| Thermal Properties | Metric | English | Comments |
|---|---|---|---|
| CTE, linear |
200
µm/m-°C @Temperature 23.0 - 60.0 °C |
111
µin/in-°F @Temperature 73.4 - 140 °F |
|
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Murtfeldt Muralen® Black Antistatic Polyethylene, Conductive
Muralen® is based on high molecular weight polyethylene (PE-HMW) and is ideally suited for use in applications that require the generally impressive material properties of polyethylene. Because of..
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| CTE, linear |
200
µm/m-°C @Temperature 23.0 - 60.0 °C |
111
µin/in-°F @Temperature 73.4 - 140 °F |
|
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Murtfeldt Original Material ”S”® Black Antistatic Polyethylene, Conductive
Original Material ”S”® black has the same properties as Original Material ”S”® green/natural. In addition, it is also electrostatically conductive due to the addition of additives. Special Pro..
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| CTE, linear |
200
µm/m-°C @Temperature 23.0 - 60.0 °C |
111
µin/in-°F @Temperature 73.4 - 140 °F |
|
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Murtfeldt Original Material ”S”® plus + LF Polyethylene, Low Friction
This material has half the sliding friction coefficient of the Original Material ”S”®. This enables an increased machine running speed at the same time as less abrasion and thus a lower maintenan..
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| CTE, linear |
200
µm/m-°C @Temperature 23.0 - 60.0 °C |
111
µin/in-°F @Temperature 73.4 - 140 °F |
|
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Murtfeldt Original Material ”S”® plus + TLS Polyethylene
Original Material ”S”® plus+ TLS is designed for high temperature industrial applications for which Original Material ”S”® could previously not be used. The thermal oxidation point has been i..
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| CTE, linear | 200 µm/m-°C | 111 µin/in-°F | DIN 53752 |
|
Okulen® 2000 PE-UHMW, 588 Blue
OKULEN® 2000 is an ultra high molecular low pressure polythylene with a molecular weight of > 7.000.000 g/mol plus additives for the improvement of specific material properties. It has an antistati..
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| CTE, linear | 200 µm/m-°C | 111 µin/in-°F | DIN 53752 |
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Okulen® 2000 PE-UHMW, AB
OKULEN® 2000 is an ultra high molecular low pressure polythylene with a molecular weight of > 7.000.000 g/mol plus additives for the improvement of specific material properties. It has an antistati..
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| CTE, linear | 200 µm/m-°C | 111 µin/in-°F | DIN 53752 |
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Okulen® 2000 PE-UHMW, GB
OKULEN® 2000 is an ultra high molecular low pressure polythylene with a molecular weight of > 7.000.000 g/mol plus additives for the improvement of specific material properties. It has an antistati..
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| CTE, linear | 200 µm/m-°C | 111 µin/in-°F | DIN 53752 |
|
Okulen® 2000 PE-UHMW, L
OKULEN® 2000 is an ultra high molecular low pressure polythylene with a molecular weight of > 7.000.000 g/mol plus additives for the improvement of specific material properties. It has an antistati..
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| CTE, linear | 200 µm/m-°C | 111 µin/in-°F | DIN 53752 |
|
Okulen® 2000 PE-UHMW, SG
OKULEN® 2000 is an ultra high molecular low pressure polythylene with a molecular weight of > 7.000.000 g/mol plus additives for the improvement of specific material properties. It has an antistati..
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| CTE, linear | 200 µm/m-°C | 111 µin/in-°F | DIN 53752 |
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Okulen® 2000 PE-UHMW, SL
OKULEN® 2000 is an ultra high molecular low pressure polythylene with a molecular weight of > 7.000.000 g/mol plus additives for the improvement of specific material properties. It has an antistati..
|
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| CTE, linear |
200
µm/m-°C @Temperature 23.0 - 100 °C |
111
µin/in-°F @Temperature 73.4 - 212 °F |
|
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Quadrant EPP TIVAR® TECH PE-UHMW + MoS2 (ISO Data)
This PE-UHMW grade with extremely high degree of polymerisation contains molybdenum disulphide, resulting in a material with improved wear resistance and sliding properties over TIVAR 1000.
