- HOME
- POLYMER SEARCH
- Polymer Property : CTE, linear = 55.0 µm/m-°C
Polymer Property : CTE, linear = 55.0 µm/m-°C Product List
Thermal PropertiesTips: 30 items are displayed at most.
| Thermal Properties | Metric | English | Comments |
|---|---|---|---|
| CTE, linear |
55.0
µm/m-°C <br>@Temperature 23.0 - 100 °C
|
30.6
µin/in-°F <br>@Temperature 73.4 - 212 °F
|
|
|
Quadrant EPP Quadrant PPSU unfilled, extruded (ISO Data)
Quadrant PPSU is a black, amorphous high performance thermoplastic, offering better impact strength and chemical resistance than polysulfone and polyetherimide. Quadrant PPSU also has superior hydro..
|
|||
| CTE, linear |
55.0
µm/m-°C <br>@Temperature -30.0 - 80.0 °C
|
30.6
µin/in-°F <br>@Temperature -22.0 - 176 °F
|
ASTM E228 |
|
Solvay Engineered Polymers SEQUEL® 1783 Engineered Polyolefin
(discontinued **)
Description: SEQUEL® 1783 engineered polyolefin is designed for large, mold-in-color automotive exterior applications that require dimensional stability over a broad temperature range. This materi..
|
|||
| CTE, linear |
55.0
µm/m-°C <br>@Temperature 20.0 °C
|
30.6
µin/in-°F <br>@Temperature 68.0 °F
|
|
|
Humiseal 1B73 Acrylic Conformal Coating
Humiseal 1B73 Acrylic Conformal CoatingHigh moisture resistanceExcellent dielectrical propertiesSelective chemical resistanceExcellent repairabilityUL ApprovedMIL-I-46058C ApprovedPasses thermal sho..
|
|||
| CTE, linear |
55.0
µm/m-°C <br>@Temperature 20.0 °C
|
30.6
µin/in-°F <br>@Temperature 68.0 °F
|
Vertical Direction; ASTM D696 |
|
Mitsui Arlenâ„¢ A315 15% Glass Fiber-Reinforced Modified Nylon 6T (COND)
ARLEN™ is a heat resistant, modified polyamide 6T developed by Mitsui Chemicals, Inc. With a high melting point (320°C) and a rigidity level comparable to super engineering plastics, it poss..
|
|||
| CTE, linear |
55.0
µm/m-°C <br>@Temperature 20.0 °C
|
30.6
µin/in-°F <br>@Temperature 68.0 °F
|
Vertical Direction; ASTM D696 |
|
Mitsui Arlenâ„¢ C215 15% Glass Fiber-Reinforced Modified Nylon 6T (COND)
ARLEN™ is a heat resistant, modified polyamide 6T developed by Mitsui Chemicals, Inc. With a high melting point (320°C) and a rigidity level comparable to super engineering plastics, it poss..
|
|||
| CTE, linear |
55.0
µm/m-°C <br>@Temperature -30.0 - 100 °C
|
30.6
µin/in-°F <br>@Temperature -22.0 - 212 °F
|
ASTM D696 |
|
LyondellBasell Hifaxâ„¢ HSBMR246 Thermoplastic Polyolefin Elastomer
Description: Hifaxâ„¢ HSBMR246 medium high melt flow, 1,500 MPa flexural modulus, paintable, mineral-filled thermoplastic elastomeric olefin (TEO) resin has an outstanding balance of physical pro..
|
|||
| CTE, linear | 55.0 µm/m-°C | 30.6 µin/in-°F | DIN 53752 |
|
Lehmann & Voss LUVOCOM® 1100-7337/WT Polyether sulfone, unreinforced
Applications: Apparatus- and precision engineering, film- and photo industry, sporting- and leisure goods, medical- and electrical enineering, aircraft- and aerospace industry.High dimensionally sta..
|
|||
| CTE, linear |
55.0
µm/m-°C <br>@Temperature 20.0 °C
|
30.6
µin/in-°F <br>@Temperature 68.0 °F
|
ASTM D696 |
|
Stratasys® Polyphenylsulfone
PPSF/PPSU (polyphenylsulfone) material has the greatest strength, heat and chemical resistance of all Stratasys materials - ideal for aerospace, automotive and medical applications. Stratasys FDM (F..
