Polymer Property : UL RTI, Electrical = 150 °C Product List

Thermal Properties

Tips: 30 items are displayed at most.

Thermal Properties	Metric	English	Comments
UL RTI, Electrical	150 °C	302 °F	UL 746B
SABIC Innovative Plastics Lexan® XHT2141 PC Copolymer XHT2141 is a high flow, high heat polycarbonate copolymer. It is available in a range of opaque and limited transparent colors.
UL RTI, Electrical	150 °C	302 °F	UL 746B
SABIC Innovative Plastics Lexan® XHT2141 PC Copolymer (Asia Pacific) XHT2141 is a high flow, high heat polycarbonate copolymer. It is available in a range of opaque and limited transparent colors.
UL RTI, Electrical	150 °C	302 °F	UL 746B
SABIC Innovative Plastics Lexan® XHT3141 PC Copolymer (Asia Pacific) XHT3141 is a high flow, high heat polycarbonate copolymer. It is available in a range of opaque and limited transparent colors.
UL RTI, Electrical	150 °C	302 °F	UL 746B
SABIC Innovative Plastics Lexan® XHT4141 PC Copolymer (Europe-Africa-Middle East) XHT4141 is a high flow, high heat polycarbonate copolymer. It is available in a range of opaque and limited transparent colors.
UL RTI, Electrical	150 °C	302 °F	Average value: 150 °C Grade Count:4
Overview of materials for Polycyclohexylenedimethylene Terephthalate (PCT), 30% Glass Reinforced This property data is a summary of similar materials in the MatWeb database for the category "PCT or PCTA, 30% Glass Reinforced".Specific grades with glass content between 25% and 34% are included. ..
UL RTI, Electrical	150 °C	302 °F	UL 746
Solvay Specialty Polymers Mindel® B-430 Polysulfone, Modified (PSU, Modified)  (discontinued **) Mindel B-430 is a 30% glass reinforced thermoplastic with excellent dimensional stability, exceptional resistance to warp, good chemical resistance, and high stiffness. It was developed specifically..
UL RTI, Electrical	150 - 220 °C	302 - 428 °F	Average value: 211 °C Grade Count:127
Overview of materials for Silicone, Molded, Glass Fiber Filled This property data is a summary of similar materials in the MatWeb database for the category "Silicone, Molded, Glass Fiber Filled". Each property range of values reported is minimum and maximum val..
UL RTI, Electrical	150 °C	302 °F	Average value: 150 °C Grade Count:6
Overview of materials for Phenolic, Novolac, Heat Resistant Grade, Filled This property data is a summary of similar materials in the MatWeb database for the category "Phenolic, Novolac, Heat Resistant Grade, Filled". Each property range of values reported is minimum and ..
UL RTI, Electrical	150 °C	302 °F	Average value: 150 °C Grade Count:6
Overview of materials for Phenolic, Novolac, Woodflour Filled This property data is a summary of similar materials in the MatWeb database for the category "Phenolic, Novolac, Woodflour Filled". Each property range of values reported is minimum and maximum valu..
UL RTI, Electrical	150 °C @Thickness 1.50 mm	302 °F @Thickness 0.0591 in	(ALL)
Hexion Bakelite™ PF 31 Phenolic Formaldehyde Resin, UL Listed  (discontinued **) Phenolic molding compound, mainly organically filled, standard molding compound for normal stress, UL listed molding compound 1.5 mm/V-1 (All), 3 mm/V-0 (All), standardized molding compound.Applicat..
UL RTI, Electrical	150 °C @Thickness 1.50 mm	302 °F @Thickness 0.0591 in	ALL
Hexion Bakelite™ PF 2774 Phenolic Formaldehyde Resin, Dishwasher Proof, Improved Electrical Properties, Low Shrinkage, UL Listed Phenolic molding compound, inorganically filled, glass fiber reinforced, increased dimensional stability, averaged notched impact strength, average heat resistance, improved electrical properties, U..
UL RTI, Electrical	150 °C @Thickness 1.50 mm	302 °F @Thickness 0.0591 in	BN, BK
Hexion Bakelite™ X65 Phenolic Formaldehyde Resin, UL Listed  (discontinued **) Phenolic molding compound, inorganically/organically filled, good heat-resistance and dimensional stability, UL listed molding compound 3.0 mm/V-0 (BN, BK).Application areas: Oven strips.Information..
UL RTI, Electrical	150 °C @Thickness 1.63 mm	302 °F @Thickness 0.0642 in
Plenco 202 Black General Purpose Woodflour Filled Phenolic Molding Compound  (discontinued **) Plaslok 202 is a two-stage, woodflour-filled phenolic molding compound formulated to provide improved impact and fatigue strength, good dimensional stability and excellent molded finish for automoti..
UL RTI, Electrical	150 °C @Thickness 1.57 mm	302 °F @Thickness 0.0618 in
Plenco 204 Black General Purpose Woodflour/Mineral Filled Phenolic Molding Compound  (discontinued **) Plaslok 204 is a two-stage, woodflour and mineral-filled phenolic molding compound formulated to accommodate a wide range of molding situations. In addition, it is recommended for use in thin wall ..
UL RTI, Electrical	150 °C @Thickness 1.57 mm	302 °F @Thickness 0.0618 in
Plenco 506 Black Heat Resistant Mineral Filled Phenolic Molding Compound  (discontinued **) Plaslok 506 is a two-stage, mineral-filled phenolic molding compound. It is formulated for automotive ashtrays and for appliance applications such as utensil handles receiving repeated exposure to ..