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| CTE, linear | 200 µm/m-°C | 111 µin/in-°F | ASTM E831 |
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Parker Chomerics THERM-A-FORM 1642 Cure-in-Place Potting and Underfill Material
Description: THERM-A-FORM™ thermally conductive silicone elastomer products are dispensable form-in-place compounds designed for heat transfer without excessive compressive force in electronics co..
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| CTE, linear |
200
µm/m-°C @Temperature 20.0 °C |
111
µin/in-°F @Temperature 68.0 °F |
|
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3M Dyneon™ Fluorel™ FE-5623Q Fluoroelastomer VF2 + HFP Dipolymer
(discontinued **)
Data provided by the manufacturer, Dyneon LLC.Incorporated cure polymer, 65.9%F in polymer with 22% Medium Thermal Carbon Black (N990), 2% MgO, and 4% Ca(OH)2. The FE series O-ring grades are the c..
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| CTE, linear |
200
µm/m-°C @Temperature 20.0 °C |
111
µin/in-°F @Temperature 68.0 °F |
|
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3M Dyneon™ Fluorel™ FE-5641Q Fluoroelastomer VF2 + HFP Dipolymer
(discontinued **)
Data provided by the manufacturer, Dyneon LLC.Incorporated cure polymer, 65.9%F in polymer with 22% Medium Thermal Carbon Black (N990), 2% MgO, and 4% Ca(OH)2. The FE series O-ring grades are the c..
|
|||
| CTE, linear |
200
µm/m-°C @Temperature 20.0 °C |
111
µin/in-°F @Temperature 68.0 °F |
|
|
3M Dyneon™ Fluorel™ FC-2121 Fluoroelastomer VF2 + HFP Dipolymer
(discontinued **)
Data provided by the manufacturer, Dyneon LLC.Incorporated cure polymer, 65.9%F in polymer with 22% Medium Thermal Carbon Black (N990), 2% MgO, and 4% Ca(OH)2. Excellent processability. Suggested ..
|
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| CTE, linear |
200
µm/m-°C @Temperature 20.0 °C |
111
µin/in-°F @Temperature 68.0 °F |
|
|
3M Dyneon™ Fluorel™ FC-2174 Fluoroelastomer VF2 + HFP Dipolymer
(discontinued **)
Data provided by the manufacturer, Dyneon LLC.Incorporated cure polymer, 65.9%F in polymer with 22% Medium Thermal Carbon Black (N990), 2% MgO, and 4% Ca(OH)2. Excellent processability. Suggested ..
|
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| CTE, linear |
200
µm/m-°C @Temperature 20.0 °C |
111
µin/in-°F @Temperature 68.0 °F |
|
|
3M Dyneon™ Fluorel™ FC-2176 Fluoroelastomer VF2 + HFP Dipolymer
(discontinued **)
Data provided by the manufacturer, Dyneon LLC.Incorporated cure polymer, 65.9%F in polymer with 22% Medium Thermal Carbon Black (N990), 2% MgO, and 4% Ca(OH)2. Good general purpose grade with good ..
|
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| CTE, linear |
200
µm/m-°C @Temperature 20.0 °C |
111
µin/in-°F @Temperature 68.0 °F |
|
|
3M Dyneon™ Fluorel™ FC-2182 Fluoroelastomer VF2 + HFP Dipolymer
(discontinued **)
Data provided by the manufacturer, Dyneon LLC.Incorporated cure polymer, 65.9%F in polymer with 22% Medium Thermal Carbon Black (N990), 2% MgO, and 4% Ca(OH)2. Dipolymer for autoclave curing. Used..
|
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| CTE, linear |
200
µm/m-°C @Temperature 20.0 °C |
111
µin/in-°F @Temperature 68.0 °F |
|
|
3M Dyneon™ Fluorel™ FC-2145 Fluoroelastomer VF2 + HFP Dipolymer
(discontinued **)
Data provided by the manufacturer, Dyneon LLC.Non-incorporated cure polymer, 65.9%F in polymer with 22% Medium Thermal Carbon Black (N990), 2% MgO, 4% Ca(OH)2, 1.4% Dihydroxy Crosslinker, 0.4% Phosp..
