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Polymer Property : CTE, linear = 27.8 µin/in-°F Product List
Thermal PropertiesTips: 30 items are displayed at most.
| Thermal Properties | Metric | English | Comments |
|---|---|---|---|
| CTE, linear | 50.0 - 70.0 µm/m-°C | 27.8 - 38.9 µin/in-°F | Polykemi |
|
Polykemi AB POLYfill PP CIM9040 Polypropylene, Mineral Reinforced
Information provided by Polykemi AB
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| CTE, linear |
50.0
µm/m-°C @Temperature 20.0 °C |
27.8
µin/in-°F @Temperature 68.0 °F |
|
|
North Wood Plastics Polypropylene with 40% Wood Fiber, Extrusion Grade
Data provided by North Wood Plastics, Inc.
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| CTE, linear |
50.0
µm/m-°C @Temperature 20.0 °C |
27.8
µin/in-°F @Temperature 68.0 °F |
ASTM D696 |
|
Covestro Makrolon® SF-800 Polycarbonate, Structural Foam
(discontinued **)
Properties based on foam density of 0.90 g/cc.Information provided by Bayer Corporation, Plastics DivisionAs of 1 September 2015, Bayer MaterialScience was separated from Bayer AG and has officially..
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| CTE, linear |
50.0
-
171
µm/m-°C @Temperature 25.6 - 300 °C |
27.8
-
95.0
µin/in-°F @Temperature 78.0 - 572 °F |
Average value: 110 µm/m-°C Grade Count:11 |
|
Overview of materials for Polytetrafluoroethylene (PTFE), Glass Filled, Molded
This property data is a summary of similar materials in the MatWeb database for the category "Polytetrafluoroethylene (PTFE), Glass Filled, Molded". Each property range of values reported is minimum..
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| CTE, linear |
50.0
µm/m-°C @Temperature 20.0 °C |
27.8
µin/in-°F @Temperature 68.0 °F |
|
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Hybrid Plastics POSS® EP 1000 Epoxy Adhesive
EP1000 is a POSS® based epoxy adhesive with outstanding oxidative resistance to ozone, plasma, or atomic oxygen environments. The EP1000 POSS® Epoxy is also well-suited for peroxide and steam...
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| CTE, linear | 50.0 µm/m-°C | 27.8 µin/in-°F | ASTM D696 |
|
Gromax PBT 4115-104D 15% Glass Fiber Filled
Product Description: A glass fiber 15% reinforced injection molding grade. Characteristics:Excellent electrical property Excellent temperature resistance, high heat distortion temperature Excellent ..
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| CTE, linear | 50.0 µm/m-°C | 27.8 µin/in-°F | DIN 53752 |
|
Lehmann & Voss LUVOCOM® 1105/WT106 PEEK, unreinforced
Applications: Automotive industry, textile machinery, medical- and precision engineering, aircraft industry.Especially suitable for medical parts, superheated steam sterilizable, hydrolysis resistan..
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| CTE, linear | 50.0 - 70.0 µm/m-°C | 27.8 - 38.9 µin/in-°F | ASTM D696 |
|
Samyang Trirex® 3027PU(X) Polycarbonate
PC is characterized by its excellent impact resistance, dimensional stability and excellent thermal resistance.3027PU(X) is an extrusion grade.Information provided by Samyang.
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| CTE, linear | 50.0 - 70.0 µm/m-°C | 27.8 - 38.9 µin/in-°F | ASTM D696 |
|
Samyang Trirex® 3017IR Polycarbonate with Heat Stabilizer
PC is characterized by its excellent impact resistance, dimensional stability and excellent thermal resistance.3017IR is a super high flow grade with added heat stabilizers, separating materials and..
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| CTE, linear | 50.0 - 55.0 µm/m-°C | 27.8 - 30.6 µin/in-°F | |
|
Master Bond EP21LV-LO Two Component, Lower Viscosity, Room Temperature Curing Epoxy System
Product Description: Master Bond EP21LV-LO is a two component, lower viscosity, room temperature curing epoxy system for high performance bonding, sealing, coating and encapsulation. This user frien..
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| CTE, linear | 50.0 - 55.0 µm/m-°C | 27.8 - 30.6 µin/in-°F | |
|
Master Bond EP21LVMed Two Component, Low Viscosity USP Class VI Epoxy
Master Bond EP21LVMed is a two component, low viscosity epoxy resin system for high performance bonding, sealing, coating, encapsulating and casting. It is formulated to cure readily at room tempera..
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| CTE, linear | 50.0 - 55.0 µm/m-°C | 27.8 - 30.6 µin/in-°F | |
|
Master Bond EP21NDFG Two component epoxy compound for high performance applications
Product Description: Master Bond EP21NDFG is a two component, room temperature curing epoxy adhesive featuring outstanding physical properties, easy processing and a non-drip, paste-like consistency..
