Thermal Properties | Metric | English | Comments |
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CTE, linear | 53.0 - 53.0 µm/m-°C @Temperature 40.0 - 130 °C |
29.4 - 29.4 µin/in-°F @Temperature 104 - 266 °F |
Average value: 53.0 µm/m-°C Grade Count:1 |
Overview of materials for Phenolic, Resole, Mineral Filled This property data is a summary of similar materials in the MatWeb database for the category "Phenolic, Resole, Mineral Filled". Each property range of values reported is minimum and maximum values .. |
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CTE, linear | 53.0 µm/m-°C @Temperature 40.0 - 130 °C |
29.4 µin/in-°F @Temperature 104 - 266 °F |
TMA; ASTM E831 |
Plenco 00732 Melamine-Phenolic, Granular, Transfer Molded PLENCO 00732 is a melamine-phenolic copolymer molding compound, exhibiting excellent electrical and flame resistant properties. Type ASTM 5948 CMG, and UL recognized under component file E40654. 007.. |
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CTE, linear | 53.0 µm/m-°C @Temperature 40.0 - 130 °C |
29.4 µin/in-°F @Temperature 104 - 266 °F |
TMA; ASTM E831 |
Plenco 1508 Polyester, Briquette, Transfer Molded PLENCO 01508 is a mineral filled pelletized polyester molding compound, which offers excellent heat resistance and electrical properties. UL recognized under component file E40654. 01508 is availabl.. |
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CTE, linear | 53.0 µm/m-°C @Temperature 40.0 - 130 °C |
29.4 µin/in-°F @Temperature 104 - 266 °F |
TMA; ASTM E831 |
Plenco 4327 Phenolic, Granular, Compression Molded PLENCO 04327 is a heat resistant mineral filled phenolic molding compound offering excellent cosmetic characteristics and improved heat resistant properties. PLENCO 04327 is not intended for electri.. |
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CTE, linear | 53.0 µm/m-°C @Temperature 40.0 - 130 °C |
29.4 µin/in-°F @Temperature 104 - 266 °F |
TMA; ASTM E831 |
Plenco 4485 Phenolic, Granular, Compression Molded PLENCO 04485 is a mineral filled phenolic molding compound offering excellent heat resistance, electrical resistance, and dimensional stability. UL recognized under component file E40654. 04485 is a.. |
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CTE, linear | 53.0 µm/m-°C @Temperature 40.0 - 130 °C |
29.4 µin/in-°F @Temperature 104 - 266 °F |
TMA; ASTM E831 |
Plenco 6582 Phenolic, Briquette, Injection Molded PLENCO 06582 is a rubber modified phenolic molding compound, offering excellent heat resistant properties, along with improved mechanical strength at elevated temperatures. UL recognized under compo.. |
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CTE, linear | 53.0 µm/m-°C @Temperature 40.0 - 130 °C |
29.4 µin/in-°F @Temperature 104 - 266 °F |
TMA; ASTM E831 |
Plenco 7200 Phenolic, Granular, Injection Molded PLENCO 07200 is an organic fiber reinforced phenolic molding compound, offering improved mechanical strength, good powder properties and excellent cosmetic properties. UL recognized under component .. |
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CTE, linear | 53.0 µm/m-°C | 29.4 µin/in-°F | ISO 11359-2 |
Unitika M1030DH PA6, Dry Nano composite nylonInformation provided by Unitika Ltd. |
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CTE, linear | 53.0 µm/m-°C @Temperature 20.0 °C |
29.4 µin/in-°F @Temperature 68.0 °F |
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Tra-Con Tra-Bond 716C01 Medium Viscosity Epoxy Adhesive TRA-BOND 716C01 is a medium viscosity epoxy resin system specifically developed for bonding and coating applications. This two-part amber adhesive is easily mixed, used and cured at room temperature.. |
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CTE, linear | 53.0 µm/m-°C @Temperature 20.0 °C |
29.4 µin/in-°F @Temperature 68.0 °F |
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Tra-Con Tra-Bond FDA12 Food and Drug Application Epoxy Adhesive TRA-BOND FDA12 is a medium viscosity epoxy resin system specifically developed for bonding and coating applications in accordance with Title 21, U.S. Code of Federal Regulations, Food and Drug Admin.. |
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CTE, linear | 53.0 µm/m-°C @Temperature 20.0 °C |
29.4 µin/in-°F @Temperature 68.0 °F |
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Tra-Con Tra-Bond FDA16 Food and Drug Application Epoxy Adhesive TRA-BOND FDA-16 EPOXY ADHESIVE is a medium viscosity epoxy resin system specifically developed for medical device applications. It has been tested in accordance with USP biological reactivity tests,.. |
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CTE, linear | 53.0 µm/m-°C @Temperature 20.0 °C |
29.4 µin/in-°F @Temperature 68.0 °F |
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Tra-Con Tra-Bond FDA2 Food and Drug Application Epoxy Adhesive TRA-BOND FDA-2 is a medium viscosity epoxy resin system specifically developed for medical device applications. It has been tested in accordance with USP biological reactivity tests, in vivo and rec.. |
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CTE, linear | 53.0 µm/m-°C @Temperature 20.0 °C |
29.4 µin/in-°F @Temperature 68.0 °F |
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Tra-Con Tra-Bond FDA2T Food and Drug Application Epoxy Adhesive TRA-BOND FDA-2T is a thixotropic epoxy resin system specifically developed for medical device applications. It has been tested in accordance with USP biological reactivity tests, in vivo and receive.. |
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CTE, linear | 53.0 µm/m-°C @Temperature 20.0 °C |
29.4 µin/in-°F @Temperature 68.0 °F |
