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Polymer Property : CTE, linear = 30.6 µin/in-°F Product List
Thermal PropertiesTips: 30 items are displayed at most.
| Thermal Properties | Metric | English | Comments |
|---|---|---|---|
| CTE, linear |
55.0
µm/m-°C <br>@Temperature 23.0 - 100 °C
|
30.6
µin/in-°F <br>@Temperature 73.4 - 212 °F
|
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Quadrant EPP Ketron® TX PEEK + solid lubricant, extruded (ISO Data)
This member of the Ketron PEEK family has been developed especially for the food industry. Like Ketron PEEK-1000, this new internally lubricated material has a food contact compliant composition, bu..
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| CTE, linear |
55.0
µm/m-°C <br>@Temperature 20.0 °C
|
30.6
µin/in-°F <br>@Temperature 68.0 °F
|
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Humiseal 1B31 Acrylic Conformal Coating
Humiseal 1B31 Acrylic Conformal CoatingHigh moisture resistanceExcellent dielectrical propertiesSelective chemical resistanceExcellent repairabilityMIL-I-46058C ApprovedPasses thermal shock test (MI..
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| CTE, linear |
55.0
µm/m-°C <br>@Temperature 20.0 °C
|
30.6
µin/in-°F <br>@Temperature 68.0 °F
|
|
|
Humiseal 1B31LSE Acrylic Conformal Coating
Humiseal 1B31LSE Acrylic Conformal CoatingHigh moisture resistanceExcellent dielectrical propertiesSelective chemical resistanceExcellent repairabilityMIL-I-46058C Approval PendingPasses thermal sho..
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| CTE, linear | 55.0 µm/m-°C | 30.6 µin/in-°F | DIN 53752 |
|
Lehmann & Voss LUVOCOM® 1502-7867/BL4 PPSU, unreinforced
Applications: Automotive industry, medical- and precision engineering, aircraft industry.Especially suitable for medical parts, superheated steam sterilizable, hydrolysis resistanceHigh chemical res..
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| CTE, linear |
55.0
µm/m-°C <br>@Temperature 20.0 °C
|
30.6
µin/in-°F <br>@Temperature 68.0 °F
|
Vertical Direction; ASTM D696 |
|
Mitsui Arlenâ„¢ A315 15% Glass Fiber-Reinforced Modified Nylon 6T (COND)
ARLEN™ is a heat resistant, modified polyamide 6T developed by Mitsui Chemicals, Inc. With a high melting point (320°C) and a rigidity level comparable to super engineering plastics, it poss..
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| CTE, linear |
55.0
µm/m-°C <br>@Temperature 20.0 °C
|
30.6
µin/in-°F <br>@Temperature 68.0 °F
|
Vertical Direction; ASTM D696 |
|
Mitsui Arlenâ„¢ C215 15% Glass Fiber-Reinforced Modified Nylon 6T (COND)
ARLEN™ is a heat resistant, modified polyamide 6T developed by Mitsui Chemicals, Inc. With a high melting point (320°C) and a rigidity level comparable to super engineering plastics, it poss..
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| CTE, linear | 55.0 µm/m-°C | 30.6 µin/in-°F | DIN 53752 |
|
Lehmann & Voss LUVOCOM® 1502-7865/BK2 PPSU, unreinforced
Applications: Automotive industry, medical- and precision engineering, aircraft industry.Especially suitable for medical parts, superheated steam sterilizable, hydrolysis resistanceHigh chemical res..
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| CTE, linear | 55.0 - 60.0 µm/m-°C | 30.6 - 33.3 µin/in-°F | |
|
Master Bond UV15LV One Component, UV Curable Epoxy Based System
Product Description: Master Bond UV15LV is a high strength, low viscosity, epoxy based UV curable system for bonding, sealing and coating. It has low viscosity and it is widely used in a variety of ..
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| CTE, linear |
55.1
µm/m-°C <br>@Temperature 20.0 °C
|
30.6
µin/in-°F <br>@Temperature 68.0 °F
|
|
|
Westlake Plastics Imidex Thermoplastic Polyimide
Made from Aurum® resin. Applications include electronics, acoustics, composites, wire/cable insulation, adhesive film, and washers/gaskets. It will not melt unto itself, is thermoformable, has hi..
