| Thermal Properties | Metric | English | Comments |
|---|---|---|---|
| Deflection Temperature at 1.8 MPa (264 psi) | 163 °C | 325 °F | ASTM D648 |
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NYCOA 715C PA 6
plasticized, high viscosity extrusion grade for monofilament weed eater, fishing lineInformation provided by NYCOA, Inc.
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| Deflection Temperature at 1.8 MPa (264 psi) | 163 °C | 325 °F | ASTM D648 |
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Network Polymers Kepital® F20-25
Description: Natural Acetal Copolymer, 25% Glass Reinforced GradeInformation provided by Network Polymers Inc.
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| Deflection Temperature at 1.8 MPa (264 psi) | 163 - 260 °C | 325 - 500 °F | Average value: 193 °C Grade Count:8 |
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Overview of materials for Polyetheretherketone, PEEK, Aramid Fiber Filled
This property data is a summary of similar materials in the MatWeb database for the category "Polyetheretherketone, PEEK, Aramid Fiber Filled". Each property range of values reported is minimum and ..
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| Deflection Temperature at 1.8 MPa (264 psi) | 163 °C | 325 °F | ASTM D648 |
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Polymer Resources AC-G25 Acetal Copolymer, 25% Glass Reinforced
Process: Molding or ExtrusionNotes: All physical, mechanical and thermal testing conducted on 1/8-inch thick, un-pigmented, test samples.Information provided by Polymer Resources Corporation.
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| Deflection Temperature at 1.8 MPa (264 psi) | 163 °C | 325 °F | ASTM D648 |
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Kolon KOCETAL® GF105 G/F Reinforced Acetal Resin
Glass fiber reinforced, improved stiffness. Applications: Products for high stiffness, improved fatigue properties. Information provided by API-Kolon.
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| Deflection Temperature at 1.8 MPa (264 psi) |
163
°C <br>@Thickness 3.20 mm
|
325
°F <br>@Thickness 0.126 in
|
unannealed; ASTM D648 |
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SABIC Innovative Plastics LNP STAT-KON EX02598C PEI
LNP* STAT-KON* EX02598C is a compound based on Polyetherimide containing Proprietary Filler(s). Added features of this material include: Clean Compound System, Electrically Conductive.
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| Deflection Temperature at 1.8 MPa (264 psi) |
163
°C <br>@Thickness 3.20 mm
|
325
°F <br>@Thickness 0.126 in
|
unannealed; ASTM D648 |
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SABIC Innovative Plastics LNP THERMOCOMP SF006 PA 12
LNP THERMOCOMP* SF006 is a compound based on Nylon 12 resin containing 30% Glass Fiber.
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| Deflection Temperature at 1.8 MPa (264 psi) | 163 °C | 325 °F | As molded; ASTM D648 |
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Sumitomo Bakelite North America RX® 3-1-501N-P Mineral Filled Diallyl Phthalate
Mineral filled, flame retardant, diallyl ortho-phthalate molding compound which meets the requirements of ASTM D5948 Type MDG-F.Information provided by Vyncolit, a Sumitomo Bak Group
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| Deflection Temperature at 1.8 MPa (264 psi) | 163 °C | 325 °F | Flatw 80*10*4 sp=64mm; ISO 75/Af |
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SABIC Innovative Plastics LNP STAT-KON 9X04323 PPE+PA66 (Asia Pacific)
LNP* Stat-kon* 9X04323 is a compound based on Noryl GTX resin,Added features of this material include: Electrically Conductive.
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| Deflection Temperature at 1.8 MPa (264 psi) |
163
°C <br>@Thickness 3.20 mm
|
325
°F <br>@Thickness 0.126 in
|
unannealed; ASTM D 648 |
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SABIC Innovative Plastics LNP Thermocomp SF006S PA 12
LNP* Thermocomp* SF006S is a compound based on Nylon 12 resin containing Glass Fiber. Added features of this material include: Heat Stabilized.This data was supplied by SABIC-IP for the Americas re..
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| Deflection Temperature at 1.8 MPa (264 psi) |
163
°C <br>@Thickness 3.17 mm
|
325
°F <br>@Thickness 0.125 in
|
Unannealed; ASTM D648 |
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Chase Plastics CP Pryme® AC125G Acetal Copolymer, 25% Glass Fiber Reinforced
Information provided by Chase Plastics.
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| Deflection Temperature at 1.8 MPa (264 psi) | 163 °C | 325 °F | ASTM D648 |
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Plenco 4466 Phenolic, Granular, Injection Molded
PLENCO 04466 is a heat resistant, mineral and flock filled phenolic molding compound, offering excellent mechanical strength and cosmetic properties. UL recognized under component file E40654. 04466..
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| Deflection Temperature at 1.8 MPa (264 psi) | 163 °C | 325 °F | ISO 75-1, 2 |
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Polyplastics Duracon® CH-20 Acetal Co-polymer (POM), Conductive, CF reinforced, Wear resistance
DURACON® is a crystalline thermoplastic acetal copolymer. The primary raw material trioxane, a trimer of formaldehyde.The thermoplastic adopts a copolymer structure in which polyoxymethylene (-C-O)..
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| Deflection Temperature at 1.8 MPa (264 psi) | 163 °C | 325 °F | ISO 75 |
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Polyram PlusTek PD300G5 Nylon 12 for Injection Molding, 25% Glass-Fiber Reinforced
25% Glass-fiber reinforced Nylon 12, heat stabilized and hydrolysis resistant for injection molding applications.Information provided by Polyram.
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| Deflection Temperature at 1.8 MPa (264 psi) | 163 °C | 325 °F | ISO 75 -1 & -2 flat |
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Asahi Kasei Tenac®-C GN455 Copolymer Acetal Resin
25% Glass Fiber - filled, high-flow grade, with high stiffness and superior dimensional stabilityInformation provided by Asahi Kasei Corporation.
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| Deflection Temperature at 1.8 MPa (264 psi) | 163 °C | 325 °F | ISO 75-1, 2 |
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Polyplastics Duracon® CH-10 Acetal Co-polymer (POM), Conductive, CF reinforced, Wear resistance
DURACON® is a crystalline thermoplastic acetal copolymer. The primary raw material trioxane, a trimer of formaldehyde.The thermoplastic adopts a copolymer structure in which polyoxymethylene (-C-O)..
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| Deflection Temperature at 1.8 MPa (264 psi) | 163 °C | 325 °F | Result based on HT G22; ISO 75-f |
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Victrex® HT™ G45 Polyetherketone
Product Description: High performance thermoplastic material, unreinforced PolyEtherKetone (PEK), semi crystalline, depth filtered granules for injection moulding, low flow, FDA food contact complia..
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| Deflection Temperature at 1.8 MPa (264 psi) | 163 °C | 325 °F | Unannealed; ASTM D648 |
|
Techmer ES Luriblend® POM CO GF20 TL20 20% Glass Filled
Availability: North AmericaForms: PelletsFiller/Reinforcement: Glass Fiber, 20% Filler by WeightAdditive: PTFE LubricantFeatures: Lubricated and CopolymerInformation provided by TP Composites, Inc.
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| Deflection Temperature at 1.8 MPa (264 psi) |
163
°C <br>@Thickness 6.35 mm
|
325
°F <br>@Thickness 0.250 in
|
Unannealed; ASTM D648 |
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PolyOne Stat-Tech™ NJ-20CF/000 Black Polyamide 12 (Nylon 12)
Stat-Tech™ Electrically Conductive Compounds are specifically engineered to provide anti-static, ESD and RFI/EMI shielding performance for critical electronic equipment applications. These compound..
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