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| CTE, linear |
50.0
µm/m-°C @Temperature 40.0 - 130 °C |
27.8
µin/in-°F @Temperature 104 - 266 °F |
TMA; ASTM E831 |
|
Plenco 4485 Phenolic, Granular, Injection Molded
PLENCO 04485 is a mineral filled phenolic molding compound offering excellent heat resistance, electrical resistance, and dimensional stability. UL recognized under component file E40654. 04485 is a..
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| CTE, linear |
50.0
µm/m-°C @Temperature 20.0 °C |
27.8
µin/in-°F @Temperature 68.0 °F |
|
|
Tra-Con Tra-Bond 2248 High Temperature Epoxy Staking Adhesive
TRA-BOND 2248 is a thixotropic, high temperature cure, 100% solids epoxy resin system that provides strong, tough bonds between a wide range of materials (includes metals, glass, ceramics, and many ..
|
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| CTE, linear |
<=
50.0
µm/m-°C @Temperature 20.0 °C |
<=
27.8
µin/in-°F @Temperature 68.0 °F |
|
|
Loctite® 3445 1 component fusible solder filler Anisotropic Epoxy Adhesive
Electrically Conductive Bonding and Encapsulants and UnderfillsLoctite® Electrically Conductive Adhesives are used in a variety of applications where electrical connectivity is needed, providing a ..
|
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| CTE, linear |
50.0
µm/m-°C @Temperature 23.0 - 80.0 °C |
27.8
µin/in-°F @Temperature 73.4 - 176 °F |
DIN 53752 |
|
CP-Polymer-Technik Wellamid® 6600 GS 30 HWCP 30% Glass Sphere Filled Nylon 66, Heat Stabilized, Dry
Information provided by CP-Polymer-Technik GmbH & Co. KG
|
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| CTE, linear |
50.0
µm/m-°C @Temperature 23.0 - 260 °C |
27.8
µin/in-°F @Temperature 73.4 - 500 °F |
ASTM D696 |
|
Daelim H&L Plavis-N DF Unfilled Aromatic Polyimide Bearing
Direct Formed. Plavis-N: Best physical properties, maximum electrical and thermal insulation, low out-gassing, superior radiation resistance.General Plavis information for all grades:PLAVIS polyimi..
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| CTE, linear |
50.0
-
90.0
µm/m-°C @Temperature 23.0 - 60.0 °C |
27.8
-
50.0
µin/in-°F @Temperature 73.4 - 140 °F |
ASTM D696 |
|
Daikin NEOFLON RP-5000 EFEP Pellets
NEOFLON EFEP is an ETFE based fluoropolymer combining the excellent physical properties derived from ETFE together with a low processing temperature that is more compatible with conventional thermop..
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| CTE, linear | >= 50.0 µm/m-°C | >= 27.8 µin/in-°F | |
|
Epoxyset Epoxibond EB-119M Unfilled Epoxy Adhesive
A two-component,unfilled, low viscosity, high temperature epoxy adhesive used for bonding and small potting applications in the medical, electronics, and aerospace industries.Information provided by..
|
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| CTE, linear |
50.0
µm/m-°C @Temperature 23.0 - 80.0 °C |
27.8
µin/in-°F @Temperature 73.4 - 176 °F |
DIN 53752 |
|
CP-Polymer-Technik Wellamid® 6000 GS 30 HWCP 30% Glass Sphere Filled Nylon 6, Heat Stabilized, Dry
Information provided by CP-Polymer-Technik GmbH & Co. KG
|
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| CTE, linear |
50.0
-
55.0
µm/m-°C @Temperature 20.0 °C |
27.8
-
30.6
µin/in-°F @Temperature 68.0 °F |
|
|
Abatron AboCast/AboCure 8109-13
Liquid hardener version of AboCast/AboCure 8109-11.Processing: 100/23 pbw; Potlife: 3-5 h/20°C (68°F), 1-3 h/40°C (105°F), 0.5-1 h/60°C (140°F); mix at RT; cures in: 30 mins/60°C (140°F), 45..
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| CTE, linear |
50.0
µm/m-°C @Temperature 20.0 °C |
27.8
µin/in-°F @Temperature 68.0 °F |
ISO 11359 |
|
Teijin Panlite® G-3410H Low Anisotropy, Glass Fiber Reinforced Polycarbonate Resin
Reinforced with 10 % of special GF and improved appearance grade, meeting UL 94 V-2.Applications:Mechanical, electric and electronic components that need good appearance and mechanical propertyPreci..
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| CTE, linear | 50.0 µm/m-°C | 27.8 µin/in-°F | |
|
Resinlab® EP1199 Black Unfilled Epoxy Adhesive
Resinlab™ EP1199 Black is a two part unfilled epoxy adhesive designed for bonding of metals, ceramics and most plastics. This product gives good resistance to water, salt spray, inorganic acids and..
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