UL RTI, Electrical	150 °C @Thickness 1.57 mm	302 °F @Thickness 0.0618 in
Plenco 306 Black General Purpose Mineral/Flock Filled Phenolic Molding Compound  (discontinued **) Plaslok 306 is a two-stage, mineral and flock-filled phenolic molding compound designed to have the heat resistant characteristics of Plaslok 504, while at the same time, improved impact strength.Da..
UL RTI, Electrical	150 °C @Thickness 1.47 mm	302 °F @Thickness 0.0579 in
Plaslok 201 Black General Purpose Woodflour/Mineral Filled Phenolic Molding Compound  (discontinued **) Plaslok Corporation was purchased by Plastics Engineering Company (maker of Plenco brand materials) in March 2000. The Plaslok name is no longer in use.Plaslok 201 is a two-stage, woodflour and min..
UL RTI, Electrical	150 °C @Thickness 1.63 mm	302 °F @Thickness 0.0642 in
Plaslok 202 Black General Purpose Woodflour Filled Phenolic Molding Compound  (discontinued **) Plaslok Corporation was purchased by Plastics Engineering Company (maker of Plenco brand materials) in March 2000. The Plaslok name is no longer in use.Plaslok 202 is a two-stage, woodflour-filled ..
UL RTI, Electrical	150 °C @Thickness 1.57 mm	302 °F @Thickness 0.0618 in
Plaslok 506 Black Heat Resistant Mineral Filled Phenolic Molding Compound  (discontinued **) Plaslok Corporation was purchased by Plastics Engineering Company (maker of Plenco brand materials) in March 2000. The Plaslok name is no longer in use.Plaslok 506 is a two-stage, mineral-filled ph..
UL RTI, Electrical	150 Â°C	302 Â°F	UL 746B
SABIC Innovative Plastics ValoxÂ® ENH3500 PBT (Europe-Africa-Middle East) Unfilled PBT, Non-Brominated & Non-Chlorinated Flame Retardant
UL RTI, Electrical	150 Â°C	302 Â°F
Sumitomo Bakelite SumikonÂ® PM-9640 Glass Filled Phenolic Two stage glass fiber filled black phenolic. It is especially designed for applications requiring high strength and dimensional stability with excellent heat resistance. PM-9640 is widely used in ..
UL RTI, Electrical	150 °C @Thickness 0.750 mm	302 °F @Thickness 0.0295 in	BK
Hexion Bakelite™ PF 2874 Phenolic Formaldehyde Resin, Low Shrinkage, Improved Electrical Properties, UL Listed, High Mechanical Strength Phenolic molding compound, inorganically filled, glass fiber reinforced, increased mechanical strength, increased temperature stability, low water absorption, good dimensional stability, UL listed m..
UL RTI, Electrical	150 °C	302 °F	UL 746B
SABIC Innovative Plastics Valox® V9561 PET (Europe-Africa-Middle East) Flame retardant PET, 30% Glass fiber filled. Offering a good balance in CTI , GWIT , High Heat and mechanical performances.
UL RTI, Electrical	150 °C @Thickness 1.47 mm	302 °F @Thickness 0.0579 in
Plaslok 504 Black (COM) Heat Resistant Mineral/Cellulose Filled Phenolic Molding Compound  (discontinued **)&l Plaslok Corporation was purchased by Plastics Engineering Company (maker of Plenco brand materials) in March 2000. The Plaslok name is no longer in use.Plaslok 504 is a two-stage, mineral and cellu..
UL RTI, Electrical	150 °C	302 °F	1.47 mm
Plaslok 5314 Black (INJ) Impact Grade Phenolic Molding Compound  (discontinued **) Plaslok Corporation was purchased by Plastics Engineering Company (maker of Plenco brand materials) in March 2000. The Plaslok name is no longer in use.Plaslok 5314 is the replacement material for ..
UL RTI, Electrical	150 °C @Thickness 1.50 mm	302 °F @Thickness 0.0591 in	(BK)
Hexion Bakelite™ PF 2836 Phenolic Formaldehyde Resin, Improved Electrical Properties, Low Shrinkage, UL Listed &nbs Phenolic molding compound, inorganically/organically filled, increased heat resistance, increased tracking resistance, low shrinkage and post shrinkage, improved electrical properties, UL listed mol..
UL RTI, Electrical	150 °C @Thickness 3.00 mm	302 °F @Thickness 0.118 in	ALL
Hexion Bakelite™ PF 2855 Phenolic Formaldehyde Resin, High Surface Quality, Low Shrinkage, For Electrostatic Coating, Dishwasher Proof, UL Listed Phenolic molding compound, inorganically/organically filled, heat resistant up to 250°C, hot steam and hot water resistant, high surface quality, for electrostatic coating, UL listed molding compou..
UL RTI, Electrical	150 °C	302 °F	1.57 mm
Plaslok 204 Black General Purpose Woodflour/Mineral Filled Phenolic Molding Compound  (discontinued **) Plaslok Corporation was purchased by Plastics Engineering Company (maker of Plenco brand materials) in March 2000. The Plaslok name is no longer in use. Plaslok 204 is a two-stage, woodflour and min..
UL RTI, Electrical	150 °C	302 °F	1.57 mm
Plaslok 501 Black Electrical Grade Mineral/Flock Filled Phenolic Molding Compound  (discontinued **) Plaslok Corporation was purchased by Plastics Engineering Company (maker of Plenco brand materials) in March 2000. The Plaslok name is no longer in use.Plaslok 501 is a two-stage, mineral and flock..