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Polymer Property : CTE, linear = 50.0 µm/m-°C Product List
Thermal PropertiesTips: 30 items are displayed at most.
| Thermal Properties | Metric | English | Comments |
|---|---|---|---|
| CTE, linear |
50.0
µm/m-°C @Temperature 23.0 - 60.0 °C |
27.8
µin/in-°F @Temperature 73.4 - 140 °F |
dry sample |
|
Omnia Plastica Rilsan® PA6 GF - Akulon GF - at 50% RH
Polyamide 6 reinforced with the addition of 30% glass fibre and graphite. The glass charge makes the material highly resistant to abrasion, compression and flexing. Akulon GF is particularly suitabl..
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| CTE, linear |
50.0
µm/m-°C @Temperature 20.0 °C |
27.8
µin/in-°F @Temperature 68.0 °F |
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North Wood Plastics PS with 20% Wood Fiber
Data provided by North Wood Plastics, Inc.
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| CTE, linear |
50.0
-
60.0
µm/m-°C @Temperature 50.0 - 100 °C |
27.8
-
33.3
µin/in-°F @Temperature 122 - 212 °F |
ISO 11359-2 |
|
Raschig Group 6552 DAIP
Glass-fiber reinforced diallyl isophthalate molding compound. Good mechanical strength together with retention of high electrical isolation properties under hot humid conditions, exceptional dimensi..
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| CTE, linear |
50.0
-
70.0
µm/m-°C @Temperature 20.0 °C |
27.8
-
38.9
µin/in-°F @Temperature 68.0 °F |
ASTM D696 |
|
Kolon Kocetal® WH702 Reinforced Grade Acetal Copolymer
(discontinued **)
Thermal properties: Kocetal has excellent heat stability; heat degradation is little under long term and high temperature application, compared to other POM. Maximum applicable temperature of produ..
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| CTE, linear | 50.0 - 70.2 µm/m-°C | 27.8 - 39.0 µin/in-°F | Average value: 65.5 µm/m-°C Grade Count:29 |
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Overview of materials for Polycarbonate, Extruded
This property data is a summary of similar materials in the MatWeb database for the category "Polycarbonate, Extruded". Each property range of values reported is minimum and maximum values of approp..
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| CTE, linear | 50.0 µm/m-°C | 27.8 µin/in-°F | DIN 53752 |
|
Lehmann & Voss LUVOCOM® 1700-1401 PPO, with carbon fiber and glass fiber
Applications: Automotive industry, textile- and office machinery, apparatus- and precision engineering.Strong, stiff parts; low thermal coefficient of expansion.Electrically conductive, suitable for..
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| CTE, linear |
50.0
µm/m-°C @Temperature -30.0 - 100 °C |
27.8
µin/in-°F @Temperature -22.0 - 212 °F |
ASTM D696 |
|
LyondellBasell Hifaxâ„¢ BB222GC Thermoplastic Olefin Resin
Key Features: medium melt flow, very high modulus, UV-stabilized thermoplastic elastomeric olefin resin, excellent impact and stiffness balance, excellent weatherability, high stiffness, good dimens..
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| CTE, linear | 50.0 - 70.0 µm/m-°C | 27.8 - 38.9 µin/in-°F | ASTM D696 |
|
Samyang Trirex® 3025PJ Polycarbonate
PC is characterized by its excellent impact resistance, dimensional stability and excellent thermal resistance.3025PJ is a general use grade.Information provided by Samyang.
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| CTE, linear | 50.0 - 55.0 µm/m-°C | 27.8 - 30.6 µin/in-°F | |
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Master Bond EP21LV-LO Two Component, Lower Viscosity, Room Temperature Curing Epoxy System
Product Description: Master Bond EP21LV-LO is a two component, lower viscosity, room temperature curing epoxy system for high performance bonding, sealing, coating and encapsulation. This user frien..
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| CTE, linear |
50.0
-
90.0
µm/m-°C @Temperature 20.0 °C |
27.8
-
50.0
µin/in-°F @Temperature 68.0 °F |
ASTM D696 |
|
Zeus EFEP Tubing |
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| CTE, linear |
50.0
-
90.0
µm/m-°C @Temperature 20.0 °C |
27.8
-
50.0
µin/in-°F @Temperature 68.0 °F |
ASTM D696 |
|
Zeus ETFE Tubing
ETFE (Ethylenetetrafluoroethylene), a copolymer of ethylene and tetrafluoroethylene, is used in applications requiring excellent impact, abrasion and stress cracking resistance. This polymer possess..
