Optic Adhesive
Description: NGAC P907-03 is a low viscosity and room temperature curing adhesive specifically formulated for fiber optic terminations.Advantages and Applications: Uses include the termination of si..
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| Glass Transition Temp, Tg | 100 °C | 212 °F | |
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Eastman Tenite 130-33 Cellulose Acetate
(discontinued **)
33% Plasticized, contains 100% fiber grade ester.ISO data as provided by the manufacturer, Eastman Chemical.
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| Glass Transition Temp, Tg | 100 - 110 °C | 212 - 230 °F | |
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Hybrid Plastics POSS® EP 1000 Epoxy Adhesive
EP1000 is a POSS® based epoxy adhesive with outstanding oxidative resistance to ozone, plasma, or atomic oxygen environments. The EP1000 POSS® Epoxy is also well-suited for peroxide and steam...
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| Glass Transition Temp, Tg | 100 °C | 212 °F | |
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Lucite International Colacryl ® CRG107 Specialty Acrylic Resin
Colacryl® CRG107 is a hard, methyl methacrylate based, acrylic resin with exceptional pigment wetting properties. It is soluble in chlorinated hydrocarbons, ketones and lower esters and compatibl..
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| Glass Transition Temp, Tg | 100 °C | 212 °F | |
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Styron DL 220 Plastic Pigment
Performance Features: Stiffness, high mechanical stability, low formaldehyde applicationsApplications: Thermo MoldableEuropeInformation provided by Styron
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| Glass Transition Temp, Tg | 100 °C | 212 °F | |
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Zeon Chemicals Zeonor® 1060R Cyclo-Olefin Polymer
Zeonor 1020R shall be in the form of pellets.
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| Glass Transition Temp, Tg | 100 °C | 212 °F | |
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Zeus PFA Tubing
PFA, or perfluoroalkoxy, is well recognized for its ability to maintain mechanical integrity in extreme temperatures even when exposed to caustic chemicals. PFA comes in high purity versions that ar..
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| Glass Transition Temp, Tg | 100 °C | 212 °F | DMA |
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Hexcel® HexPly® ES70 120°C Curing Epoxy Matrix
HexPly® ES70 is a structural epoxy resin particularly well adapted to low pressure molding processes. This system is versatile and allows a polymerization from 100°C (212°F) up to 150°C (302°F)..
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| Glass Transition Temp, Tg | 100 °C | 212 °F | Ultimate Tg |
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Tra-Con Tra-Bond 931-1 Low Viscosity Encapsulant
TRA-BOND 931-1 low viscosity epoxy encapsulant is designed for high reliability applications, where capillary action is desired. This encapsulant provides environmental and mechanical protection.Inf..
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| Glass Transition Temp, Tg | 100 °C | 212 °F | Onset, Cure Temperature: 100°C, Cure Time: 90 min |
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Hexcel® HexPly® M52 120°C/250°F Curing Epoxy
HexPly® M52 is a modified epoxy matrix with good mechanical and temperature performance, specifically designed for rapid press curing. HexPly® M52 is ideal for small to high volume industrial appl..
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| Glass Transition Temp, Tg | 100 °C | 212 °F | DSC |
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Eastman Sahara Film
Sahara Films are developed for use in applications where increased temperature resistance is desired.Applications/UsesHigh temperature printable films
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| Glass Transition Temp, Tg | >= 100 °C | >= 212 °F | Dynamic Cure 20—200°C /ISO 25 Min; Ramp 10—200°C @ 20°C/Min |
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Epoxy Technology EPO-TEK® 375 High Temperature Epoxy
Product Description: EPO-TEK®375 is a two component, high temperature epoxy designed for semiconductor, hybrid, fiber optic, and medical applications. Also available in a single component frozen sy..
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| Glass Transition Temp, Tg | >= 100 °C | >= 212 °F | Dynamic Cure 20—200°C /ISO 25 Min; Ramp -10—200°C @ 20°C/Min |
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Epoxy Technology EPO-TEK® E2001-HV Electrically Conductive, Silver-Filled Epoxy
Product Description: EPO-TEK® E2001-HV Is a snap cure, two component, silver-filled die attach adhesive for semiconductor plastic IC packaging.Advantages & Application Notes:Snap cure adhesive or f..
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| Glass Transition Temp, Tg | >= 100 °C | >= 212 °F | Dynamic Cure 20—200°C /ISO 25 Min; Ramp -10—200°C @ 20°C/Min |
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Epoxy Technology EPO-TEK® E2116 Electrically Conductive, Silver Epoxy
Product Description: EPO-TEK® E2116 is a two component, silver-filled and stencil printable electrically conductive adhesive for bonding SMDs onto PCB and substrates. Can be used as a “lead-free”..