|
|||
| CTE, linear | 55.0 µm/m-°C | 30.6 µin/in-°F | Below Tg |
|
Tra-Con Tra-Bond 77-1S One Component SMD Adhesive
TRA-BOND 77-1S one component, solvent-free, insulating epoxy adhesive is designed specifically for attaching surface mounted devices (SMDs) to printed circuit boards prior to wave solder. TRA-BOND 7..
|
|||
| CTE, linear |
55.0
µm/m-°C <br>@Temperature 20.0 °C
|
30.6
µin/in-°F <br>@Temperature 68.0 °F
|
|
|
Tra-Con Tra-Bond CA20 Coil-Fix Epoxy Adhesive
TRA-BOND CA-20 is a thixotropic epoxy adhesive system specially formulated for shorted turns, damaged end wire extensions, or other coil repair applications where a high-fill, non-sag adhesive is re..
|
|||
| CTE, linear |
55.0
µm/m-°C <br>@Temperature 20.0 °C
|
30.6
µin/in-°F <br>@Temperature 68.0 °F
|
|
|
Tra-Con Tra-Bond FDA15 Food and Drug Application Epoxy Adhesive
TRA-BOND FDA-15 is a low viscosity epoxy resin system specifically developed for bonding and coating applications in accordance with Title 21, U.S. Code of Federal Regulations, Food and Drug Adminis..
|
|||
| CTE, linear | 55.0 - 65.0 µm/m-°C | 30.6 - 36.1 µin/in-°F | |
|
Master Bond UV15DC80 One Component, UV and Heat Curable Epoxy System
Master Bond UV15DC80 is a special dual cure epoxy based system which offers a primary cure utilizing UV light along with a secondary heat curing mechanism. This system addresses the problem of curin..
|
|||
| CTE, linear |
55.0
µm/m-°C <br>@Temperature 20.0 °C
|
30.6
µin/in-°F <br>@Temperature 68.0 °F
|
|
|
Tra-Con Tra-Bond 2104 Rigid Epoxy Staking Compound
TRA-BOND 2104 is a thixotropic epoxy system recommended for critical electronic, aerospace and industrial bonding, laminating and reinforcing applications requiring an adhesive with high-fill, non-s..
|
|||
| CTE, linear |
55.0
µm/m-°C <br>@Temperature 20.0 °C
|
30.6
µin/in-°F <br>@Temperature 68.0 °F
|
|
|
Tra-Con Tra-Bond 2105 Clear Rigid, Medium Viscosity Epoxy Adhesive
TRA-BOND 2105 is a clear, medium viscosity epoxy adhesive which contains no solvents or other additives which can be harmful to the environment or to its users. It has excellent adhesion to glass, c..
|
|||
| CTE, linear |
55.0
µm/m-°C <br>@Temperature 20.0 °C
|
30.6
µin/in-°F <br>@Temperature 68.0 °F
|
|
|
Tra-Con Tra-Bond 2110 High Impact Epoxy Staking Compound
TRA-BOND 2110 is a thixotropic epoxy resin and hardener formulation developed for industrial adhesive, staking, laminating, repair and manufacturing applications where long pot-life, good wetting, n..
|
|||
| CTE, linear |
55.0
µm/m-°C <br>@Temperature 23.0 - 260 °C
|
30.6
µin/in-°F <br>@Temperature 73.4 - 500 °F
|
ASTM D696 |
|
Daelim H&L Plavis-N CM Unfilled Aromatic Polyimide Bearing
Compression Molded. Plavis-N: Best physical properties, maximum electrical and thermal insulation, low out-gassing, superior radiation resistance.General Plavis information for all grades:PLAVIS po..
|
|||
| CTE, linear | 55.0 µm/m-°C | 30.6 µin/in-°F | Below Tg |
|
Epoxy Technology EPO-TEK® OG142-112 UV Cure Optical Epoxy
Material Description: Single component, medium viscosity, UV curable epoxy for adhesive sealing and encapsulating fiber optic and optoelectronic packaging application. Replacement version of EPO-TE..
|
|||
| CTE, linear | 55.0 µm/m-°C | 30.6 µin/in-°F | Below Tg |
|
Epoxy Technology EPO-TEK® U300-2 Two Component Epoxy
Material Description: A two component epoxy designed for capillary underfill of semiconductor chips and SMDs. Long potlife, high Tg, and optical clarity are a few of its traits. NASA approved lo..