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| CTE, linear | 55.0 µm/m-°C | 30.6 µin/in-°F | Absolute Drying; ASTM-D696 |
|
Toyobo GLAMIDE® TY-145TZ Nylon-6
GLAMIDE® is very tough and exhibits high abrasion resistance. It has a high melting point and heat resistance, has well-balanced proportions of mechanical properties, performs self-distinguishing a..
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| CTE, linear |
55.0
µm/m-°C <br>@Temperature 20.0 °C
|
30.6
µin/in-°F <br>@Temperature 68.0 °F
|
|
|
Tra-Con Tra-Bond 2111 Rigid Epoxy Staking Compound
TRA-BOND 2111 is a thixotropic epoxy resin and hardener formulation developed for industrial adhesive, staking, laminating, repair and manufacturing applications where long pot-life, good wetting, n..
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| CTE, linear |
55.0
µm/m-°C <br>@Temperature 20.0 °C
|
30.6
µin/in-°F <br>@Temperature 68.0 °F
|
|
|
Tra-Con Tra-Bond 2112 Rigid Epoxy Staking Compound
TRA-BOND 2112 is a thixotropic epoxy system recommended for critical electronic, aerospace and industrial bonding, laminating and reinforcing applications requiring an adhesive with high-fill, non-s..
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| CTE, linear |
55.0
µm/m-°C <br>@Temperature 20.0 °C
|
30.6
µin/in-°F <br>@Temperature 68.0 °F
|
|
|
Tra-Con Tra-Bond CA20 Coil-Fix Epoxy Adhesive
TRA-BOND CA-20 is a thixotropic epoxy adhesive system specially formulated for shorted turns, damaged end wire extensions, or other coil repair applications where a high-fill, non-sag adhesive is re..
|
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| CTE, linear |
55.0
µm/m-°C <br>@Temperature 20.0 °C
|
30.6
µin/in-°F <br>@Temperature 68.0 °F
|
|
|
Tra-Con Tra-Bond F113 High Impact Optically Clear Epoxy Adhesive
TRA-BOND F113 is an optically clear, low viscosity, high impact epoxy adhesive developed for bonding and small volume potting of plastic or glass optical fibers, lenses, and prisms, LED displays, an..
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| CTE, linear |
55.0
µm/m-°C <br>@Temperature 20.0 °C
|
30.6
µin/in-°F <br>@Temperature 68.0 °F
|
|
|
Tra-Con Tra-Bond 2101 General Purpose Epoxy Adhesive
TRA-BOND 2101 is a medium viscosity epoxy formulation recommended for laminating, bonding, repair and other adhesive applications where the combination of its superior structural, mechanical and ele..
|
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| CTE, linear |
55.0
µm/m-°C <br>@Temperature 20.0 °C
|
30.6
µin/in-°F <br>@Temperature 68.0 °F
|
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Tra-Con Tra-Bond 2105 Clear Rigid, Medium Viscosity Epoxy Adhesive
TRA-BOND 2105 is a clear, medium viscosity epoxy adhesive which contains no solvents or other additives which can be harmful to the environment or to its users. It has excellent adhesion to glass, c..
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| CTE, linear |
55.0
µm/m-°C <br>@Temperature 23.0 - 80.0 °C
|
30.6
µin/in-°F <br>@Temperature 73.4 - 176 °F
|
DIN 53752 |
|
CP-Polymer-Technik Wellamid® 6000 MR 409 HWCP Mineral Nylon 6, Heat Stabilized, Dry
Information provided by CP-Polymer-Technik GmbH & Co. KG
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| CTE, linear | 55.0 µm/m-°C | 30.6 µin/in-°F | ASTM E831 |
|
Addiplast Addinyl A2 ZP40 Nylon 66, 40% Mineral Filled
Mineral filled, increased thermal aging stabilityInformation provided by Addiplast.
