Polymer Property : UL RTI, Mechanical with Impact = 150 °C Product List

Thermal Properties

Tips: 30 items are displayed at most.

Thermal Properties	Metric	English	Comments
UL RTI, Mechanical with Impact	150 °C @Thickness 1.50 mm	302 °F @Thickness 0.0591 in	UL746B
Covestro Apec® DP9-9371 High-Heat Polycarbonate, General Purpose  (discontinued **) Information provided by Bayer Corporation, Plastics DivisionAs of 1 September 2015, Bayer MaterialScience was separated from Bayer AG and has officially adopted its new name – Covestro. This produ..
UL RTI, Mechanical with Impact	150 °C @Thickness 1.50 mm	302 °F @Thickness 0.0591 in	UL746B
Covestro Apec® DP9-9373 High-Heat Polycarbonate, General Purpose, UV-Stabilized  (discontinued **) Information provided by Bayer Corporation, Plastics DivisionAs of 1 September 2015, Bayer MaterialScience was separated from Bayer AG and has officially adopted its new name – Covestro. This produ..
UL RTI, Mechanical with Impact	150 °C	302 °F	Average value: 150 °C Grade Count:6
Overview of materials for Phenolic, Novolac, Woodflour Filled This property data is a summary of similar materials in the MatWeb database for the category "Phenolic, Novolac, Woodflour Filled". Each property range of values reported is minimum and maximum valu..
UL RTI, Mechanical with Impact	150 °C @Thickness 0.750 mm	302 °F @Thickness 0.0295 in	NC
Hexion Bakelite™ PF 13 Phenolic Formaldehyde Resin, UL Listed  (discontinued **) Phenolic molding compound, inorganically mica filled, heat resistance, good electrical properties, UL listed molding compound 0.75 mm/V-1 (NC), 3 mm/V-0, standardized molding compound.Application ar..
UL RTI, Mechanical with Impact	150 °C @Thickness 1.50 mm	302 °F @Thickness 0.0591 in	(BN, BK)
Hexion Bakelite™ X22 Phenolic Formaldehyde Resin, UL Listed  (discontinued **) Phenolic molding compound, mainly organically filled, UL listed molding compound 3.0 mm/V-0 (BN, BK).Application areas: Pot handles, operating controls, electrical isolators, housing parts.Informati..
UL RTI, Mechanical with Impact	150 °C @Thickness 1.50 mm	302 °F @Thickness 0.0591 in	BN, BK
Hexion Bakelite™ X65 Phenolic Formaldehyde Resin, UL Listed  (discontinued **) Phenolic molding compound, inorganically/organically filled, good heat-resistance and dimensional stability, UL listed molding compound 3.0 mm/V-0 (BN, BK).Application areas: Oven strips.Information..
UL RTI, Mechanical with Impact	150 °C @Thickness 1.57 mm	302 °F @Thickness 0.0618 in
Plenco 204 Black General Purpose Woodflour/Mineral Filled Phenolic Molding Compound  (discontinued **) Plaslok 204 is a two-stage, woodflour and mineral-filled phenolic molding compound formulated to accommodate a wide range of molding situations. In addition, it is recommended for use in thin wall ..
UL RTI, Mechanical with Impact	150 °C @Thickness 1.47 mm	302 °F @Thickness 0.0579 in
Plenco 5000 Black General Purpose Woodflour Filled Phenolic Molding Compound  (discontinued **) Plaslok 5000 is the replacement material for the former Union Carbide BMM-5000. It is a two-stage, woodflour-filled phenolic molding compound having versatile molding performance and preheating cha..
UL RTI, Mechanical with Impact	150 °C @Thickness 1.47 mm	302 °F @Thickness 0.0579 in
Plenco 7000 Black General Purpose Woodflour Filled Phenolic Molding Compound  (discontinued **) Plaslok 7000 is the replacement material for the former Union Carbide BMM-7000. It is a two-stage, woodflour-filled phenolic molding compound having versatile molding and preheating characteristics..
UL RTI, Mechanical with Impact	150 °C @Thickness 1.47 mm	302 °F @Thickness 0.0579 in
Plenco 504 Black (INJ) Heat Resistant Mineral/Cellulose Filled Phenolic Molding Compound  (discontinued **)&lt Plaslok 504 is a two-stage, mineral and cellulose-filled phenolic molding compound having better impact and heat resistance than general purpose molding compounds. Since it also has good electrical..
