Polymer Property : UL RTI, Mechanical without Impact = 302 °F Product List

Thermal Properties

Tips: 30 items are displayed at most.

Thermal Properties	Metric	English	Comments
UL RTI, Mechanical without Impact	150 °C @Thickness 1.50 mm	302 °F @Thickness 0.0591 in	UL746B
Covestro Apec® DP9-9371 High-Heat Polycarbonate, General Purpose  (discontinued **) Information provided by Bayer Corporation, Plastics DivisionAs of 1 September 2015, Bayer MaterialScience was separated from Bayer AG and has officially adopted its new name – Covestro. This produ..
UL RTI, Mechanical without Impact	150 °C	302 °F	Average value: 150 °C Grade Count:6
Overview of materials for Phenolic, Novolac, Heat Resistant Grade, Filled This property data is a summary of similar materials in the MatWeb database for the category "Phenolic, Novolac, Heat Resistant Grade, Filled". Each property range of values reported is minimum and ..
UL RTI, Mechanical without Impact	150 °C	302 °F	Average value: 150 °C Grade Count:6
Overview of materials for Phenolic, Novolac, Woodflour Filled This property data is a summary of similar materials in the MatWeb database for the category "Phenolic, Novolac, Woodflour Filled". Each property range of values reported is minimum and maximum valu..
UL RTI, Mechanical without Impact	150 °C @Thickness 1.50 mm	302 °F @Thickness 0.0591 in	(ALL)
Hexion Bakelite™ PF 31 Phenolic Formaldehyde Resin, UL Listed  (discontinued **) Phenolic molding compound, mainly organically filled, standard molding compound for normal stress, UL listed molding compound 1.5 mm/V-1 (All), 3 mm/V-0 (All), standardized molding compound.Applicat..
UL RTI, Mechanical without Impact	150 °C @Thickness 1.50 mm	302 °F @Thickness 0.0591 in	(BK, BN)
Hexion Bakelite™ PF 85 Phenolic Formaldehyde Resin, UL Listed  (discontinued **) Phenolic molding compound, organically filled, reinforced with cotton fibers, average notched impact strength, UL listed molding compound 1.5 mm/HB (BK, BN).Application areas: Switch covers, rolls, ..
UL RTI, Mechanical without Impact	150 °C @Thickness 0.840 mm	302 °F @Thickness 0.0331 in	BK
Hexion Bakelite™ PF 4109 Phenolic Formaldehyde Resin, Improved Electrical Properties, Ammonia Free, Resistant to High Temperatures, Low Shrinkage, High Arc Resistance, UL Listed, Acetic Acid Free Phenolic molding compound, inorganically filled, glass fiber reinforced, ammonia and acetic acid free, electrically high grade, high temperature stability, low shrinkage, high mechanical strength, U..
UL RTI, Mechanical without Impact	150 °C @Thickness 1.50 mm	302 °F @Thickness 0.0591 in	(BN, BK)
Hexion Bakelite™ X22 Phenolic Formaldehyde Resin, UL Listed  (discontinued **) Phenolic molding compound, mainly organically filled, UL listed molding compound 3.0 mm/V-0 (BN, BK).Application areas: Pot handles, operating controls, electrical isolators, housing parts.Informati..
UL RTI, Mechanical without Impact	150 °C @Thickness 1.50 mm	302 °F @Thickness 0.0591 in	BN, BK
Hexion Bakelite™ X65 Phenolic Formaldehyde Resin, UL Listed  (discontinued **) Phenolic molding compound, inorganically/organically filled, good heat-resistance and dimensional stability, UL listed molding compound 3.0 mm/V-0 (BN, BK).Application areas: Oven strips.Information..
UL RTI, Mechanical without Impact	150 °C @Thickness 1.63 mm	302 °F @Thickness 0.0642 in
Plenco 202 Black General Purpose Woodflour Filled Phenolic Molding Compound  (discontinued **) Plaslok 202 is a two-stage, woodflour-filled phenolic molding compound formulated to provide improved impact and fatigue strength, good dimensional stability and excellent molded finish for automoti..