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| CTE, linear |
50.0
µm/m-°C @Temperature 23.0 - 80.0 °C |
27.8
µin/in-°F @Temperature 73.4 - 176 °F |
DIN 53752 |
|
CP-Polymer-Technik Wellamid® 6600 GS 30 HWCP 30% Glass Sphere Filled Nylon 66, Heat Stabilized, Dry
Information provided by CP-Polymer-Technik GmbH & Co. KG
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| CTE, linear |
50.0
µm/m-°C @Temperature 23.0 - 80.0 °C |
27.8
µin/in-°F @Temperature 73.4 - 176 °F |
DIN 53752 |
|
CP-Polymer-Technik Wellamid® 6600 GV 5 HWCP 5% Glass Fiber Nylon 66, Heat Stabilized, Dry
Information provided by CP-Polymer-Technik GmbH & Co. KG
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| CTE, linear |
50.0
µm/m-°C @Temperature 23.0 - 260 °C |
27.8
µin/in-°F @Temperature 73.4 - 500 °F |
ASTM D696 |
|
Daelim H&L Plavis-MS DF MoS2 Filled Aromatic Polyimide Bearing
Direct Formed. Plavis-MS: MoS2 15 wt% filled, Self lubricating grade for vacuum environments.General Plavis information for all grades:PLAVIS polyimide has nitrogen bonded to 3 carbons is the criti..
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| CTE, linear |
50.0
-
90.0
µm/m-°C @Temperature 23.0 - 60.0 °C |
27.8
-
50.0
µin/in-°F @Temperature 73.4 - 140 °F |
ASTM D696 |
|
Daikin NEOFLON EP-610 ETFE Pellets
Due to its excellent melt flow properties, NEOFLON ETFE can be processed in the same was as other thermoplastic resins. NEOFLON ETFE is also highly suited to such secondary processes as welding, fl..
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| CTE, linear | >= 50.0 µm/m-°C | >= 27.8 µin/in-°F | |
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Epoxyset Epoxibond EB-103F Unfilled Epoxy Adhesive
A two-component, unfilled, fast setting epoxy adhesive used for bonding and small potting applications in the medical, electronics, and aerospace industries. EB-103F has excellent bond strength to v..
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| CTE, linear | >= 50.0 µm/m-°C | >= 27.8 µin/in-°F | |
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Epoxyset Epoxibond EB-107LP-1 Unfilled Epoxy Adhesive
A two-component, unfilled epoxy adhesive used for bonding and small potting applications in the medical, electronics, and aerospace industries.Information provided by Epoxyset Inc.
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| CTE, linear | >= 50.0 µm/m-°C | >= 27.8 µin/in-°F | |
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Epoxyset Epoxibond EB-119M Unfilled Epoxy Adhesive
A two-component,unfilled, low viscosity, high temperature epoxy adhesive used for bonding and small potting applications in the medical, electronics, and aerospace industries.Information provided by..
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| CTE, linear | >= 50.0 µm/m-°C | >= 27.8 µin/in-°F | |
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Epoxyset Epoxibond EB-130M-1 Unfilled Epoxy Adhesive
A two-component, non-hazmat, unfilled epoxy adhesive used for bonding and small potting applications in the medical, electronics, and aerospace industries.Information provided by Epoxyset Inc.
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| CTE, linear |
50.0
µm/m-°C @Temperature 20.0 °C |
27.8
µin/in-°F @Temperature 68.0 °F |
ASTM D696 |
|
E-Polymers TEKAMID® TB120G15 , 15% Glass Fiber Reinforced PA6, DAM
15% Glass Fiber reinforced, Good surface Information provided by E-Polymers Co. Ltd.
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| CTE, linear | 50.0 µm/m-°C | 27.8 µin/in-°F | |
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Resinlab® EP1199 Black Unfilled Epoxy Adhesive
Resinlab™ EP1199 Black is a two part unfilled epoxy adhesive designed for bonding of metals, ceramics and most plastics. This product gives good resistance to water, salt spray, inorganic acids and..
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| CTE, linear |
>=
50.0
µm/m-°C @Temperature 20.0 °C |
>=
27.8
µin/in-°F @Temperature 68.0 °F |
|
|
Loctite® 3888 Room Temperature Cure Isotropic Epoxy Adhesive
Electrically Conductive BondersLoctite® Electrically Conductive Adhesives are used in a variety of applications where electrical connectivity is needed, providing a conductive path where traditiona..
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| CTE, linear |
50.0
µm/m-°C @Temperature 20.0 - 100 °C |
27.8
µin/in-°F @Temperature 68.0 - 212 °F |
|
|
Isoflon PCTFE Polychlorotrifluoroethylene
Fluoropolymer material specifications.Information provided by Isoflon.
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| CTE, linear | 50.0 µm/m-°C | 27.8 µin/in-°F | |
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Resinlab® EP1282 Black Unfilled Electronic Grade Epoxy Encapsulant
Resinlab™ EP1282 Black is a two part unfilled electronic grade epoxy encapsulant designed for medium sized castings. It is recognized under the Component Recognition Program of Underwriters Laborat..
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