|
|||
| CTE, linear | 55.0 µm/m-°C | 30.6 µin/in-°F | |
|
Hippe PI
Wide temperature range for use. High oxidation resistance. UV stability, low coefficient of linear expansion, good strength at high temperatures, resistance against stress cracking.Information pro..
|
|||
| CTE, linear |
55.0
-
65.0
µm/m-°C <br>@Temperature 20.0 °C
|
30.6
-
36.1
µin/in-°F <br>@Temperature 68.0 °F
|
|
|
Abatron AboCast/AboCure 8109-6
High heat resistance. Easy to use.Processing: 100/90 pbw; Potlife: 15-20 days/20°C (68°F), 7-10 h/120°C (250°F); mix at RT; cures in: 3 h/100°C (212°F) + 3 h/190°C (375°F) postcure.Applicat..
|
|||
| CTE, linear |
55.0
µm/m-°C <br>@Temperature 20.0 °C
|
30.6
µin/in-°F <br>@Temperature 68.0 °F
|
|
|
Armstrong A-2/A Epoxy Adhesive
This off-white paste epoxy is a versatile adhesive systems. The choice of one of four recommended Activators (A, E, W or H-20) makes A-2 Adhesive an ideal choice for many applications. A-2 with Ac..
|
|||
| CTE, linear |
55.0
µm/m-°C <br>@Temperature -30.0 - 30.0 °C
|
30.6
µin/in-°F <br>@Temperature -22.0 - 86.0 °F
|
ASTM D696 |
|
Beijing Chemical Industry KAIFA® 301-G10F PBT Resin
10% glass fiber reinforced, flame retardant, good flow, low bleedingInformation provided by Beijing Chemical Industry Research Institute (Group)
|
|||
| CTE, linear | 55.0 µm/m-°C | 30.6 µin/in-°F | |
|
Atom Adhesives AA-BOND 2112 Epoxy Adhesive
AA-BOND 2112 is a thixotropic epoxy system recommended for critical electronics, aerospace and industrial bonding, laminating and reinforcing applications requiring an adhesive with high-fill, non-s..
|
|||
| CTE, linear | 55.0 µm/m-°C | 30.6 µin/in-°F | ASTM D696 |
|
Gromax CCP PBT 3010-104 10% Glass Fiber Filled
Product Description: PBT glass fiber 10% reinforced injection molding grade.Characteristics:Excellent electrical property Excellent temperature resistance, high heat distortion temperature Excellent..
|
|||
| CTE, linear | 55.0 µm/m-°C | 30.6 µin/in-°F | ASTM D696 |
|
Gromax CCP PBT 4815-NCB 15% Glass Fiber Filled
Product Description: A glass fiber 15% reinforced injection molding grade. Characteristics:Excellent electrical property Excellent temperature resistance, high heat distortion temperature Excellent ..
|
|||
| CTE, linear |
55.0
µm/m-°C <br>@Temperature 20.0 °C
|
30.6
µin/in-°F <br>@Temperature 68.0 °F
|
ISO 11359 |
|
CENTROPLAST CENTRO HPM Polyphenylensulfone
This plastic has very good mechanical, electrical and thermal properties. It has very good hydrolysis resistance, and is suitable for medical, and pharmaceutical equipment construction.Information ..
|
|||
| CTE, linear | 55.0 µm/m-°C | 30.6 µin/in-°F | ASTM E831 |
|
Addiplast Addinyl PMD 20170 Nylon 66
GalvanizingInformation provided by Addiplast.
|
|||
| CTE, linear | 55.0 µm/m-°C | 30.6 µin/in-°F | ASTM D696 |
|
Proto3000 PPSF Fused Deposition Modeling Polymer
Description: PPSF/PPSU (polyphenylsulfone) material has the greatest heat and chemical resistance of all Fortus materials - ideal for aerospace, automotive and medical applications. PPSF parts manuf..
|
|||
| CTE, linear | 55.0 µm/m-°C | 30.6 µin/in-°F | |
|
Resinlab® EP1056LC Urethane Modified Epoxy Adhesive
Resinlab™ EP1056LC is a two part urethane modified epoxy adhesive designed to give good adhesion to metals and hard to bond surfaces such as PVC. It is thixotropic to provide good gap filling abili..
|
|||
Copyright © lookpolymers.com All Rights Reserved