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Tra-Con Tra-Bond FDA2YL02 Food and Drug Application Epoxy Adhesive TRA-BOND FDA-2 YL02 is a medium viscosity epoxy resin system specifically developed for adhesive and coating applications in accordance with Title 21, U.S. Code of Federal Regulations, Food and Drug.. |
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CTE, linear | 53.0 µm/m-°C @Temperature 20.0 °C |
29.4 µin/in-°F @Temperature 68.0 °F |
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Tra-Con Tra-Bond FDA8 Food and Drug Application Epoxy Adhesive TRA-BOND FDA-8 EPOXY ADHESIVE is a low viscosity epoxy resin system specifically developed for bonding and coating applications in accordance with Title 21, U.S. Code of Federal Regulations, Food an.. |
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CTE, linear | 53.0 µm/m-°C @Temperature 20.0 °C |
29.4 µin/in-°F @Temperature 68.0 °F |
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Tra-Con Tra-Bond FDA8T Food and Drug Application Thixotropic Flexible Epoxy Adhesive TRA-BOND FDA-8T EPOXY ADHESIVE is a thixotropic epoxy resin system specifically developed for bonding applications in accordance with Title 21, U.S. Code of Federal Regulations, Food and Drug Admini.. |
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CTE, linear | 53.0 µm/m-°C | 29.4 µin/in-°F | ISO 11359-2 |
Unitika M1030DH PA6, Conditioned Nano composite nylonInformation provided by Unitika Ltd. |
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CTE, linear | 53.0 µm/m-°C @Temperature 20.0 °C |
29.4 µin/in-°F @Temperature 68.0 °F |
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Tra-Con Tra-Bond FDA12WH01 Food and Drug Application Epoxy Adhesive TRA-BOND FDA12 WH01 is a medium viscosity epoxy resin system specifically developed for bonding and coating applications in accordance with Title 21, U.S. Code of Federal Regulations, Food and Drug .. |
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CTE, linear | 53.0 µm/m-°C | 29.4 µin/in-°F | Below Tg |
Epoxy Technology EPO-TEK® 360T High Temperature Epoxy Material Description: A two component, high-temperature grade, electrically and thermally insulating epoxy for semiconductor, electronics, fiber optics and medical applications. It is a thixotropic.. |
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CTE, linear | 53.0 µm/m-°C | 29.4 µin/in-°F | Below Tg |
Epoxy Technology EPO-TEK® EJ2189 Electrically Conductive Epoxy Product Description: EPO-TEK® EJ2189 is an electrically conductive, silver-filled epoxy paste. This two component system is designed for low temperature curing from ambient to 80°C, although othe.. |
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CTE, linear | 53.0 µm/m-°C | 29.4 µin/in-°F | Below Tg |
Epoxy Technology EPO-TEK® H20-HC Electrically Conductive Epoxy Product Description: EPO-TEK® H20E-HC is a two component, 100% solids silver-filled epoxy system designed specifically for chip bonding in microelectronic and optoelectronic applications. It is al.. |
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CTE, linear | 53.0 µm/m-°C @Temperature 20.0 °C |
29.4 µin/in-°F @Temperature 68.0 °F |
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Armstrong A-701 Epoxy Adhesive A one-component, light gray, thixotropic, non-sag epoxy adhesive. A-701 uses an inert oxide filler that provides excellent electrical insulation properties. Features high temperature, 400°F, bond.. |
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CTE, linear | 53.0 µm/m-°C @Temperature 20.0 °C |
29.4 µin/in-°F @Temperature 68.0 °F |
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Armstrong A-706 Epoxy Adhesive A one-component, gray, aluminum-filled, thixotropic, non-sag epoxy adhesive. A-706 has an in-service temperature range to 400°F, but requires 350°F minimum cure temperature. Features excellent m.. |
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CTE, linear | 53.0 µm/m-°C @Temperature -50.0 - 50.0 °C |
29.4 µin/in-°F @Temperature -58.0 - 122 °F |
Axial; ASTM E831 |
Chevron Phillips Ryton® PR09-60 Polyphenylene Sulfide Compound
(discontinued **) Polyphenylene Sulfide CompoundRyton® PR09-60 is pelletized unfilled high molecular weight polyphenylene sulfide resin suitable for extrusion or injection molding.Comments: Test specimen molding con.. |
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CTE, linear | 53.0 µm/m-°C @Temperature -50.0 - 50.0 °C |
29.4 µin/in-°F @Temperature -58.0 - 122 °F |
Axial; ASTM E831 |
Chevron Phillips Ryton® PR09-60 Polyphenylene Sulfide Compound, Annealed 2 hours at 200°C
(discontinued **)&l Polyphenylene Sulfide CompoundRyton® PR09-60 Annealed 2 hours at 200°C is pelletized unfilled high molecular weight polyphenylene sulfide resin suitable for extrusion or injection molding.Comments.. |
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CTE, linear | 53.0 µm/m-°C @Temperature 20.0 °C |
29.4 µin/in-°F @Temperature 68.0 °F |
DIN 53752 |
GEHR Plastics PPS Polyphenylene Sulfide The linear polyphenylensulfide belongs to the semi-crystalline materials and offers a very high mechanical capacity, thermal and chemical resistance distinguished at the same time, high dimensional .. |
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CTE, linear | 53.0 µm/m-°C @Temperature -30.0 - 100 °C |
29.4 µin/in-°F @Temperature -22.0 - 212 °F |
ASTM D696 |
LyondellBasell Hifax™ HSBMF248 Thermoplastic Polyolefin Elastomer Description: Hifax™ HSBMF248 high melt flow, 1,400 MPa flexural modulus, paintable, mineral-filled thermoplastic elastomeric olefin (TEO) resin has an excellent combination of flow, rigidity, low t.. |