UL RTI, Mechanical without Impact	150 °C @Thickness 1.47 mm	302 °F @Thickness 0.0579 in
Plenco 5000 Black General Purpose Woodflour Filled Phenolic Molding Compound  (discontinued **) Plaslok 5000 is the replacement material for the former Union Carbide BMM-5000. It is a two-stage, woodflour-filled phenolic molding compound having versatile molding performance and preheating cha..
UL RTI, Mechanical without Impact	150 °C @Thickness 1.47 mm	302 °F @Thickness 0.0579 in
Plenco 5440 Black General Purpose Phenolic Molding Compound  (discontinued **) Plaslok 5440 is the replacement material for the former Union Carbide BMRS-5440. It is a two-stage, phenolic molding compound that has been successfully formulated to accommodate a very wide range ..
UL RTI, Mechanical without Impact	150 °C @Thickness 1.47 mm	302 °F @Thickness 0.0579 in
Plenco 504 Black (INJ) Heat Resistant Mineral/Cellulose Filled Phenolic Molding Compound  (discontinued **)&lt Plaslok 504 is a two-stage, mineral and cellulose-filled phenolic molding compound having better impact and heat resistance than general purpose molding compounds. Since it also has good electrical..
UL RTI, Mechanical without Impact	150 °C @Thickness 1.57 mm	302 °F @Thickness 0.0618 in
Plenco 506 Black Heat Resistant Mineral Filled Phenolic Molding Compound  (discontinued **) Plaslok 506 is a two-stage, mineral-filled phenolic molding compound. It is formulated for automotive ashtrays and for appliance applications such as utensil handles receiving repeated exposure to ..
UL RTI, Mechanical without Impact	150 °C @Thickness 1.57 mm	302 °F @Thickness 0.0618 in
Plenco 5314 Black (COM) Impact Grade Phenolic Molding Compound  (discontinued **) Plaslok 5314 is the replacement material for the former Union Carbide BMMA-5314. It is a two-stage, impact grade phenolic molding compound suitable for compression, transfer or injection molding of..
UL RTI, Mechanical without Impact	150 °C @Thickness 1.47 mm	302 °F @Thickness 0.0579 in
Plenco 5314 Black (INJ) Impact Grade Phenolic Molding Compound  (discontinued **) Plaslok 5314 is the replacement material for the former Union Carbide BMMA-5314. It is a two-stage, impact grade phenolic molding compound suitable for compression, transfer or injection molding of..
UL RTI, Mechanical without Impact	150 °C @Thickness 1.60 mm	302 °F @Thickness 0.0630 in
Plenco 309 Black (INJ) Mineral/Fiber Filled Phenolic Molding Compound  (discontinued **) Plaslok 309 is a two-stage, mineral and fiber-filled phenolic molding compound having excellent impact strength; and as such, is considered a good candidate for replacing chopped-fiber filled compou..
UL RTI, Mechanical without Impact	150 °C @Thickness 1.63 mm	302 °F @Thickness 0.0642 in
Plaslok 202 Black General Purpose Woodflour Filled Phenolic Molding Compound  (discontinued **) Plaslok Corporation was purchased by Plastics Engineering Company (maker of Plenco brand materials) in March 2000. The Plaslok name is no longer in use.Plaslok 202 is a two-stage, woodflour-filled ..
UL RTI, Mechanical without Impact	150 °C	302 °F	E54153
Arlon 56866R026 0.028" Cured/Uncured Silicone Rubber with Fiberglass Substrate Design/Construction:Side 1: Cured Silicone RubberSubstrate: Style 1564 FiberglassSide 2: Uncured Silicone RubberInterleave: 3 mil LDPEThis data represents typical values for the production mater..
