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Polymer Property : CTE, linear = 22.0 µm/m-°C Product List

Thermal Properties

Tips: 30 items are displayed at most.
Thermal Properties Metric English Comments
CTE, linear 22.0 - 47.0 µm/m-°C

@Temperature -30.0 - 30.0 °C
 12.2 - 26.1 µin/in-°F

@Temperature -22.0 - 86.0 °F
 TMA
SABIC Innovative Plastics Lexan® LC120 PC (Asia Pacific)
CTE, linear 22.0 µm/m-°C

@Temperature 20.0 °C
 12.2 µin/in-°F

@Temperature 68.0 °F
Cookson Group Plaskon® 440 Mineral Filled Novolac Epoxy Molding Compound  (discontinued **)
Test specimens were transfer molded and post cured 4 hours at 175°C.Combines exceptional reliability with wide molding process latitude. This material is designed to encapsulate semiconductor devi..
CTE, linear 22.0 µm/m-°C

@Temperature 20.0 °C
 12.2 µin/in-°F

@Temperature 68.0 °F
Cookson Group Plaskon® 440S Mineral Filled Novolac Epoxy Molding Compound  (discontinued **)
Test specimens were transfer molded and post cured 4 hours at 175°C.Combines exceptional reliability with wide process latitude. This material is designed to encapsulate a wide range of semiconduc..
CTE, linear 22.0 µm/m-°C

@Temperature 20.0 °C
 12.2 µin/in-°F

@Temperature 68.0 °F
Cookson Group Plaskon® 3400F Epoxy Molding Compound  (discontinued **)
Test specimens were transfer molded and post cured 4 hours at 175°C.A fast curing, reduced-stress epoxy molding compound for the encapsulation of semiconductor devices including DIPs, PLCCs, SOICs ..
CTE, linear 22.0 µm/m-°C
12.2 µin/in-°F
DIN 53752
Lehmann & Voss LUVOCOM® 1105-7192 PEEK, with glass fiber
Applications: Automotive industry, textile machinery, medical- and precision engineering, aircraft industry.Strong, stiff parts.Chemical and hydrolysis resistance parts, non flammable.High dimension..
CTE, linear 22.0 µm/m-°C
12.2 µin/in-°F
DIN 53752
Lehmann & Voss LUVOCOM® 1105-7920/RD PEEK, with glass fiber
Applications: Automotive industry, textile machinery, medical- and precision engineering, aircraft industry.Strong, stiff parts.Chemical and hydrolysis resistance parts, non flammable.High dimension..
CTE, linear 22.0 µm/m-°C
12.2 µin/in-°F
DIN 53752
Lehmann & Voss LUVOCOM® 1105-7938/GY PEEK, with glass fiber
Applications: Automotive industry, textile machinery, medical- and precision engineering, aircraft industry.Strong, stiff parts.Chemical and hydrolysis resistance parts, non flammable.High dimension..
CTE, linear 22.0 µm/m-°C
12.2 µin/in-°F
DIN 53752
Lehmann & Voss LUVOCOM® 50/CF/10/GF/20/BK Polycarbonate, with carbon fiber and glass fiber
Applications: Data processing machinery, precision engineering, film and photo industry, sporting and leisure goods, medical enineering.High-strength and high-stiff parts; low coefficient of expansi..
CTE, linear 22.0 µm/m-°C

@Temperature 20.0 °C
 12.2 µin/in-°F

@Temperature 68.0 °F
 DIN 53752
GEHR Plastics PEEK-mod Polyetheretherketone, 10% PTFE, 10% Graphite, 10% Carbon Fiber
Polyether etherketone can be used at very high temperatures and it shows a good mechanical strength, toughness, hardness, flexural strength, and torsional strength. PEEK exhibits excellent chemical ..
CTE, linear 22.0 µm/m-°C

