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Polymer Property : CTE, linear = 12.2 µin/in-°F Product List
Thermal PropertiesTips: 30 items are displayed at most.
| Thermal Properties | Metric | English | Comments |
|---|---|---|---|
| CTE, linear |
22.0
-
47.0
µm/m-°C @Temperature -30.0 - 30.0 °C |
12.2
-
26.1
µin/in-°F @Temperature -22.0 - 86.0 °F |
TMA |
|
SABIC Innovative Plastics Lexan® LC120 PC (Asia Pacific) |
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| CTE, linear |
22.0
µm/m-°C @Temperature 20.0 °C |
12.2
µin/in-°F @Temperature 68.0 °F |
|
|
Cookson Group Plaskon® 3200LS Mineral Filled Novolac Epoxy Molding Compound
(discontinued **)
Test specimens were transfer molded and post cured 4 hours at 175°C.Exhibits exceptional reliability under very stringent testing. This material is designed to minimize stress on the encapsulated ..
|
|||
| CTE, linear |
22.0
µm/m-°C @Temperature 20.0 °C |
12.2
µin/in-°F @Temperature 68.0 °F |
|
|
Cookson Group Plaskon® 3400F Epoxy Molding Compound
(discontinued **)
Test specimens were transfer molded and post cured 4 hours at 175°C.A fast curing, reduced-stress epoxy molding compound for the encapsulation of semiconductor devices including DIPs, PLCCs, SOICs ..
|
|||
| CTE, linear |
22.0
µm/m-°C @Temperature 20.0 °C |
12.2
µin/in-°F @Temperature 68.0 °F |
|
|
Cookson Group Plaskon® 3400FP Epoxy Molding Compound
(discontinued **)
Test specimens were transfer molded and post cured 4 hours at 175°C.A fast curing, reduced-stress epoxy molding compound for the encapsulation of semiconductor devices including DIPs, PLCCs, SOICs ..
|
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| CTE, linear | 22.0 µm/m-°C | 12.2 µin/in-°F | DIN 53752 |
|
Lehmann & Voss LUVOCOM® 1105-7920/RD PEEK, with glass fiber
Applications: Automotive industry, textile machinery, medical- and precision engineering, aircraft industry.Strong, stiff parts.Chemical and hydrolysis resistance parts, non flammable.High dimension..
|
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| CTE, linear | 22.0 µm/m-°C | 12.2 µin/in-°F | DIN 53752 |
|
Lehmann & Voss LUVOCOM® 50/CF/10/GF/20/BK Polycarbonate, with carbon fiber and glass fiber
Applications: Data processing machinery, precision engineering, film and photo industry, sporting and leisure goods, medical enineering.High-strength and high-stiff parts; low coefficient of expansi..
|
|||
| CTE, linear | 22.0 µm/m-°C | 12.2 µin/in-°F | DIN 53752 |
|
Lehmann & Voss LUVOCOM® 1104-7452 Polyether ketone, with glass fiber, easy flowing
Applications: Automotive industry, mechanical- and precision engineering.Improved strength and stiffnes at elevated temperatures.Improved fatigue properties.Thermic, mechanic and chemical highly str..
|
|||
| CTE, linear | 22.0 µm/m-°C | 12.2 µin/in-°F | DIN 53752 |
|
Lehmann & Voss LUVOCOM® 1105-0923/GY2 PEEK, with glass fiber
Applications: Automotive industry, textile machinery, medical- and precision engineering, aircraft industry.Strong, stiff parts.High dimensionally stable precision parts, high continuous use tempera..
|
|||
| CTE, linear | 22.0 µm/m-°C | 12.2 µin/in-°F | DIN 53752 |
|
Lehmann & Voss LUVOCOM® 1105-8389/BL PEEK, with glass fiber
Applications: Automotive industry, textile machinery, medical- and precision engineering, aircraft industry.Strong, stiff parts.Chemical and hydrolysis resistance parts, non flammable.High dimension..