UL RTI, Mechanical with Impact	150 °C @Thickness 1.57 mm	302 °F @Thickness 0.0618 in
Plenco 506 Black Heat Resistant Mineral Filled Phenolic Molding Compound  (discontinued **) Plaslok 506 is a two-stage, mineral-filled phenolic molding compound. It is formulated for automotive ashtrays and for appliance applications such as utensil handles receiving repeated exposure to ..
UL RTI, Mechanical with Impact	150 °C @Thickness 1.57 mm	302 °F @Thickness 0.0618 in
Plenco 5303 Black Electrical Grade Mineral/Flock Filled Phenolic Molding Compound  (discontinued **) Plaslok 5303 is a two-stage, mineral and flock-filled phenolic molding compound designed for use in appliance, automotive and electrical applications. It can be molded by compression, transfer or i..
UL RTI, Mechanical with Impact	150 °C @Thickness 1.57 mm	302 °F @Thickness 0.0618 in
Plenco 306 Black General Purpose Mineral/Flock Filled Phenolic Molding Compound  (discontinued **) Plaslok 306 is a two-stage, mineral and flock-filled phenolic molding compound designed to have the heat resistant characteristics of Plaslok 504, while at the same time, improved impact strength.Da..
UL RTI, Mechanical with Impact	150 °C @Thickness 1.57 mm	302 °F @Thickness 0.0618 in
Plenco 5314 Black (COM) Impact Grade Phenolic Molding Compound  (discontinued **) Plaslok 5314 is the replacement material for the former Union Carbide BMMA-5314. It is a two-stage, impact grade phenolic molding compound suitable for compression, transfer or injection molding of..
UL RTI, Mechanical with Impact	150 °C @Thickness 1.60 mm	302 °F @Thickness 0.0630 in
Plenco 309 Black (INJ) Mineral/Fiber Filled Phenolic Molding Compound  (discontinued **) Plaslok 309 is a two-stage, mineral and fiber-filled phenolic molding compound having excellent impact strength; and as such, is considered a good candidate for replacing chopped-fiber filled compou..
UL RTI, Mechanical with Impact	150 °C @Thickness 1.47 mm	302 °F @Thickness 0.0579 in
Plaslok 201 Black General Purpose Woodflour/Mineral Filled Phenolic Molding Compound  (discontinued **) Plaslok Corporation was purchased by Plastics Engineering Company (maker of Plenco brand materials) in March 2000. The Plaslok name is no longer in use.Plaslok 201 is a two-stage, woodflour and min..
UL RTI, Mechanical with Impact	150 °C @Thickness 1.57 mm	302 °F @Thickness 0.0618 in
Plaslok 506 Black Heat Resistant Mineral Filled Phenolic Molding Compound  (discontinued **) Plaslok Corporation was purchased by Plastics Engineering Company (maker of Plenco brand materials) in March 2000. The Plaslok name is no longer in use.Plaslok 506 is a two-stage, mineral-filled ph..
UL RTI, Mechanical with Impact	150 °C	302 °F	1.60 mm
Plaslok 309 Black (COM) Mineral/Fiber Filled Phenolic Molding Compound  (discontinued **) Plaslok Corporation was purchased by Plastics Engineering Company (maker of Plenco brand materials) in March 2000. The Plaslok name is no longer in use.Plaslok 309 is a two-stage, mineral and fiber..
UL RTI, Mechanical with Impact	150 °C @Thickness 1.60 mm	302 °F @Thickness 0.0630 in
Plaslok 309 Black (INJ) Mineral/Fiber Filled Phenolic Molding Compound  (discontinued **) Plaslok Corporation was purchased by Plastics Engineering Company (maker of Plenco brand materials) in March 2000. The Plaslok name is no longer in use.Plaslok 309 is a two-stage, mineral and fiber..