UL RTI, Mechanical without Impact	150 °C @Thickness 1.50 mm	302 °F @Thickness 0.0591 in	UL746B
Covestro Apec® DP9-9353 High-Heat Polycarbonate, UV Stabilized  (discontinued **) Information provided by Bayer Corporation, Plastics DivisionAs of 1 September 2015, Bayer MaterialScience was separated from Bayer AG and has officially adopted its new name – Covestro. This produ..
UL RTI, Mechanical without Impact	150 °C	302 °F
Resinoid 1322 Phenolic Molding, Glass Reinforced Data provided by the manufacturer.The Resinoid 1300 and 7000 glass fiber reinforced series compounds feature mechanical strength, dimensional stability, electrical insulation, and heat resistance
UL RTI, Mechanical without Impact	150 °C @Thickness 0.750 mm	302 °F @Thickness 0.0295 in	BK
Hexion Bakelite™ PF 2874 Phenolic Formaldehyde Resin, Low Shrinkage, Improved Electrical Properties, UL Listed, High Mechanical Strength Phenolic molding compound, inorganically filled, glass fiber reinforced, increased mechanical strength, increased temperature stability, low water absorption, good dimensional stability, UL listed m..
UL RTI, Mechanical without Impact	150 °C	302 °F	UL 746B
SABIC Innovative Plastics Valox® V9561 PET (Europe-Africa-Middle East) Flame retardant PET, 30% Glass fiber filled. Offering a good balance in CTI , GWIT , High Heat and mechanical performances.
UL RTI, Mechanical without Impact	150 °C @Thickness 1.47 mm	302 °F @Thickness 0.0579 in
Plaslok 5000 Black General Purpose Woodflour Filled Phenolic Molding Compound  (discontinued **) Plaslok Corporation was purchased by Plastics Engineering Company (maker of Plenco brand materials) in March 2000. The Plaslok name is no longer in use. Plaslok 5000 is the replacement material for ..
UL RTI, Mechanical without Impact	150 °C @Thickness 1.47 mm	302 °F @Thickness 0.0579 in
Plaslok 504 Black (COM) Heat Resistant Mineral/Cellulose Filled Phenolic Molding Compound  (discontinued **)&l Plaslok Corporation was purchased by Plastics Engineering Company (maker of Plenco brand materials) in March 2000. The Plaslok name is no longer in use.Plaslok 504 is a two-stage, mineral and cellu..
UL RTI, Mechanical without Impact	150 °C @Thickness 1.47 mm	302 °F @Thickness 0.0579 in
Plaslok 504 Black (INJ) Heat Resistant Mineral/Cellulose Filled Phenolic Molding Compound  (discontinued **)&l Plaslok Corporation was purchased by Plastics Engineering Company (maker of Plenco brand materials) in March 2000. The Plaslok name is no longer in use.Plaslok 504 is a two-stage, mineral and cellu..
UL RTI, Mechanical without Impact	150 °C	302 °F	1.47 mm
Plaslok 5314 Black (INJ) Impact Grade Phenolic Molding Compound  (discontinued **) Plaslok Corporation was purchased by Plastics Engineering Company (maker of Plenco brand materials) in March 2000. The Plaslok name is no longer in use.Plaslok 5314 is the replacement material for ..
UL RTI, Mechanical without Impact	150 °C	302 °F
Resinoid 7201 Phenolic Molding, Glass Reinforced Data provided by the manufacturer.The Resinoid 1300 and 7000 glass fiber reinforced series compounds feature mechanical strength, dimensional stability, electrical insulation, and heat resistance
UL RTI, Mechanical without Impact	150 °C @Thickness 1.50 mm	302 °F @Thickness 0.0591 in	(ALL)
Hexion Bakelite™ PF 2560 Phenolic Formaldehyde Resin, High Surface Quality, For Electrostatic Coating, UL Listed &n Phenolic molding compound, inorganically/organically filled, average heat resistant, high surface quality, lower water absorption than PF 31, minimal distortion, UL listed molding compound 1.5 mm/V-..