Polymer Property : UL RTI, Electrical = 302 °F Product List

Thermal Properties

Tips: 30 items are displayed at most.

Thermal Properties	Metric	English	Comments
UL RTI, Electrical	150 °C	302 °F	UL 746B
SABIC Innovative Plastics Lexan® XHT2141 PC Copolymer (Asia Pacific) XHT2141 is a high flow, high heat polycarbonate copolymer. It is available in a range of opaque and limited transparent colors.
UL RTI, Electrical	150 °C	302 °F
Resinoid 7051 Phenolic Molding, Glass Reinforced Data provided by the manufacturer.The Resinoid 1300 and 7000 glass fiber reinforced series compounds feature mechanical strength, dimensional stability, electrical insulation, and heat resistance
UL RTI, Electrical	150 °C @Thickness 1.50 mm	302 °F @Thickness 0.0591 in	UL746B
Covestro Apec® DP9-9351 High-Heat Polycarbonate, General Purpose  (discontinued **) Information provided by Bayer Corporation, Plastics DivisionAs of 1 September 2015, Bayer MaterialScience was separated from Bayer AG and has officially adopted its new name – Covestro. This produ..
UL RTI, Electrical	150 °C @Thickness 1.50 mm	302 °F @Thickness 0.0591 in	UL746B
Covestro Apec® DP9-9371 High-Heat Polycarbonate, General Purpose  (discontinued **) Information provided by Bayer Corporation, Plastics DivisionAs of 1 September 2015, Bayer MaterialScience was separated from Bayer AG and has officially adopted its new name – Covestro. This produ..
UL RTI, Electrical	150 °C @Thickness 1.50 mm	302 °F @Thickness 0.0591 in	UL746B
Covestro Apec® DP9-9373 High-Heat Polycarbonate, General Purpose, UV-Stabilized  (discontinued **) Information provided by Bayer Corporation, Plastics DivisionAs of 1 September 2015, Bayer MaterialScience was separated from Bayer AG and has officially adopted its new name – Covestro. This produ..
UL RTI, Electrical	150 °C	302 °F	UL 746B
SABIC Innovative Plastics Lexan® XHT4141 PC Copolymer (Asia Pacific) XHT4141 is a high flow, high heat polycarbonate copolymer. It is available in a range of opaque and limited transparent colors.
UL RTI, Electrical	150 °C	302 °F	UL 746
Solvay Specialty Polymers Mindel® B-430 Polysulfone, Modified (PSU, Modified)  (discontinued **) Mindel B-430 is a 30% glass reinforced thermoplastic with excellent dimensional stability, exceptional resistance to warp, good chemical resistance, and high stiffness. It was developed specifically..
UL RTI, Electrical	150 °C	302 °F	Average value: 150 °C Grade Count:6
Overview of materials for Phenolic, Novolac, Heat Resistant Grade, Filled This property data is a summary of similar materials in the MatWeb database for the category "Phenolic, Novolac, Heat Resistant Grade, Filled". Each property range of values reported is minimum and ..
UL RTI, Electrical	150 °C	302 °F	Average value: 150 °C Grade Count:6
Overview of materials for Phenolic, Novolac, Woodflour Filled This property data is a summary of similar materials in the MatWeb database for the category "Phenolic, Novolac, Woodflour Filled". Each property range of values reported is minimum and maximum valu..
UL RTI, Electrical	150 °C	302 °F	Average value: 150 °C Grade Count:6
Overview of materials for Phenolic, Novolac, Glass Filled This property data is a summary of similar materials in the MatWeb database for the category "Phenolic, Novolac, Glass Filled". Each property range of values reported is minimum and maximum values o..
UL RTI, Electrical	150 °C @Thickness 1.50 mm	302 °F @Thickness 0.0591 in	(ALL)
Hexion Bakelite™ PF 31 Phenolic Formaldehyde Resin, UL Listed  (discontinued **) Phenolic molding compound, mainly organically filled, standard molding compound for normal stress, UL listed molding compound 1.5 mm/V-1 (All), 3 mm/V-0 (All), standardized molding compound.Applicat..
UL RTI, Electrical	150 °C @Thickness 1.50 mm	302 °F @Thickness 0.0591 in	(BK, BN)
Hexion Bakelite™ PF 85 Phenolic Formaldehyde Resin, UL Listed  (discontinued **) Phenolic molding compound, organically filled, reinforced with cotton fibers, average notched impact strength, UL listed molding compound 1.5 mm/HB (BK, BN).Application areas: Switch covers, rolls, ..
UL RTI, Electrical	150 °C @Thickness 1.50 mm	302 °F @Thickness 0.0591 in	(ALL)
Hexion Bakelite™ PF 2400 Phenolic Formaldehyde Resin, High Surface Quality, Dishwasher Proof, UL Listed  (disc Phenolic molding compound, inorganically/organically filled, average heat resistance, increased dimensional stability, dish washer proof, UL listed molding compound 1.5 mm/V-0 (ALL).Application area..
UL RTI, Electrical	150 °C @Thickness 1.50 mm	302 °F @Thickness 0.0591 in	ALL
Hexion Bakelite™ PF 2774 Phenolic Formaldehyde Resin, Dishwasher Proof, Improved Electrical Properties, Low Shrinkage, UL Listed Phenolic molding compound, inorganically filled, glass fiber reinforced, increased dimensional stability, averaged notched impact strength, average heat resistance, improved electrical properties, U..
UL RTI, Electrical	150 °C @Thickness 1.47 mm	302 °F @Thickness 0.0579 in
Plenco 201 Black General Purpose Woodflour/Mineral Filled Phenolic Molding Compound  (discontinued **) Plaslok 201 is a two-stage, woodflour and mineral-filled phenolic molding compound formulated to have an excellent balance of molded properties. The material provides good electrical insulation val..
