Polymer Property : CTE, linear = 25.0 µm/m-°C Product List

Thermal Properties

Tips: 30 items are displayed at most.

Thermal Properties	Metric	English	Comments
CTE, linear	25.0 µm/m-°C	13.9 µin/in-°F	X; IPC-TM-650.2.4.41
Park Electrochemical Nelco® NX9300 PTFE Laminate, Woven-Glass Reinforced The N9000 PTFE laminate system is designed for critical microwave components, antennas, power amplifiers and subassemblies. Superior mechanical and electrical performance make the N9000 PTFE laminat..
CTE, linear	25.0 µm/m-°C	13.9 µin/in-°F	X; IPC-TM-650.2.4.41
Park Electrochemical Nelco® NY9217 PTFE Laminate, Woven-Glass Reinforced The N9000 PTFE laminate system is designed for critical microwave components, antennas, power amplifiers and subassemblies. Superior mechanical and electrical performance make the N9000 PTFE laminat..
CTE, linear	25.0 µm/m-°C	13.9 µin/in-°F	ASTM D696
Solvay Specialty Polymers Torlon® 4275 Polyamide-imide (PAI)  (Unverified Data**) Torlon 4275 is a wear-resistant grade of polyamide-imide (PAI). This grade offers an excellent balance of mechanical properties and wear resistance. It offers high tensile strength and modulus with ..
CTE, linear	25.0 Âµm/m-Â°C @Temperature 20.0 Â°C	13.9 Âµin/in-Â°F @Temperature 68.0 Â°F	DIN 53752; ASTM D696
Kolon KOPETÂ® KP133G45 FR-PET Resin KOPETÂ® is the FR-PET which realizes the good properties and surface of injection molding with good mold process of short cooling time in low molding temperature.Good mold release, good surface of..
CTE, linear	25.0 Âµm/m-Â°C @Temperature 20.0 Â°C	13.9 Âµin/in-Â°F @Temperature 68.0 Â°F
Indium Corp. IndalloyÂ® 117 Bi-Pb-In-Sn-Cd Fusible Alloy General purpose fusible alloy.Information provided by the manufacturer, Indium Corporation.
CTE, linear	25.0 Âµm/m-Â°C @Temperature 20.0 Â°C	13.9 Âµin/in-Â°F @Temperature 68.0 Â°F
Indium Corp. IndalloyÂ® 164 Pb-In-Ag Solder Alloy This alloy is very useful in the 300Â°C range. It has particularly good thermal fatigue properties as well as the minimal gold leaching properties of indium-lead alloys. Often used in reducing atm..
CTE, linear	25.0 Âµm/m-Â°C @Temperature 20.0 Â°C	13.9 Âµin/in-Â°F @Temperature 68.0 Â°F
Indium Corp. Indalloy 130 Tin-Lead Solder Alloy Inexpensive utility solderInformation Provided by Indium Corporation
CTE, linear	25.0 µm/m-°C @Temperature 20.0 °C	13.9 µin/in-°F @Temperature 68.0 °F
Cosmic Plastics K31 Short Glass Fiber Filled Iso Diallyl Phthalate Molding Compound Data provided by the manufacturer.
CTE, linear	25.0 µm/m-°C	13.9 µin/in-°F	ISO 11359-2
Unitika E-RUNG60 PA66, 60% Glass Fiber Reinforced, Conditioned Information provided by Unitika Ltd.
CTE, linear	25.0 µm/m-°C @Temperature 20.0 °C	13.9 µin/in-°F @Temperature 68.0 °F
Williams Advanced Alloys WS300 Solder All Williams alloys are available in a variety of shapes and forms, including ribbon, preforms, rod, ring, wire, and custom shapes.Information provided by Williams Advanced Alloys
CTE, linear	25.0 µm/m-°C @Temperature -30.0 - 30.0 °C	13.9 µin/in-°F @Temperature -22.0 - 86.0 °F	D696
Zhejiang Juner 301-G30 30% Glass Fibre Reinforced and Flammable Resistant Applications: Electrons and Electricity: TV Components, Plugs of Computers, Exhaust Fans of Computers, Plugs, Sockets, Shells of Electronics, Framework of Level Output Transformers, Pipe Pedestals, ..
CTE, linear	25.0 µm/m-°C @Temperature 20.0 °C	13.9 µin/in-°F @Temperature 68.0 °F	ASTM D696
Toyobo VYLOPET® EMC130-20 Injection Molding Polyester Resin, Flame Resistant Applications: Relay partsFeatures: Excellent arc resistanceFlame resistanceInformation provided by Toyobo.
CTE, linear	25.0 µm/m-°C @Temperature 20.0 °C	13.9 µin/in-°F @Temperature 68.0 °F	Alpha 1