UL RTI, Mechanical with Impact	150 °C	302 °F
Resinoid 1312 Phenolic Molding, Glass Reinforced Data provided by the manufacturer.The Resinoid 1300 and 7000 glass fiber reinforced series compounds feature mechanical strength, dimensional stability, electrical insulation, and heat resistance
UL RTI, Mechanical with Impact	150 °C	302 °F
Resinoid 2016 Phenolic Molding, Fabric Reinforced Data provided by the manufacturer.The Resinoid 2000 organic fiber reinforced series compounds feature mechanical strength, dimensional stability, and shock resistance
UL RTI, Mechanical with Impact	150 °C @Thickness 0.750 mm	302 °F @Thickness 0.0295 in	BK
Hexion Bakelite™ PF 4111 Phenolic Formaldehyde Resin, Improved Electrical Properties, Ammonia Free, Resistant to High Temperatures, Low Shrinkage, High Arc Resistance, UL Listed, Acetic Acid Free, Copper Adhesive Phenolic molding compound, inorganically filled, glass fiber reinforced, ammonia and acetic acid free, electrically high grade, high temperature stability, high mechanical strength, copper-adhesive,..
UL RTI, Mechanical with Impact	150 °C @Thickness 1.57 mm	302 °F @Thickness 0.0618 in
Plenco 302 Black Impact Grade Woodflour/Flock Filled Phenolic Molding Compound  (discontinued **) Plaslok 302 is a two-stage, woodflour and flock-filled phenolic molding compound. It has low specific gravity, broad molding latitude and an excellent balance of electrical and physical properties...
UL RTI, Mechanical with Impact	150 °C @Thickness 1.47 mm	302 °F @Thickness 0.0579 in
Plaslok 5000 Black General Purpose Woodflour Filled Phenolic Molding Compound  (discontinued **) Plaslok Corporation was purchased by Plastics Engineering Company (maker of Plenco brand materials) in March 2000. The Plaslok name is no longer in use. Plaslok 5000 is the replacement material for ..
UL RTI, Mechanical with Impact	150 °C	302 °F	1.47 mm
Plaslok 7000 Black General Purpose Woodflour Filled Phenolic Molding Compound  (discontinued **) Plaslok Corporation was purchased by Plastics Engineering Company (maker of Plenco brand materials) in March 2000. The Plaslok name is no longer in use.Plaslok 7000 is the replacement material for ..
UL RTI, Mechanical with Impact	150 °C @Thickness 1.57 mm	302 °F @Thickness 0.0618 in
Plaslok 302 Black Impact Grade Woodflour/Flock Filled Phenolic Molding Compound  (discontinued **) Plaslok Corporation was purchased by Plastics Engineering Company (maker of Plenco brand materials) in March 2000. The Plaslok name is no longer in use.Plaslok 302 is a two-stage, woodflour and flo..
UL RTI, Mechanical with Impact	150 °C @Thickness 1.57 mm	302 °F @Thickness 0.0618 in
Plaslok 5314 Black (COM) Impact Grade Phenolic Molding Compound  (discontinued **) Plaslok Corporation was purchased by Plastics Engineering Company (maker of Plenco brand materials) in March 2000. The Plaslok name is no longer in use.Plaslok 5314 is the replacement material for ..
UL RTI, Mechanical with Impact	150 °C	302 °F	1.47 mm
Plaslok 5314 Black (INJ) Impact Grade Phenolic Molding Compound  (discontinued **) Plaslok Corporation was purchased by Plastics Engineering Company (maker of Plenco brand materials) in March 2000. The Plaslok name is no longer in use.Plaslok 5314 is the replacement material for ..
UL RTI, Mechanical with Impact	150 °C	302 °F
Resinoid 7201 Phenolic Molding, Glass Reinforced Data provided by the manufacturer.The Resinoid 1300 and 7000 glass fiber reinforced series compounds feature mechanical strength, dimensional stability, electrical insulation, and heat resistance
UL RTI, Mechanical with Impact	150 °C @Thickness 1.50 mm	302 °F @Thickness 0.0591 in	(ALL)
Hexion Bakelite™ PF 2560 Phenolic Formaldehyde Resin, High Surface Quality, For Electrostatic Coating, UL Listed &n Phenolic molding compound, inorganically/organically filled, average heat resistant, high surface quality, lower water absorption than PF 31, minimal distortion, UL listed molding compound 1.5 mm/V-..