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| CTE, linear |
55.0
µm/m-°C <br>@Temperature 20.0 °C
|
30.6
µin/in-°F <br>@Temperature 68.0 °F
|
|
|
Armstrong A-2/A Epoxy Adhesive
This off-white paste epoxy is a versatile adhesive systems. The choice of one of four recommended Activators (A, E, W or H-20) makes A-2 Adhesive an ideal choice for many applications. A-2 with Ac..
|
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| CTE, linear |
55.0
µm/m-°C <br>@Temperature 20.0 °C
|
30.6
µin/in-°F <br>@Temperature 68.0 °F
|
|
|
Armstrong A-2/E Epoxy Adhesive
This off-white paste epoxy is a versatile adhesive systems. The choice of one of four recommended Activators (A, E, W or H-20) makes A-2 Adhesive an ideal choice for many applications. A-2 with Ac..
|
|||
| CTE, linear |
55.0
µm/m-°C <br>@Temperature 20.0 °C
|
30.6
µin/in-°F <br>@Temperature 68.0 °F
|
|
|
Armstrong A-271 Epoxy Adhesive
A clear amber adhesive system. A-271 is a medium viscosity liquid with excellent wetting ability. It is ideal for bonding glass or similar smooth surfaces. It features very low shrinkage coupled ..
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| CTE, linear | 55.1 µm/m-°C | 30.6 µin/in-°F | |
|
Atom Adhesives AA-BOND 2104 Epoxy Adhesive
AA-BOND 2104 is a thixotropic epoxy system recommended for critical electronics, aerospace and industrial bonding, laminating and reinforcing applications requiring an adhesive with high-fill, non-s..
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| CTE, linear | 55.1 µm/m-°C | 30.6 µin/in-°F | |
|
Atom Adhesives AA-BOND 2116 Epoxy Adhesive
AA-BOND 2116 is a thixotropic, low vapor pressure epoxy system that passes the NASA Outgassing Specification. It is recommended for critical electronics, aerospace, and industrial applications where..
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| CTE, linear | 55.0 - 65.0 µm/m-°C | 30.6 - 36.1 µin/in-°F | Polykemi |
|
Polykemi AB POLYfill PPH BF405510 VT1 Polypropylene Homopolymer, Reinforced, Heat Resistant
Information provided by Polykemi AB
|
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| CTE, linear |
55.0
µm/m-°C <br>@Temperature -30.0 - 80.0 °C
|
30.6
µin/in-°F <br>@Temperature -22.0 - 176 °F
|
ASTM E228 |
|
Solvay Engineered Polymers DEXFLEX® 930 TPO
(discontinued **)
Description: DEXFLEX® 930 is a thermoplastic olefinic elastomer (TPO) designed for large automotive exterior applications that require high flow for excellent processability, ductile impact propert..
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| CTE, linear |
55.0
µm/m-°C <br>@Temperature 20.0 °C
|
30.6
µin/in-°F <br>@Temperature 68.0 °F
|
Vertical Direction; ASTM D696 |
|
Mitsui Arlen™ C215 15% Glass Fiber-Reinforced Modified Nylon 6T (DAM)
ARLEN™ is a heat resistant, modified polyamide 6T developed by Mitsui Chemicals, Inc. With a high melting point (320°C) and a rigidity level comparable to super engineering plastics, it possesses ..
|
|||
| CTE, linear |
55.0
-
65.0
µm/m-°C <br>@Temperature 20.0 °C
|
30.6
-
36.1
µin/in-°F <br>@Temperature 68.0 °F
|
|
|
Abatron AboCast/AboCure 8109-7
Processing: 100/80 pbw; Potlife: 6-7 days/20°C (68°F), 12-24 h/40°C (105°F), 0.75-7 h /60°C (140°F); mix at 50-80°C (120-175°F); cures in: 1 h/100°C (212°F) + 4 h/150°C (300°F) postcure...
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| CTE, linear | 55.0 µm/m-°C | 30.6 µin/in-°F | ASTM E831 |
|
Addiplast Addinyl PMD 20170 Nylon 66
GalvanizingInformation provided by Addiplast.
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| CTE, linear | 55.0 µm/m-°C | 30.6 µin/in-°F | |
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Resinlab® EP1056LC Urethane Modified Epoxy Adhesive
Resinlab™ EP1056LC is a two part urethane modified epoxy adhesive designed to give good adhesion to metals and hard to bond surfaces such as PVC. It is thixotropic to provide good gap filling abili..
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| CTE, linear |
55.0
-
75.0
µm/m-°C <br>@Temperature -30.0 - 30.0 °C
|
30.6
-
41.7
µin/in-°F <br>@Temperature -22.0 - 86.0 °F
|
TMA |
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SABIC Innovative Plastics NORYL EX130 PPE+HIPS (Asia Pacific)
PPE+PS Auto Exterior Grade
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