Cosmic Plastics E4930 Mineral & Glass Filled Epoxy Molding Compound, Encapsulated Grade Data provided by the manufacturer.
CTE, linear	25.0 µm/m-°C @Temperature 23.0 - 80.0 °C	13.9 µin/in-°F @Temperature 73.4 - 176 °F	DIN 53752
CP-Polymer-Technik Wellamid® 6000 GVS 10/20 HWUVCP 10% Glass Fiber and 20% Glass Sphere Nylon 6, UV Stabilized, Heat Stabilized, Dry Information provided by CP-Polymer-Technik GmbH & Co. KG
CTE, linear	25.0 µm/m-°C @Temperature 23.0 - 80.0 °C	13.9 µin/in-°F @Temperature 73.4 - 176 °F	DIN 53752
CP-Polymer-Technik Wellamid® 6000 MRGV 25/15 HWCP 25% Mineral and 15% Glass Fiber Nylon 6, Heat Stabilized, Dry Information provided by CP-Polymer-Technik GmbH & Co. KG
CTE, linear	25.0 µm/m-°C @Temperature 23.0 - 80.0 °C	13.9 µin/in-°F @Temperature 73.4 - 176 °F	DIN 53752
CP-Polymer-Technik Wellamid® 6600 GVS 20/10 HWCP 20% Glass Fiber and 10% Glass Sphere Nylon 66, Heat Stabilized, Dry Information provided by CP-Polymer-Technik GmbH & Co. KG
CTE, linear	25.0 µm/m-°C	13.9 µin/in-°F
Epoxyset Epoxibond EB-315 Low Expansion Epoxy Adhesive EB-315 is a highly filled, heat curing, high temperature resistant epoxy adhesive. Due to its low coefficient of thermal expansion and outgassing, it can be used for bonding and sealing in critical ..
CTE, linear	25.0 µm/m-°C @Temperature 20.0 °C	13.9 µin/in-°F @Temperature 68.0 °F
AIM 47 Fusible Bismuth Alloy Uses: low-temperature solder; fixturing delicate parts for machining; lens blocking; proof casting of cavities; dental models; fusible element in safety devices and alarms; radiation blocking for x-..
CTE, linear	25.0 µm/m-°C @Temperature 20.0 °C	13.9 µin/in-°F @Temperature 68.0 °F
AIM 54Sn/26Pb/20In Solder for Photonic Packaging Uses include:Fiber to Ferrule SolderingLaser Die AttachHermetic Packaging & SealingWetting & Sealing Laser OpticsThermal ManagementInformation provided by AIM Specialty Materials.
CTE, linear	25.0 µm/m-°C @Temperature -30.0 - 30.0 °C	13.9 µin/in-°F @Temperature -22.0 - 86.0 °F	ASTM D696
Beijing Chemical Industry KAIFA® 201-G30 PBT Resin 30% glass fiber reinforcedInformation provided by Beijing Chemical Industry Research Institute (Group)
CTE, linear	25.0 µm/m-°C @Temperature 20.0 °C	13.9 µin/in-°F @Temperature 68.0 °F	ASTM D696
LATI LASULF G/30 30% Glass Reinforced Polysulfone (PSU)  (Unverified Data**) Description: Lasulf products are composed of polysulfone (PSU). They feature good thermal and mechanical properties such as excellent toughness, even at low temperatures, excellent dimensional stabi..
CTE, linear	25.0 µm/m-°C @Temperature 20.0 °C	13.9 µin/in-°F @Temperature 68.0 °F	ASTM D696
LATI LARTON G/50 50% Glass Fiber Filled Polyphenylene sulfide (PPS)  (discontinued **) Description: Larton thermoplastics are polyphenylene sulfide (PPS) products. They are distinguished by a group of very interesting properties combined with easy moldability. Larton parts feature: ex..
CTE, linear	25.0 µm/m-°C	13.9 µin/in-°F	GB1036
Beijing Evergrow Resources Glass Filled Nylon Information provided by Beijing Evergrow Resources.
CTE, linear	25.0 - 46.0 µm/m-°C	13.9 - 25.6 µin/in-°F	Average value: 34.3 µm/m-°C Grade Count:12
Overview of materials for Diallyl Phthalate (DAP), Cast, Mineral Filler This property data is a summary of similar materials in the MatWeb database for the category "Diallyl Phthalate (DAP), Cast, Mineral Filler". Each property range of values reported is minimum and ma..
CTE, linear	25.0 µm/m-°C	13.9 µin/in-°F	DIN 53752
Lehmann & Voss LUVOCOM® 1-7003 Polyamide 66, with carbon fiber and PTFE, heat stabilized Applications: Automotive industry, textile- and office machinery, apparatus- and precision engineering.High-strength and high-stiff parts; low coefficient of expansion.Electrically conductive, suita..