@Temperature 20.0 °C
 12.2 µin/in-°F

@Temperature 68.0 °F
Indium Corp. Indalloy® 19 In-Bi-Sn Fusible Alloy
Environmentally safe fusible alloy. Contains no lead or cadmium.Information provided by the manufacturer, Indium Corporation.
CTE, linear 22.0 µm/m-°C
12.2 µin/in-°F
Lord Adhesives Circalokâ„¢ 6037 Epoxy Adhesive
Circalokâ„¢ 6037 is an epoxy adhesive formulated for use by the semiconductor industry. An easy-to-spread thixotropic paste, it offers high heat transfer, low shrinkage, and a coefficient of ther..
CTE, linear 22.0 µm/m-°C
12.2 µin/in-°F
DIN 53752
Lehmann & Voss LUVOCOM® 1104-7452 Polyether ketone, with glass fiber, easy flowing
Applications: Automotive industry, mechanical- and precision engineering.Improved strength and stiffnes at elevated temperatures.Improved fatigue properties.Thermic, mechanic and chemical highly str..
CTE, linear 22.0 µm/m-°C
12.2 µin/in-°F
DIN 53752
Lehmann & Voss LUVOCOM® 1105/GF/30/NAT-2 PEEK, with glass fiber
Applications: Automotive industry, textile machinery, medical- and precision engineering, aircraft industry.Strong, stiff parts.Chemical and hydrolysis resistance parts, non flammable.High dimension..
CTE, linear 22.0 µm/m-°C
12.2 µin/in-°F
DIN 53752
Lehmann & Voss LUVOCOM® 1105/GF/30/TF/15 PEEK, with glass fiber and PTFE
Applications: Automotive industry, textile machinery, medical- and precision engineering, aircraft industry.Dynamic stressed parts at high movement velocity.Chemical and hydrolysis resistance parts,..
CTE, linear 22.0 µm/m-°C
12.2 µin/in-°F
DIN 53752
Lehmann & Voss LUVOCOM® 1105-0779/WT PEEK, with glass fiber
Applications: Automotive industry, textile machinery, medical- and precision engineering, aircraft industry.Strong, stiff parts.High chemical resistance parts, hydrolysis resistance, non flammable.H..
CTE, linear 22.0 µm/m-°C
12.2 µin/in-°F
DIN 53752
Lehmann & Voss LUVOCOM® 1105-0895/BL PEEK, with glass fiber
Applications: Automotive industry, textile machinery, medical- and precision engineering, aircraft industry.Strong, stiff parts.Chemical and hydrolysis resistance parts, non flammable.High dimension..
CTE, linear 22.0 µm/m-°C
12.2 µin/in-°F
DIN 53752
Lehmann & Voss LUVOCOM® 1105-8402 PEEK, with glass fiber
Applications: Automotive industry, textile machinery, medical- and precision engineering, aircraft industry.Strong, stiff parts.Chemical and hydrolysis resistance parts, non flammable.High dimension..
CTE, linear 22.0 µm/m-°C

@Temperature 20.0 °C
 12.2 µin/in-°F

@Temperature 68.0 °F
Indium Corp. Indalloy® 158 Bi-Pb-Sn-Cd Solder Alloy
Lowest melting point solder. Good fusible alloy used for lens blocking.Information provided by the manufacturer, Indium Corporation.
CTE, linear 22.0 µm/m-°C

@Temperature 23.0 - 60.0 °C
 12.2 µin/in-°F

@Temperature 73.4 - 140 °F
Sumitomo Bakelite Sumikon® PM-9501 Glass-Filled Phenolic, Injection Grade
Sumikon PM-9501 is a two stage glass fiber and mineral filled black phenolic special purpose molding compound. It is especially designed for applications requiring high strength and dimensional s..
CTE, linear 22.0 - 25.0 µm/m-°C
12.2 - 13.9 µin/in-°F
Master Bond EP30ANHT Two Part, Electrically Isolating Epoxy Adhesive
Description: Master Bond Polymer System EP30ANHT is a two part epoxy system with terrific thermal conductivity, while maintaining electrical insulation. One noteworthy property is its wide service t..
CTE, linear 22.0 µm/m-°C

@Temperature 20.0 °C
 12.2 µin/in-°F

@Temperature 68.0 °F
Williams Advanced Alloys WS235 Solder
All Williams alloys are available in a variety of shapes and forms, including ribbon, preforms, rod, ring, wire, and custom shapes.Information provided by Williams Advanced Alloys
CTE, linear 22.0 - 24.0 µm/m-°C
12.2 - 13.3 µin/in-°F
Master Bond EP34AO Epoxy Compound Withstands High Temperatures
Description: Master Bond Polymer System EP34AO is a room temperature curing, two component epoxy compound for high temperature bonding and sealing applications especially where thermal conductivity ..
CTE, linear 22.0 µm/m-°C
12.2 µin/in-°F
Below Tg
Epoxy Technology EPO-TEK® H55 Epoxy
Material Description: A two component, thixotropic and high temperature epoxy designed to be used for hybrids and PCB applications.Information Provided by Epoxy Technology
CTE, linear 22.0 µm/m-°C

@Temperature 20.0 °C
 12.2 µin/in-°F

@Temperature 68.0 °F
AIM 95Sn/3.5Ag/1.5In Solder for Photonic Packaging
Uses include:Fiber to Ferrule SolderingLaser Die AttachHermetic Packaging & SealingWetting & Sealing Laser OpticsThermal ManagementInformation provided by AIM Specialty Materials.
CTE, linear 22.0 µm/m-°C

@Temperature -30.0 - 30.0 °C
 12.2 µin/in-°F

@Temperature -22.0 - 86.0 °F
 ASTM D696
Beijing Chemical Industry KAIFA® 551-GT30S PBT Resin
Glass fiber and mineral filled, flame retardant, low warpage, superior electrical performanceInformation provided by Beijing Chemical Industry Research Institute (Group)
CTE, linear 22.0 µm/m-°C

@Temperature 20.0 °C
 12.2 µin/in-°F

@Temperature 68.0 °F
 ASTM D696
Solvay Specialty Polymers Ixef® 2530/X9027 Polyarylamide, 55% Mineral + Glass Fiber, DAM  (discontinued **)&lt
The IXEF compounds are a family of semi-crystalline polyarylamide thermoplastics reinforced with glass fibers and/or mineral fillers for injection molding.Data provided by the manufacturer, Solvay A..
CTE, linear 22.0 - 71.0 µm/m-°C

@Temperature -30.0 - 30.0 °C
 12.2 - 39.4 µin/in-°F

@Temperature -22.0 - 86.0 °F
 TMA
SABIC Innovative Plastics NORYL PX2935 PPE+PS (Asia Pacific)
PPE/PS, GF20%, non-FR
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