|
|||
| CTE, linear | 22.0 µm/m-°C | 12.2 µin/in-°F | DIN 53752 |
|
Lehmann & Voss LUVOCOM® 1105-8402 PEEK, with glass fiber
Applications: Automotive industry, textile machinery, medical- and precision engineering, aircraft industry.Strong, stiff parts.Chemical and hydrolysis resistance parts, non flammable.High dimension..
|
|||
| CTE, linear |
22.0
µm/m-°C @Temperature 20.0 °C |
12.2
µin/in-°F @Temperature 68.0 °F |
|
|
Indium Corp. Indalloy 108 Tin-Lead Solder Alloy
Good pre-tinning alloyInformation Provided by Indium Corporation
|
|||
| CTE, linear |
22.0
µm/m-°C @Temperature 20.0 °C |
12.2
µin/in-°F @Temperature 68.0 °F |
|
|
Indium Corp. Indalloy® 158 Bi-Pb-Sn-Cd Solder Alloy
Lowest melting point solder. Good fusible alloy used for lens blocking.Information provided by the manufacturer, Indium Corporation.
|
|||
| CTE, linear | 22.0 µm/m-°C | 12.2 µin/in-°F | DIN 53752 |
|
Lehmann & Voss LUVOCOM® 1105-0858 PEEK, with glass fiber, easy flowing
Applications: Automotive industry, textile machinery, medical- and precision engineering, aircraft industry.Strong, stiff parts.High dimensionally stable precision parts, high continuous use tempera..
|
|||
| CTE, linear |
22.0
-
34.0
µm/m-°C @Temperature -30.0 - 30.0 °C |
12.2
-
18.9
µin/in-°F @Temperature -22.0 - 86.0 °F |
TMA |
|
SABIC Innovative Plastics NORYL PX2956 PPE+PS (Asia Pacific)
PPE+PS GF+Mineral Filler total 35% FR V-0
|
|||
| CTE, linear |
22.0
µm/m-°C @Temperature 23.0 - 60.0 °C |
12.2
µin/in-°F @Temperature 73.4 - 140 °F |
|
|
Sumitomo Bakelite Sumikon® PM-9501 Glass-Filled Phenolic, Compression Grade
Sumikon PM-9501 is a two stage glass fiber and mineral filled black phenolic special purpose molding compound. It is especially designed for applications requiring high strength and dimensional s..
|
|||
| CTE, linear |
22.0
µm/m-°C @Temperature 23.0 - 60.0 °C |
12.2
µin/in-°F @Temperature 73.4 - 140 °F |
|
|
Sumitomo Bakelite Sumikon® PM-9501 Glass-Filled Phenolic, Injection Grade
Sumikon PM-9501 is a two stage glass fiber and mineral filled black phenolic special purpose molding compound. It is especially designed for applications requiring high strength and dimensional s..
|
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| CTE, linear | 22.0 - 25.0 µm/m-°C | 12.2 - 13.9 µin/in-°F | |
|
Master Bond EP21ANHT Two Component, Room Temperature Curing Epoxy Adhesive
Product Description: Master Bond Polymer Adhesive EP21ANHT is a two component room temperature curing adhesive, sealant and coating that combines high thermal conductivity and electrical insulation ..
|
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| CTE, linear | 22.0 - 25.0 µm/m-°C | 12.2 - 13.9 µin/in-°F | |
|
Master Bond EP30ANHT Two Part, Electrically Isolating Epoxy Adhesive
Description: Master Bond Polymer System EP30ANHT is a two part epoxy system with terrific thermal conductivity, while maintaining electrical insulation. One noteworthy property is its wide service t..
|
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| CTE, linear | 22.0 - 25.0 µm/m-°C | 12.2 - 13.9 µin/in-°F | |
|
Master Bond EP30AOHT Dimensionally Stable, Two Component Epoxy
Description: Master Bond Polymer System EP30AOHT is a two component epoxy resin system for high performance bonding, potting, sealing and coating, formulated to cure at room temperature or more rapi..
