Polymer Property : CTE, linear = 13.9 µin/in-°F Product List

Thermal Properties

Tips: 30 items are displayed at most.

Thermal Properties	Metric	English	Comments
CTE, linear	5.00 - 25.0 µm/m-°C	2.78 - 13.9 µin/in-°F	Average value: 15.0 µm/m-°C Grade Count:6
Overview of materials for Phenolic, Resole, Glass Fiber Filled This property data is a summary of similar materials in the MatWeb database for the category "Phenolic, Resole, Glass Fiber Filled". Each property range of values reported is minimum and maximum val..
CTE, linear	7.00 - 25.0 µm/m-°C	3.89 - 13.9 µin/in-°F	Average value: 15.7 µm/m-°C Grade Count:3
Overview of materials for Polyphenylene Sulfide (PPS) with 50% Glass Fiber Filler This property data is a summary of similar materials in the MatWeb database for the category "Polyphenylene Sulfide (PPS) with 50% Glass Fiber Filler". Specific grades with glass content between 45%..
CTE, linear	6.00 - 25.0 µm/m-°C	3.33 - 13.9 µin/in-°F	Average value: 16.4 µm/m-°C Grade Count:8
Overview of materials for Nylon 66, 30% Carbon Fiber Filled This property data is a summary of similar materials in the MatWeb database for the category "Nylon 66, 30% Carbon Fiber Filled". Specific grades with carbon fiber content between 25% and 34% are in..
CTE, linear	22.0 - 25.0 µm/m-°C	12.2 - 13.9 µin/in-°F
Master Bond EP21ANHT Two Component, Room Temperature Curing Epoxy Adhesive Product Description: Master Bond Polymer Adhesive EP21ANHT is a two component room temperature curing adhesive, sealant and coating that combines high thermal conductivity and electrical insulation ..
CTE, linear	22.0 - 25.0 µm/m-°C	12.2 - 13.9 µin/in-°F
Master Bond EP21AOLV-1 Two Part, Room Temperature Curing Epoxy System Product Description: Master Bond Polymer Adhesive EP21AOLV-1 is a two component, thermally conductive, electrically isolating epoxy adhesive, sealant and coating. This versatile system will adhere t..
CTE, linear	20.0 - 25.0 µm/m-°C	11.1 - 13.9 µin/in-°F
Master Bond EP30AN-1 Low Viscosity, NASA Low Outgassing Epoxy Description: Master Bond EP30AN-1 is a two part epoxy for high performance potting, sealing, coating and bonding featuring high thermal conductivity, excellent electrical insulation properties and N..
CTE, linear	22.0 - 25.0 µm/m-°C	12.2 - 13.9 µin/in-°F
Master Bond EP30ANHT Two Part, Electrically Isolating Epoxy Adhesive Description: Master Bond Polymer System EP30ANHT is a two part epoxy system with terrific thermal conductivity, while maintaining electrical insulation. One noteworthy property is its wide service t..
CTE, linear	22.0 - 25.0 µm/m-°C	12.2 - 13.9 µin/in-°F
Master Bond EP30AOHT Dimensionally Stable, Two Component Epoxy Description: Master Bond Polymer System EP30AOHT is a two component epoxy resin system for high performance bonding, potting, sealing and coating, formulated to cure at room temperature or more rapi..
CTE, linear	15.0 - 25.0 µm/m-°C	8.33 - 13.9 µin/in-°F	VDE 0304T1
Bulk Molding Compounds tetra-DUR F 4401 Bulk Molding Compound UL-licensed, general purpose productTypical Applications - Requiring mechanical strength, abrasion resistance, dimensional stability, electrical insulation, electrostatic dissipation (explosion prot..
CTE, linear	15.0 - 25.0 µm/m-°C	8.33 - 13.9 µin/in-°F	VDE 0304T1
Bulk Molding Compounds tetra-DUR L 4305 Bulk Molding Compound UL-licensed. Anchor wave-isolation.Typical Applications - Requiring mechanical strength, abrasion resistance, dimensional stability, electrical insulation, electrostatic dissipation (explosion prote..
CTE, linear	18.0 - 25.0 µm/m-°C	10.0 - 13.9 µin/in-°F	VDE 0304T1
Bulk Molding Compounds tetra-DUR N 4303 Bulk Molding Compound Mechanical high grade standard product.Typical Applications - Requiring mechanical strength, abrasion resistance, dimensional stability, electrical insulation, electrostatic dissipation (explosion p..
CTE, linear	15.0 - 25.0 µm/m-°C @Temperature 50.0 - 150 °C	8.33 - 13.9 µin/in-°F @Temperature 122 - 302 °F	Average value: 19.2 µm/m-°C Grade Count:3
Overview of materials for Epoxy Molding Compound This property data is a summary of similar materials in the MatWeb database for the category "Epoxy Molding Compound". Each property range of values reported is minimum and maximum values of appropr..
CTE, linear	25.0 - 25.0 µm/m-°C @Temperature 140 - 180 °C	13.9 - 13.9 µin/in-°F @Temperature 284 - 356 °F	Average value: 25.0 µm/m-°C Grade Count:1
Overview of materials for Polysulfone, 30% Glass Fiber Reinforced This property data is a summary of similar materials in the MatWeb database for the category "Polysulfone, 30% Glass Fiber Reinforced". Specific grades with glass content between 25% and 34% are inc..
CTE, linear	20.0 - 25.0 µm/m-°C	11.1 - 13.9 µin/in-°F	VDE 0304T1
Bulk Molding Compounds tetra-DUR F 4206 Bulk Molding Compound General purpose productTypical Applications - Requiring mechanical strength, abrasion resistance, dimensional stability, electrical insulation, electrostatic dissipation (explosion protection), ther..