|
|||
| CTE, linear |
200
µm/m-°C @Temperature 20.0 °C |
111
µin/in-°F @Temperature 68.0 °F |
|
|
3M Dyneon™ Fluorel™ FC-2261Q Fluoroelastomer VF2 + HFP Dipolymer
(discontinued **)
Data provided by the manufacturer, Dyneon LLC.Non-incorporated cure polymer, 65.9%F in polymer with 22% Medium Thermal Carbon Black (N990), 2% MgO, 4% Ca(OH)2, 1.4% Dihydroxy Crosslinker, 0.4% Phosp..
|
|||
| CTE, linear |
200
µm/m-°C @Temperature 20.0 °C |
111
µin/in-°F @Temperature 68.0 °F |
ASTM E-831 |
|
DSM Biomedical PurSil® AL 5 Aliphatic Thermoplastic Silicone Polyether Urethane
(discontinued **)
PurSil® AL is a family of aliphatic, thermoplastic silicone polyether urethane copolymers. These polymers are formed by the incorporation of silicone in the polymer backbone together with polyether..
|
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| CTE, linear | 200 µm/m-°C | 111 µin/in-°F | DIN 52328 |
|
Isoflon PEHD 500 High Density Polyethylene
Products with excellent friction, anti-stick, abrasion and chemical inertia characteristicsVery good impact resistanceNo moisture regainProduct for the food industryInformation provided by Isoflon.
|
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| CTE, linear |
200
µm/m-°C @Temperature 20.0 °C |
111
µin/in-°F @Temperature 68.0 °F |
|
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Momentive Performance Materials RTV31 Red Extreme High Temperature Potting/Encapsulating Compound
Two-part condensation cure. Two-part condensation cure silicones RTVs are designed to cute at room temperature, and can be applied at temperature up to one inch (2.5 cm). These are very tough mate..
|
|||
| CTE, linear |
200
µm/m-°C @Temperature 20.0 °C |
111
µin/in-°F @Temperature 68.0 °F |
|
|
Momentive Performance Materials RTV41 White General Purpose Potting/Encapsulating Compound
Two-part condensation cure. Two-part condensation cure silicones RTVs are designed to cute at room temperature, and can be applied at temperature up to one inch (2.5 cm). These are very tough mate..
|
|||
| CTE, linear |
200
µm/m-°C @Temperature 20.0 °C |
111
µin/in-°F @Temperature 68.0 °F |
|
|
Momentive Performance Materials RTV60 Red Extreme High Temperature Potting/Encapsulating Compound
Two-part condensation cure. Two-part condensation cure silicones RTVs are designed to cute at room temperature, and can be applied at temperature up to one inch (2.5 cm). These are very tough mate..
|
|||
| CTE, linear |
200
µm/m-°C @Temperature 20.0 - 100 °C |
111
µin/in-°F @Temperature 68.0 - 212 °F |
DIN 53752 |
|
Schwartz Technical Plastics LAMIGAMID® 700 Ultra High Molecular Weight Polyethylene
Application: wear liners, sliding platesInformation provided by Schwartz Technical Plastics GmbH
|
|||
| CTE, linear |
200
µm/m-°C @Temperature 20.0 °C |
111
µin/in-°F @Temperature 68.0 °F |
TMA |
|
Toyobo PELPRENE™ P40BU Polyester TPE, Weather-resistant
Features: Polyester TPE, Weather-resistantInformation provided by Toyobo.
|
|||
| CTE, linear |
200
µm/m-°C @Temperature 20.0 - 60.0 °C |
111
µin/in-°F @Temperature 68.0 - 140 °F |
TMS2 Perkin Elmer |
|
Arkema Group Orgalloy® LE 60LMXV Polyamide 6 Alloy
Polyamide Alloy, Semi-Flexible grade, Nylon 6 basedTubes / Mandrels / Profiles / CablesInformation provided by Arkema Group
|
|||
| CTE, linear |
200
µm/m-°C @Temperature 20.0 °C |
111
µin/in-°F @Temperature 68.0 °F |
ISO 11359 |
|
CENTROPLAST CENTROLEN PE-HD Polyethylene high density
This material is a low density, easily machined plastic that can be welded and has good chemical resistance. Applications include apparatus engineering, and machines in the foodstuff industry.Infor..
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