UL RTI, Electrical	150 °C @Thickness 1.57 mm	302 °F @Thickness 0.0618 in
Plenco 204 Black General Purpose Woodflour/Mineral Filled Phenolic Molding Compound  (discontinued **) Plaslok 204 is a two-stage, woodflour and mineral-filled phenolic molding compound formulated to accommodate a wide range of molding situations. In addition, it is recommended for use in thin wall ..
UL RTI, Electrical	150 °C @Thickness 1.47 mm	302 °F @Thickness 0.0579 in
Plenco 5440 Black General Purpose Phenolic Molding Compound  (discontinued **) Plaslok 5440 is the replacement material for the former Union Carbide BMRS-5440. It is a two-stage, phenolic molding compound that has been successfully formulated to accommodate a very wide range ..
UL RTI, Electrical	150 °C @Thickness 1.47 mm	302 °F @Thickness 0.0579 in
Plenco 504 Black (COM) Heat Resistant Mineral/Cellulose Filled Phenolic Molding Compound  (discontinued **)&lt Plaslok 504 is a two-stage, mineral and cellulose-filled phenolic molding compound having better impact and heat resistance than general purpose molding compounds. Since it also has good electrical..
UL RTI, Electrical	150 °C @Thickness 1.57 mm	302 °F @Thickness 0.0618 in
Plenco 5314 Black (COM) Impact Grade Phenolic Molding Compound  (discontinued **) Plaslok 5314 is the replacement material for the former Union Carbide BMMA-5314. It is a two-stage, impact grade phenolic molding compound suitable for compression, transfer or injection molding of..
UL RTI, Electrical	150 °C @Thickness 1.60 mm	302 °F @Thickness 0.0630 in
Plenco 309 Black (COM) Mineral/Fiber Filled Phenolic Molding Compound  (discontinued **) Plaslok 309 is a two-stage, mineral and fiber-filled phenolic molding compound having excellent impact strength; and as such, is considered a good candidate for replacing chopped-fiber filled compou..
UL RTI, Electrical	150 °C @Thickness 1.60 mm	302 °F @Thickness 0.0630 in
Plenco 309 Black (INJ) Mineral/Fiber Filled Phenolic Molding Compound  (discontinued **) Plaslok 309 is a two-stage, mineral and fiber-filled phenolic molding compound having excellent impact strength; and as such, is considered a good candidate for replacing chopped-fiber filled compou..
UL RTI, Electrical	150 °C @Thickness 1.47 mm	302 °F @Thickness 0.0579 in
Plaslok 201 Black General Purpose Woodflour/Mineral Filled Phenolic Molding Compound  (discontinued **) Plaslok Corporation was purchased by Plastics Engineering Company (maker of Plenco brand materials) in March 2000. The Plaslok name is no longer in use.Plaslok 201 is a two-stage, woodflour and min..
UL RTI, Electrical	150 °C @Thickness 1.60 mm	302 °F @Thickness 0.0630 in
Plaslok 309 Black (INJ) Mineral/Fiber Filled Phenolic Molding Compound  (discontinued **) Plaslok Corporation was purchased by Plastics Engineering Company (maker of Plenco brand materials) in March 2000. The Plaslok name is no longer in use.Plaslok 309 is a two-stage, mineral and fiber..
UL RTI, Electrical	150 °C	302 °F	E54153
Arlon 56866R026 0.028" Cured/Uncured Silicone Rubber with Fiberglass Substrate Design/Construction:Side 1: Cured Silicone RubberSubstrate: Style 1564 FiberglassSide 2: Uncured Silicone RubberInterleave: 3 mil LDPEThis data represents typical values for the production mater..
UL RTI, Electrical	150 °C	302 °F
Resinoid 1312 Phenolic Molding, Glass Reinforced Data provided by the manufacturer.The Resinoid 1300 and 7000 glass fiber reinforced series compounds feature mechanical strength, dimensional stability, electrical insulation, and heat resistance
UL RTI, Electrical	150 °C	302 °F
Resinoid 1322 Phenolic Molding, Glass Reinforced Data provided by the manufacturer.The Resinoid 1300 and 7000 glass fiber reinforced series compounds feature mechanical strength, dimensional stability, electrical insulation, and heat resistance
UL RTI, Electrical	150 °C	302 °F
Resinoid 2016 Phenolic Molding, Fabric Reinforced Data provided by the manufacturer.The Resinoid 2000 organic fiber reinforced series compounds feature mechanical strength, dimensional stability, and shock resistance
UL RTI, Electrical	150 °C @Thickness 1.47 mm	302 °F @Thickness 0.0579 in
Plaslok 5000 Black General Purpose Woodflour Filled Phenolic Molding Compound  (discontinued **) Plaslok Corporation was purchased by Plastics Engineering Company (maker of Plenco brand materials) in March 2000. The Plaslok name is no longer in use. Plaslok 5000 is the replacement material for ..
UL RTI, Electrical	150 °C @Thickness 1.47 mm	302 °F @Thickness 0.0579 in
Plaslok 504 Black (COM) Heat Resistant Mineral/Cellulose Filled Phenolic Molding Compound  (discontinued **)&l Plaslok Corporation was purchased by Plastics Engineering Company (maker of Plenco brand materials) in March 2000. The Plaslok name is no longer in use.Plaslok 504 is a two-stage, mineral and cellu..
UL RTI, Electrical	150 °C	302 °F	1.47 mm
Plaslok 5314 Black (INJ) Impact Grade Phenolic Molding Compound  (discontinued **) Plaslok Corporation was purchased by Plastics Engineering Company (maker of Plenco brand materials) in March 2000. The Plaslok name is no longer in use.Plaslok 5314 is the replacement material for ..