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| Glass Transition Temp, Tg | >= 100 °C | >= 212 °F | Dynamic Cure 20—200°C /ISO 25 Min; Ramp -10—200°C @ 20°C/Min |
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Epoxy Technology EPO-TEK® E3001-6 Electrically Conductive, Silver Epoxy
Product Description: EPO-TEK® E3001-HV is a snap cure, single component, silver-filled die attach adhesive for semiconductor plastic IC packaging. Also available in a frozen syringe. Advantages & ..
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| Glass Transition Temp, Tg | >= 100 °C | >= 212 °F | Dynamic Cure 20—200°C /ISO 25 Min; Ramp -10—200°C @ 20°C/Min |
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Epoxy Technology EPO-TEK® E3035T-2 Electrically Conductive Epoxy
Product Description: EPO-TEK® E3035T-2 is a single component, silver-filled epoxy for semiconductor die attach, as well as SMD attach on hybrid circuits.Advantages & Application Notes: This epoxy c..
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| Glass Transition Temp, Tg | >= 100 °C | >= 212 °F | Dynamic Cure 20—300°C /ISO 25 Min; Ramp -10—200°C @ 20°C/Min |
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Epoxy Technology EPO-TEK® H35-175MP Electrically Conductive, Silver Epoxy
Product Description: EPO-TEK® H35-175MP is a single component, silver-filled, electrically conductive epoxy designed for semiconductor die attach applications found in hybrids, JEDEC, and opto-elec..
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| Glass Transition Temp, Tg | >= 100 °C | >= 212 °F | Dynamic Cure 20—300°C /ISO 25 Min; Ramp -10—200°C @ 20°C/Min |
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Epoxy Technology EPO-TEK® H35-175MPLV Electrically Conductive, Silver Epoxy
Product Description: EPO-TEK® H35-175MPLV is a single component, silver-filled, electrically conductive epoxy designed for semiconductor die attach applications found in hybrids, JEDEC, and opto-el..
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| Glass Transition Temp, Tg | >= 100 °C | >= 212 °F | Dynamic Cure 20—300°C /ISO 25 Min; Ramp -10—200°C @ 20°C/Min |
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Epoxy Technology EPO-TEK® H35-175MPT Electrically Conductive, Silver Epoxy
Product Description: EPO-TEK® H35MPT is a single component, silver-filled, electrically conductive epoxy designed for military hybrid die and component attach. High viscosity version of EPO-TEK® H..
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| Glass Transition Temp, Tg | >= 100 °C | >= 212 °F | Dynamic Cure 20—200°C /ISO 25 Min; Ramp -10—200°C @ 20°C/Min |
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Epoxy Technology EPO-TEK® H44 Gold-Filled, Electrically Conductive Epoxy
Product Description: EPO-TEK® H44 is a single component, gold-filled, electrically conductive epoxy adhesive designed for hybrid microelectronic packaging.Advantages & Application Notes: High visco..
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| Glass Transition Temp, Tg | >= 100 °C | >= 212 °F | Ramp 40°C/Min to 300°C |
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Epoxy Technology EPO-TEK® P1011S Electrically Conductive Modified Polyimide
Product Description: EPO-TEK® P1011S is a single component, modified polyimide, high temperature grade, silver-filled electrically and thermally conductive adhesive designed for semiconductor die-a..
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| Glass Transition Temp, Tg | >= 100 °C | >= 212 °F | Dynamic Cure 20—200°C /ISO 25 Min; Ramp -10—200°C @ 20°C/Min |
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Epoxy Technology EPO-TEK® E3035 Electrically Conductive Adhesive
Product Description: EPO-TEK® E3035 is a single component, silver-filled epoxy for hybrid die and component attach.Advantages & Application Notes: Performs exceptionally well as a die attach for sm..
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| Glass Transition Temp, Tg | 100 °C | 212 °F | |
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BASF Polystyrol® 168 N Polystyrene (Europe)
High molecular, heat-resistant grades used where high strength is required. Suitable for expanded film.Data was collected by ISO methods and provided by BASF.
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| Glass Transition Temp, Tg | 100 °C | 212 °F | |
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Atom Adhesives AA-BOND FDA15 Epoxy Adhesive
AA-BOND FDA15 is a low viscosity epoxy resin system specifically developed for bonding and coating applications in accordance with Title 21, U.S. Code of Federal Regulations, Food and Drug Administr..
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| Glass Transition Temp, Tg | 100 °C | 212 °F | |
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BASF Polystyrol® 158 K Polystyrene (Global)
Heat-resistant, rapid freezing general-purpose grade. Suitable for expanded film and for blending with Styrolux and impact-modified Polystyrol in heat contact applications (e.g. coffee cups).Data w..
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| Glass Transition Temp, Tg | 100 °C | 212 °F | ASTM D7426 |
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Perstorp Compounds Akestra™ 100 Thermoplastic Copolyester
Excellent appearance, clarity, hydrolytic stability, heat resistance and high strength. Used for extrusion and injection molded articles, blow molding, films and sheets. It can be used as a polyst..
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