|
|||
| CTE, linear |
22.0
µm/m-°C @Temperature 20.0 °C |
12.2
µin/in-°F @Temperature 68.0 °F |
DIN 53752 |
|
Zell-Metall Engineering Plastics Zellamid 1500T (PEEK modified)
Zellamid® 1500 (Polyetheretherketone - PEEK, natural) is the registered trademark for Zell-Metall’s semi-crystalline high performance thermoplastic which exhibits a unique combination of high m..
|
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| CTE, linear | 21.9 µm/m-°C | 12.2 µin/in-°F | |
|
Hexcel® HexPly® F522 Epoxy Resin
HexPly® F522 is an advanced, modified epoxy formulation designed for autoclave curing to offer very high laminate strengths, coupled with increased fracture toughness, excellent hot-wet properties ..
|
|||
| CTE, linear |
22.0
µm/m-°C @Temperature 20.0 °C |
12.2
µin/in-°F @Temperature 68.0 °F |
|
|
AIM 95Sn/3.5Ag/1.5In Solder for Photonic Packaging
Uses include:Fiber to Ferrule SolderingLaser Die AttachHermetic Packaging & SealingWetting & Sealing Laser OpticsThermal ManagementInformation provided by AIM Specialty Materials.
|
|||
| CTE, linear |
22.0
µm/m-°C @Temperature 23.0 - 80.0 °C |
12.2
µin/in-°F @Temperature 73.4 - 176 °F |
53752-A |
|
BASF Elastollan R 2001 20% Glass Filled TPUR
Description: Thermoplastic Polyester Polyurethane Elastomers with exceptional properties, very high impact resistance, high modulus with at the same time elasticity, low coefficient of thermal expan..
|
|||
| CTE, linear |
22.0
µm/m-°C @Temperature -30.0 - 30.0 °C |
12.2
µin/in-°F @Temperature -22.0 - 86.0 °F |
ASTM Test |
|
BASF Petra® 140 BK-112 45% Glass Filled PET
Petra 140 BK-112 is a 45% glass reinforced, pigmented black, polyethylene terephthalate (PET) injection molding compound offering an increased level of strength, stiffness, high temperature performa..
|
|||
| CTE, linear |
22.0
µm/m-°C @Temperature 20.0 °C |
12.2
µin/in-°F @Temperature 68.0 °F |
|
|
AIM 70 Fusible Alloy
Uses: punch and die in short run sheet metal forming; external and internal support for bending tubing extrusions; holding jet engine blades for machining and broaching; annealing and nitriding seal..
|
|||
| CTE, linear |
22.0
µm/m-°C @Temperature 20.0 °C |
12.2
µin/in-°F @Temperature 68.0 °F |
ASTM D-696 |
|
Glastic GLASGUARD Scuff and Bulkhead Liners
GlasGuard Scuff and Bulkhead Liners serve as a method of protecting trailer walls from damage caused by forklift trucks and careless loading and unloading of freight. Manufactured of 1/4" thick fib..
|
|||
| CTE, linear |
22.0
-
71.0
µm/m-°C @Temperature -30.0 - 30.0 °C |
12.2
-
39.4
µin/in-°F @Temperature -22.0 - 86.0 °F |
TMA |
|
SABIC Innovative Plastics NORYL PX2935 PPE+PS (Asia Pacific)
PPE/PS, GF20%, non-FR
|
|||
| CTE, linear |
22.0
µm/m-°C @Temperature 20.0 °C |
12.2
µin/in-°F @Temperature 68.0 °F |
|
|
AIM 97In/3Ag Solder for Photonic Packaging
Uses include:Fiber to Ferrule SolderingLaser Die AttachHermetic Packaging & SealingWetting & Sealing Laser OpticsThermal ManagementInformation provided by AIM Specialty Materials.
|
|||
| CTE, linear | 22.0 µm/m-°C | 12.2 µin/in-°F | DIN 53752 |
|
Lehmann & Voss LUVOCOM® 1105-7173/BL PEEK, with glass fiber
Applications: Automotive industry, textile machinery, medical- and precision engineering, aircraft industry.Strong, stiff parts.Chemical and hydrolysis resistance parts, non flammable.High dimension..
|
|||
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